• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.129-133
• /
• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.11a
• /
• pp.26-27
• /
• 2006

The fundamental mechanical characteristics under tensile and bending deformations of hermetically-sealed reinforced Bi-2223 tape and CTOP processed Bi-2223 tape were examined at 77K. Also, the Tensile strain dependence of the critical current, $I_c$, was obtained at 77K and self-field. The reinforced hermetic tape showed higher tensile strength and a better Tensile strain tolerance than the CTOP processed tape. For bending tests, a rho-shaped sample holder was used giving multiple bending strains. in increasing order. In the same case under bending deformation, the hermetic tape showed a higher bending strain tolerance than the CTOP processed tape. This higher strength of the hermetic tape can be attributed to the thick hardened copper reinforcement layer.

• Proceedings of the SAREK Conference
• /
• 2007.11a
• /
• pp.404-409
• /
• 2007

For a hermetic reciprocating compressor, it has been known that the gas pulsation in the suction line affects the compressor performance, and suction muffler design has been focused on both of noise reduction and minimum pressure drop across the muffler. Some studies have been carried out on the mutual interaction between the gas pulsation and the cylinder pressure to investigate some supercharging effects, but their efforts were limited on rather simple geometries. In this paper, interaction of the gas pulsation in the compressor suction line with cylinder pressure via suction valve motion has been calculated; for the gas pulsation analysis, modeling of Helmholtz resonators in series was used, and for cylinder pressure calculation, energy equations was set up for the gas inside the cylinder. For demonstration of this calculation method, four different types of suction line configurations for a hermetic reciprocating compressor were compared in terms of compressor performance and gas pulsation level.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.11a
• /
• pp.195-198
• /
• 2002

현재의 광통신, 이동통신 및 디지털 시대에서는 보다 소형화되고, 대용량의 데이터 저장 및 다기능 소자에 대한 요구가 많아지고 있다. 이러한 전자 산업 환경에서 MEMS 소자는 여러 요구조건을 만족시킬 수 있는 특징을 갖추고 있으며 실제 소자의 제작에 있어서 MEMS 소자를 이용하여 여러 물리 및 화학 센서 및 Actuator 제작에 응용이 되어지고 있고 Optical switch, Gyroscope, 적외선 어레이 센서, 가속도 센서, 위치 센서 등 여러 분야에서 실용화가 진행되어지고 있다. MEMS 구조물의 packaging 방법에 있어서는 내부 MEMS 소자의 동작을 위한 외부 환경으로부터의 보호를 위하여 Hermetic sealing에 대한 요구를 만족시켜야 한다. 본 발표에서는 이와 같은 MEMS device의 진공 패키지를 구현함에 있어서 기판 내부에 수동소자를 실장할 수 있는 LTCC 기술을 이용하여 진공 패키징하는 방법에 대하여 소개한다. 본 기술을 이용하는 경우 기존의 Hermetic sealing 이외에 향후 적층 기판 내부에 수동소자를 내장시켜 배선 길이 및 노이즈 성분을 감소시켜 더욱 전기적 성능을 향상시킬 수 있는 장점이 있게된다. 본 논문에서는 LTCC 기판을 이용하여 패키징 시킨 후, 내부 진공도에 영향을 줄 수 있는 계면들에서의 시간에 따른 진공도 변화의 특성치를 측정하여 LTCC 기판의 Hermetic sealing 특성에 관하여 조사하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.1
• /
• pp.31-38
• /
• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2007.05a
• /
• pp.14.2-14.2
• /
• 2007

• Journal of the Microelectronics and Packaging Society
• /
• v.1 no.2
• /
• pp.135-142
• /
• 1994

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.04a
• /
• pp.115-134
• /
• 2003

• The monthly packaging world
• /
• s.201
• /
• pp.67-71
• /
• 2010

• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.11 no.8
• /
• pp.374-383
• /
• 2001

A reciprocating compressor unit with variable rotating speed driven by BLDC motor is mounted Inside hermetic chamber on an internal suspension composed of 4 roil springs and a discharge pipe. A method for predicting the dynamic behavior of compressor body is required for a reduction of transmitted vibrations. The mechanical characteristics of spring and discharge pipe stiffness properties have been obtained from experimental tests and mass moment of inertia of the compressor body iron CAD. To confirm the vibration model for the compressor body, free vibration analyses are performed with theoretical and experimental methods. results for analytical investigations on the dynamic behavior of the compressor body and the transmitted forces to the hermetic chamber through the suspension elements are Presented.