• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.2
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• pp.132-139
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• 2000

This paper reports a novel micromachining process based on UV-LIGA process and (110) silicon anisotropic etching for fabrication of a high-aspect-ratio comb actuator. The comb electrodes are fabricated by (110) SILICON comb structure considering the etch-rate-ratio between (110) and (111) planes and lateral etch rate of a beam-type structure. The fabricated structure was$ 400\mum \; thick\; and\; 18\mum$ wide comb electrodes separated by $7\mim$ so that the height-gap ratio was about 57. Also considering resonant frequency of the comb actuator and the frequency-matching between sensing and driving mode for gyroscope application, we designed the number, width, height and length of the spring structures. Electroplated gold springs on both sides of the seismic mass were $15\mum\; wide,\; 14\mum\; thick\; and \; 500\mum$ long. The fabricated comb actuator had resonant frequency ay 1430Hz, which was calculated to be 1441Hz. The proposed fabrication process can be applicable to the fabrication of a high-aspect-ratio comb actuator for a large displacement actuator and precision sensors. Moreover, this combined process enables to fabricate a more complex structure which cannot be fabricate only by surface or bulk micromachining.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.8
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• pp.598-604
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• 1999

This paper describes the research to minimize the film stress and maximize the aspect ratio of photoresist structure, especially about SU-8 for electroplating mold. UV LIGA process using SU-8 allows fabricating high aspect ratio polymer structures. However, it is hard to get fine patterns in the high aspect ratio structures because of high internal stress and difficulty of removing SU-8. The purpose of this paper is to setup the process condition for the obtainment of both low film stress and high aspect ratio and to find design rules that make the pattern be less dependent on stress problem. Firstly, the process of heat treatment and exposure of SU-8 are proposed. These two conditions control the amount of cross-linkage in polymer structure, which is the most important parameter of both pattern generation and remaining stress. Heat treatment is dealed with soft bake and post-exposure-bake. Temperature and time duration of each step are varied with heat treatment condition. Some test patterns are fabricated to evaluate the proposed process. Nickel electroplating is performed with the mold fabricated through the proposed process to confirm the SU-8 as a good electroplating mold.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.164-173
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• 2006

The cooling capacity of a micro-heat pipe is mainly governed by the magnitude of capillary pressure induced in the wick structure. For microchannel wicks, a higher capillary pressure is achievable for narrower and deeper channels. In this study, a metallic micro-heat pipe adopting high-aspect-ratio microchannel wicks is fabricated. Micromachining of high-aspect-ratio microchannels is done using the laser-induced wet etching technique in which a focused laser beam irradiates the workpiece placed in a liquid etchant along a desired channel pattern. Because of the direct writing characteristic of the laser-induced wet etching method, no mask is necessary and the fabrication procedure is relatively simple. Deep microchannels of an aspect ratio close to 10 can be readily fabricated with little heat damage of the workpiece. The laser-induced wet etching process for the fabrication of high-aspect-ratio microchannels in 0.5mm thick stainless steel foil is presented in detail. The shape and size variations of microchannels with respect to the process variables, such as laser power, scanning speed, number of scans, and etchant concentration are closely examined. Also, the fabrication of a flat micro-heat pipe based on the high-aspect-ratio microchannels is demonstrated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.1050-1053
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• 2002

This paper presents metal structure that is fabricated using UV-LIGA process with PMER N-CA3000. In order to fabricate metal structure with high aspect ratio, the systematic optimization method was adopted and then the structure of $36{\mu}m$ thick mold with aspect ratio 7:1 (trench) and $32{\mu}m$ thick nickel structure was obtained. This structure is applied to the fabrication of optical switch.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.85-88
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• 1995

Recently, the micro mold maching techining technology is developed by means of the mechanical and high energy beam process. It is possible to make the micro structure mold with high aspect ratio by the LIGA technology. This mode is used for mass production of plastic parts by the micro injection molding method. In this study, we intend to research on the basic technology of micro injection molding. As the result, we developed the injection molding technology for small column plastic parts which diameter is 500 .mu. m and 200 .mu. m respectively with wbout aspect ratio 20.

• Proceedings of the KSME Conference
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• 2001.06e
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• pp.169-174
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• 2001

This paper reports on the development of high aspect ratio structure and 3-D integrated process for MEMS-based micro gas turbines. To manufacture high aspect ratio structures, Deep Reactive Ion Etching (DRIE) process have been developed and optimized. Specially, in this study, structures with aspect ratios greater than 10 were fabricated. Also, wafer direct bonding and Infra-Red (IR) camera bonding inspection systems have been developed. Moreover, using glass/silicon wafer direct bonding, we optimized the 3-D integrated process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.1061-1064
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• 1997

Micro injection molding technology is very important fiw mass product of micro structures or micro parts. And, it is so difficult that the molding technology of micro pole or thin wall(barrier rib) structures with high aspect ratio. In this stud). \vc intend to research on the basic technology of micro wall structure part:< with high aspect ratio by the inject~on moldins method. The mold for esperimenrs with micro multi-square structures was made by L, I(;A process. One square polc's size is 157 157pm. height 50011111. And the distance of each poles is 5011n1. 7'hus. molding products will be for~nctl like as the net structure with thin wall of about 50pn thickness.(aspect ratio 10) Ihrough the e~lxriment. \be obtained the prociuctr of micro multi-square slructure with bout 37.000 cell per a piece. 'Ihe micro injection molding process technolog for thin wall by multi-square structure mold was analy~cd.

• Journal of Power System Engineering
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• v.19 no.4
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• pp.36-42
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• 2015

TMixed convective flow in a bottom heated and top cooled rectangular channel can be significantly affected by the channel aspect ratio, Prandtl number, Reynolds number, Rayleigh number and angle of inclination. In such a mixed convection, the flow pattern plays an important role in various technological processes. In this study, a numerical investigation is carried out to explore mixed convection in a three-dimensional rectangular channel with bottom heated and top cooled uniformly. The three-dimensional governing equations are discretized using the finite volume method. In the range of low Reynolds number($0{\leq}Re{\leq}9.6{\times}10^{-2}$), the effects of the aspect ratio($2{\leq}AR{\leq}12$) and Gr/Re are presented and discussed. The longitudinal roll number in the channel is increased with increasing aspect ratio, and the roll number induced, regardless of the aspect ratio number, is even in the range of aspect ratios between 2 and 12, New vortex flow structure containing inclined longitudinal rolls is found, which is affected by aspect ratio and Reynolds number. The ratio Gr/Re is used to check the relative magnitudes of forced and natural convection in the mixed convective flow of high viscous fluid.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03b
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• pp.45-45
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• 2010

Nanoporous anodic alumina membranes (NAAM) with high aspect ratio, self-ordered pore array were fabricated by high-field 2-step anodization method. High voltages of 80, 100, 120 and 140 V as well as 40 V for comparison were applied to an aluminum anode with respect to a Pt cathode immersed both in 0.3M oxalic acid solution in order to investigate the self-ordering characteristics of the nanoporous structure. The pore structures, including interpore distance, pore size, pore density, and porosity as well as the ordering characteristic were analyzed using field-enhanced scanning electron microscopy (FE-SEM) and the corresponding Fourier-transformed images. The nanoporous structure could be produced for all the voltage conditions, but the well-ordered through-hole pore without a branched structure seemed to occur only at 40 and 140 V. It turned out that the growth rate under 140 V high-field anodization was about 40 times higher than under conventional 40 V mild anodization, which enabled the fast fabrication of self-ordered, high aspect ratio NAAMs.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.302-305
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• 2007

In recent years, many researches on new storage media with high capacity and information are developing. For manufacture of optical storage with high capacity, the injection molding process is generally used. In order to increase the filling ratio of the injection molding structure, the injection molding process required for high injection pressure, packing pressure and temperature control of the mold. However, conventional injection molding process is difficult to increase the filling ratio using injection master with the range of several nanometers and high aspect ratio. In order to improve and increase filling ratio of nano-structure with high aspect ratio, the active temperature control of injection mold was used. Experimental conditions were used injection pressure, time and temperature. Consequently, by using the peltier device into injection mold, we carried out the efficient and active temperature control of mold at low cost.