Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Hermetic Packaging For MEMS

  • Kang Seok Jin (Gyro Project Team Samsung Advanced Institute of Technology)
  • Published : 2003.04.01
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Abstract

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