• Journal of the Korean Society for Nondestructive Testing
• /
• v.13 no.3
• /
• pp.31-38
• /
• 1993

The storage ring vacuum system for the Pohang Light Source (PLS) has been designed to maintain the vacuum pressure of $10^{-10}Torr$ which requires UHV welding to have helium leak rate less than $1{\times}10^{-10}Torr{\cdot}{\ell}/sec$. In order to develop new technique (PLS) welding technique), a prototype vacuum chamber has been welded by using Tungsten Inert Gas welding method and all the welded joints have been tested with a non-destructive method, so called helium leak detection, to investigate the vacuum tightness of the weld joints. The test was performed with a detection limit of $1{\times}10^{-10}Torr{\cdot}{\ell}/sec$ for helium and no detectable leaks were found for all the welded joints. Thus the performance of welding technique is proven to meet the criteria of helium leak rate required in the PLS Storage Ring. Both the principle and the procedure for the helium leak detection are also discussed.

• The KSFM Journal of Fluid Machinery
• /
• v.19 no.4
• /
• pp.39-42
• /
• 2016

A PFA lined ball valve, which is machined with fluorinated resin PFA to its inner part for improving corrosion resistance, non-stickness, heat-resistance, has been widely used to the chemical/pharmaceutical industries, the semiconductor/LCD manufacturing processes, etc. with the high purity chemicals as working fluid. EPA stated that 60% of all fugitive emissions come from the valve stem packing in a typical petroleum or chemical processing plant. They monitor regulated components for leaks and maintain seal performance at acceptable levels. Korean industrial standards only deals with the bubble test for in-line leakage of valves, which has the detectable leak rate of $10^{-4}$ [$mbar{\cdot}L{\cdot}s^{-1}$], therefore, it is not sufficient to check fugitive emissions. In this study, we conducted Helium leak detection from a PFA lined ball valve and evaluated fugitive emissions according to ISO 15848-1, which has the detectable leak rate of $10^{-9}$ [$mbar{\cdot}L{\cdot}s^{-1}$], for manufacturing the high-reliable PFA lined ball valves against fugitive emissions.

• Proceedings of the KIEE Conference
• /
• 2008.07a
• /
• pp.1464-1465
• /
• 2008

In this paper, we compared the mechanical characteristics between LTCC-based RF MEMS packaging structures fabricated using two different types of bonding materials; BCB and gold-tin. The BCB-based packages showed an average shear strength of 32.1 MPa and helium leak rate of $1.76{\times}10^{-8}atm{\cdot}cc/sec$ for a cavity volume of $0.45\times10^{-3}cc$, while the packages bonded by gold-tin layer (80 wt.% gold, 20 wt.% tin) showed an average shear strength of 42.70 MPa and helium leak rate $1.38{\times}10^{-8}atm{\cdot}cc/sec$ for a cavity volume of $1.21{\times}10^{-3}cc$.

• Progress in Superconductivity and Cryogenics
• /
• v.2 no.1
• /
• pp.7-13
• /
• 2000

A rotating cryogenic system was designed similar to the cooling system for the rotor of a superconducting generator. The experimental rotor has an inner vessel which simulates the winding space of an actual superconducting rotor, and a torque tube of comparable design. This paper describes the evaluation of the total heat leak into the inner vessel that leads to the study of the heat transfer characteristic of the rotating cryogenic system. To examine the insulation performance of the experimental rotor. temperature was measured at each part of the system at various rotaing speeds from 0 rpm to 600 rpm. Total heat leak into the inner vessel was calculated by measuring the boil-off rate of liquid helium. Conduction heat leak to the inner vessel was obtained by the vent tube, and radiation heat leak was calculated by subtracting the conduction heat lent from the total heat leak. There seemed to be no rotaional dependency of total heat leak at least up 600 rpm.

• Journal of the Korean Vacuum Society
• /
• v.16 no.2
• /
• pp.153-159
• /
• 2007

In-cryostat helium lines are under installation to transfer a cryogenic helium into cold components in KSTAR device. In KSTAR, three kinds of helium should be supplied into the cold components, which are supercritical helium Into superconduction(SC) magnet system, liquid helium into current lead system, and gas helium into thermal shields. Cryogenic helium lines consist of transfer lines outside the cryostat, in-cryostat helium lines, and electrical breaks. In-cryostat helium lines should be guaranteed of leak tightness for tong time operation at high internal helium pressure of 20 bar. We wrapped the helium line with multi-layer insulator(MLI) to reduce radiation heat and insulated the surface of the high potential part with prepreg tape. The electrical break was fabricated by brazing ceramic tube with stainless steel tube. To ensure the operation reliability at operation temperature, all the electrical break have been examined by the thermal cycle test at liquid nitrogen and by the hydraulic test at 30 bar. And additional surface insulation was prepared with prepreg tape to give structural safety. At present most of the in-cryostat helium lines have been installed and the final inspection test is progressing.

• Journal of Radiation Protection and Research
• /
• v.28 no.4
• /
• pp.291-298
• /
• 2003

The KN-12 transport cask has been designed to transport 12 PWR spent nuclear fuel assemblies and to comply with the regulatory requirements for a Type B(U) package. The containment boundary of the cask is defined by a cask body, a cask lid, lid bolts with nuts, O-ring seals and a bolted closure lid. The containment vessel for the cask consists of a forged thick-walled carbon steel cylindrical body with an integrally-welded carbon steel bottom and is closed by a lid made of stainless steel, which is fastened to the cask body by lid bolts with nuts and sealed by double elastomer O-rings. In the cask lid an opening is closed by a plug with an O-ring seal and covered by the bolted closure lid sealed with an O-ring. The cask must maintain a radioactivity release rate of not more than the regulatory limit for normal transport conditions and for hypothetical accident conditions, as required by the related regulations. The containment requirements of the cask are satisfied by maintaining a maximum air reference leak rate of $2.7{\times}10^{-4}ref.cm^3s^{-1}$ or a helium leak rate of $3.3{\times}10^{-4}cm^3s^{-1}$ for normal transport conditions and for hypothetical accident conditions.

• Progress in Superconductivity and Cryogenics
• /
• v.8 no.1
• /
• pp.59-64
• /
• 2006

A closed-loop cryogenic cooling system for high field magnets is presented. This design is motivated by our recent development of cooling system for 21 tesla Fourier Transform ion Cyclotron Resonance (FT-ICR) superconducting magnets without any replenishment of cryogen. The low temperature superconducting magnets are immersed in a subcooled 1.8 K bath, which is connected hydraulically to the 4.2 K reservoir through a narrow channel. Saturated liquid helium is cooled by Joule-Thomson heat exchanger and flows through the JT valve, isenthalpically dropping its pressure to approximately 1 6 kPa, corresponding saturation temperature of 1.8 K. Helium gas exhausted from pump is now recondensed by two-stage cryocooler located after vapor purify system. The amount of cryogenic Heat loads and required mass flow rate through closed-loop are estimated by a relevant heat transfer analysis, from which dimensions of JT heat exchanger and He II heat exchanger are determined. The detailed design of cryocooler heat exchanger for helium recondensing is performed. The effect of cryogenic loads, especially superfluid heat leak through the gap of weight load relief valve, on the dimensions of cryogenic system is also investigated.

• Journal of the Semiconductor & Display Technology
• /
• v.3 no.3
• /
• pp.5-9
• /
• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.2
• /
• pp.29-36
• /
• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Journal of Sensor Science and Technology
• /
• v.15 no.1
• /
• pp.58-64
• /
• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.