• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.629-632
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• 1998

This paper presents a new and simple technique to realize high Q inductor on low resistivity silicon wafer with 6 $\Omega$.cm. This technique is very compatible with bipolar and CMOS standard silicon process. By forming the deep and narrow trenches on the low resistivity wafer substrate under inductor pattern, oxidizing and filling with undoped polysilicon, the low resistivity silicon wafer acts as high resistivity wafer being suitable for the fabrication of high Q inductor. By using this technique the quality factor (Q) for 8-turn spiral inductor was improved up to max. 10.3 at 2 ㎓ with 3.0 $\mu\textrm{m}$ of metal thickness. The experiment results show that Q on low resistivity silicon wafer with the trench technique have been improved more than 2 times compared to the conventional low resistivity silicon wafer without trenches.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.12
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• pp.1049-1055
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• 2007

Lots of integration work has been done in order to miniaturize the devices for communication. To do this work, one of key work is to get miniaturized inductor with high Q factor for RF circuitry. However, it is not easy to get high Q inductor with silicon based substrate in the range of GHz. Although silicon is well known for its good electrical and mechanical characteristics, silicon has many losses due to small resistivity and high permittivity in the range of high frequency. MEMS technology is a key technology to fabricate miniaturized devices and LTCC is one of good substrate materials in the range of high frequency due to its characteristics of high resistivity and low permittivity. Therefore, we proposed and studied to fabricate and analyze the inductor on the LTCC substrate with MEMS fabrication technology as the one of solutions to overcome this problem. We succeeded in fabricating and characterizing the high Q inductor on the LTCC substrate and then compared and analyzed the results of this inductor with that on a silicon and a glass substrate. The inductor on the LTCC substrate has larger Q factor value and inductance value than that on a silicon and a glass substrate. The values of Q factor with the LTCC substrate are 12 at 3 GHz, 33 at 6 GHz, 51 at 7 GHz and the values of inductance is 1.8, 1.5, 0.6 nH in the range of 5 GHz on the silicon, glass, and LTCC substrate, respectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.3
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• pp.311-320
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• 2008

In this paper, a new variable active inductor using a conventional grounded active inductor with feedback variable LC-resonator is proposed. The grounded active inductor is realized by the gyrator-C topology and the variable LC-resonator is realized by the low-Q spiral inductor and varactor. This variable LC-resonator can compensate the degradation of Q-factor due to parasitic capacitance of a transistor, and the frequency range with high Q-factor is adjustable by resonance frequency adjustment of LC-resonator. The fabricated variable active inductor with Magnachip $0.18{\mu}m$ CMOS process shows that high-Q frequency range can be adjusted according to varactor control voltage from 4.66 GHz to 5.45 GHz and Q-factor is higher than 50 in the operating frequency ranges. The measured inductance at 4.9GHz can be controlled from 4.12 nH to 5.97 nH by control voltage.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.12
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• pp.559-565
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• 2002

Today, because a quality factor of the inductor fabricated on silicon substrate for RFIC is under 12, the realization of inductor haying high-Q is essential. In this paper, two inductors having improved Q-factor are proposed and fabricated using a bondwire on silicon substrate. Also for the PGS is applied to the same inductors, four inductors are fabricated finally The bondwire Inductors have the relatively low conductor loss due to wide cross-section area and they can reduce the parastic capacitance very much because they are located in the air. Simulation and measurement results show that the proposed inductors have much more improved Q-factor, 15, than a conventional spiral inductor at 1.5 GHz. Because of the use of an automatic bonding machine, we can fabricate the high - Q inductors very easily, repeatedly.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2001.11a
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• pp.218-221
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• 2001

In this paper, High Q Inductor using negative resistance circuit and the ceramic inductor was designed and fabricated at 2GHz. It was Improved the inductor of Q=90 using a inductor with Q=30 added to negative resistance circuit at 2GHz. As a result, at the bias condition of 3V and 16mA, the output power and phase noise in the operation frequency 2.01GHz are 5dBm and -115.34dBc/Hz at 100kHz offset from carrier, respectively. Phase noise was improved -10dBc/Hz at 100kHz offset compared to only using ceremic inductor.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.9
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• pp.28-35
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• 1997

A novel high-Q vertical jinductor for MMICs is proposed and characterized in a wide range of frequencies (DC~10 GHz) using the numerical methods such as the PeEC(partial equivalent element circuit), the FDM (finite difference method) and the MoM (method of moments). Electrical superiority of the vertical inductor to the horizontal is observed in terms of the magnetic flux linkage and the ground screening effect. The veritcal bondwire inductor is designed in consideration of the wire bonding feasibility and the optimum electrical peformance. This structure is also analyzed using the equivalent circuit and compared with the conventional spiral inductors From the calculated results, high Q-factor, inductance, and cut-off frequency are observed to be inherent characteristics of the veritcal bondwire inductor.

• Journal of Power Electronics
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• v.16 no.5
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• pp.1716-1724
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• 2016

This paper proposes both an active-switched quasi-Z-source inverter (AS-qZSI) and an extended active-switched qZSI (EAS-qZSI), which are based on the classic qZSI. The proposed AS-qZSI adds only one active switch and one diode to the classic qZSI for increasing the voltage boost capability. Compared with other topologies based on the switched-inductor/capacitor qZSI, the proposed AS-qZSI requires fewer passive components in the impedance network under the same boost capability. Additionally, the proposed EAS-qZSI is designed by adding one inductor and three diodes to the AS-qZSI, which offers enhanced boost capability and lower voltage stress across the switches. The performances of the two proposed topologies are verified by simulation and experimental results obtained from a prototype with a 32-bit DSP built in a laboratory.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.2
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• pp.125-129
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• 2008

A low-voltage active CMOS inductor approach, which can improve the quality-factor(Q), is proposed in this paper. A low-voltage active inductor circuit topology with a feedback resistance is proposed, which can substantially improve its equivalent inductance and quality-factor(Q). This proposed low-voltage active inductor with a feedback resistance was simulated by ADS(Agilent) using 0.18um standard CMOS technology. Simulation showed that the designed active inductor had a maximum quality-factor(Q) of 3000 with a 1.5nH inductance at 4GHz

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.294-298
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• 2003

In this paper, the modeling and design of high-Q multilayer passives have been investigated, and multilayer diplexer for GSM/DCS applications has been designed and fabricated using the passives. To minimize the system, the configuration of a multilayer inductor has involved a square spiral structure. Modeling of a multilayer inductor was performed by the subsystems of distributed components, and using the modeling the optimal structures of the high-Q multilayer inductor could be designed by analyzing parasitics and couplings which affect their frequency characteristics. Multilayer diplexer for GSM/DCS application has been designed and fabricated using LTCC technology. LPF for GSM band had the passband insertion loss of less than 0.55 dB, the return loss of more than 12 dB, and the isolation level of more than 26 dB by locating attenuation pole at 1800 MHz. HPF for DCS band had the passband insertion loss of less than 0.82 dB, the return loss of more than 11 dB, and the isolation level of more than 38 dB by locating attenuation pole at 930 MHz.

• Journal of the Korean Ceramic Society
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• v.40 no.4
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• pp.375-379
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• 2003

In this paper, a novel design of multilayer ceramic-based Transmit/Receive (T/R) switch using Low Temperature Co-fired Ceramic (LTCC) technology have been presented. Compact T/R switch has been designed by transforming quarter-wave transmission line to its lumped equivalent circuit. Especially, high-Q three dimensional inductors with double strip have been proposed and incorporated. The proposed inductor has been modeled by multi-conductor coupled lines. A measured inductor quality factor (Q) of 80 and a Self-Resonance Frequency (SRF) of 6.6 GHz have been demonstrated. The inductor library has been incorporated into the design of WCDMA T/R switch.