• Title/Summary/Keyword: heating information

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The Production of High Functional Hot Mat with Sleeping Type (고기능성 침낭형 온수매트 제작)

  • Lee, Sang-Heon;Kang, Jung-Uk;Won, Woo-Yeon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.6
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    • pp.400-402
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    • 2015
  • The typical winter heating unit heating mat. The product is to be found in the development of new water heating mat today. The product that circulates the water through the hose inside the mat with your existing heating mat electric heated mat is different from boiling water. However, no clear standards for noise and safety, consumer choice is giving confusing information about the product is low. We were to develop a high heat retention and stability than conventional sleeping mats to produce creative than traditional hot mats, heated mats general comparison with experimental results is a more efficient heat retention mat is produced.

Analysis on Self-Heating Effect in 7 nm Node Bulk FinFET Device

  • Yoo, Sung-Won;Kim, Hyunsuk;Kang, Myounggon;Shin, Hyungcheol
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.2
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    • pp.204-209
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    • 2016
  • The analyses on self-heating effect in 7 nm node non-rectangular Bulk FinFET device were performed using 3D device simulation with consideration to contact via and pad. From self-heating effect simulation, the position where the maximum lattice temperature occurs in Bulk FinFET device was investigated. Through the comparison of thermal resistance at each node, main heat transfer path in Bulk FinFET device can be determined. Self-heating effect with device parameter and operation temperature was also analyzed and compared. In addition, the impact of interconnects which are connected between the device on self-heating effect was investigated.

Optical, Thermal property by Applied PCB Structure design (PCB 구조적 설계에 따른 LED Module의 열적 광학적 특성)

  • Lee, Seung-Min;Lee, Seong-Jin;Choi, Gi-Seung;Lee, Jong-Chan;Park, Dae-Hee
    • Proceedings of the KIEE Conference
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    • 2006.07a
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    • pp.609-610
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    • 2006
  • As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

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Optical, Thermal property by Applied PCB Structure design (PCB 구조적 설계에 따른 LED Module의 열적 광학적 특성)

  • Lee, Seung-Min;Lee, Seong-Jin;Choi, Gi-Seung;Lee, Jong-Chan;Park, Dae-Hee
    • Proceedings of the KIEE Conference
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    • 2006.07d
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    • pp.2241-2242
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    • 2006
  • As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

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Optical, Thermal property by Applied PCB Structure design (PCB 구조적 설계에 따른 LED Module의 열적 광학적 특성)

  • Lee, Seung-Min;Lee, Seong-Jin;Choi, Gi-Seung;Lee, Jong-Chan;Park, Dae-Hee
    • Proceedings of the KIEE Conference
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    • 2006.07b
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    • pp.1275-1276
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    • 2006
  • As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

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Nonequilibrium Heat Transfer Characteristics During Ultrafast Pulse Laser Heating of a Silicon Microstructure

  • Lee Seong Hyuk
    • Journal of Mechanical Science and Technology
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    • v.19 no.6
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    • pp.1378-1389
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    • 2005
  • This work provides the fundamental knowledge of energy transport characteristics during very short-pulse laser heating of semiconductors from a microscopic viewpoint. Based on the self-consistent hydrodynamic equations, in-situ interactions between carriers, optical phonons, and acoustic phonons are simulated to figure out energy transport mechanism during ultrafast pulse laser heating of a silicon substrate through the detailed information on the time and spatial evolutions of each temperature for carriers, longitudinal optical (LO) phonons, acoustic phonons. It is found that nonequilibrium between LO phonons and acoustic phonons should be considered for ultrafast pulse laser heating problem, two-peak structures become apparently present for the subpicosecond pulses because of the Auger heating. A substantial increase in carrier temperature is observed for lasers with a few picosecond pulse duration, whereas the temperature rise of acoustic and phonon temperatures is relatively small with decreasing laser pulse widths. A slight lagging behavior is observed due to the differences in relaxation times and heat capacities between two different phonons. Moreover, the laser fluence has a significant effect on the decaying rate of the Auger recombination.

Development of Formulas to Predict Deformations in Plate by Line Heating Method (선상가열법에 의한 강판의 변형 예측식 개발)

  • Lee, Joo-Sung;Lee, Joung-Ho
    • Journal of Ocean Engineering and Technology
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    • v.22 no.6
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    • pp.83-87
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    • 2008
  • Although a great deal of research has been carried out to solve the plate forming problem and to improve the effectiveness and productivity of the plate forming process, no practical way of automating the plate forming process has been proposed yet. Since characteristics of heating machines may vary, it is necessary to investigate the thermal deformation characteristics of the heating machine that will be used in the automation system its characteristics may be modified as new information about thermal deformation by heating becomes available. In this paper, experiments for line heating have been carried out to calculate the formula of predicting thermal deformation due to line heating with varying affecting parameters, and numerical study has been carried out to produce data beyond the range where a line heating test is impractical. Formulas of predicting transverse distortion and shrinkage have been proposed and derived, based on the present experimental and numerical works. This paper also illustrates how the formula has been modified as new experimental data are added.

Study on the Deformation Behavior by Spot Heating for thin plate (박판 점 곡직 시 변형 특성에 관한 연구)

  • Jang, Gyeong-Bok;Park, Jung-Gu;Jo, Si-Hun;Jang, Tae-Won
    • Proceedings of the KWS Conference
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    • 2005.06a
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    • pp.285-287
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    • 2005
  • During fabrication of deck house block in passenger ships, the problem of unexpected large deformation and distortion frequently occurs. In this case, line and spot heating method were widely used to correct the distortion of thin plate structure. Spot heating was especially used for the case under 5mm thickness. Few papers are available on the working conditions of spot heating method but only little information on deformation control. In this study, evaluation was carried out on the temperature distribution of spot heating methods using FEA and practical experiments for various heating time. IIn FEA, heat input model was established using Tsuji's double Gaussian heat input mode (Tsuji, I., 1988). This model was verified by comparing with experimental data. Also radial shrinkage and angular distortion due to spot heating were determined and compared with experimental results. Thermo elasto-plastic analysis was performed using commercial FE code, MSC/MARC. Radial shrinkage and angular distortion were measured using 3D measuring apparatus. Based on these results, simplified analysis model for deformation by spot heating was established.

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A Study on the Concave Type Hull Plate Forming using Induction Heating System (고주파 유도가열을 이용한 오목 곡면 곡가공에 관한 연구)

  • Hyun, Chung Min;Kim, Dae Kyung;Mun, Seung Hwan;Park, Jung Seo;Dohr, Kyu Won
    • Journal of the Society of Naval Architects of Korea
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    • v.56 no.2
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    • pp.128-134
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    • 2019
  • In shipbuilding, accurate fabrication of curved hull plates is one of the most important steps, since the shape of ship hull, which is very critical in the overall performance of a ship, is a collection of such plates. The curved hull plates forming process requires a significant amount of time by skilled workers in shipbuilding. In general, the workers cause thermal distortion in the plate and forming initial shape using gas heat source. So shipbuilding companies need skilled workers who have long experience. To solve the problem, a lot of researchers tried to develop automation system for curved hull plates. In this paper, we propose automatic heating system with gantry robot, high frequency induction heater to replace the gas heat source and automatic measurement system. We apply the system to forming concave type plate that is actually used in ship manufacturing. In addition, a system was developed to automatically generate heating information, such as the heating location and the heating speed, for actual heating process. Then the system was applied to the actual heating material. It is shown that the proposed triangle heating pattern makes desired concave shape successfully. The induction heating system showed that it can be used for automation system of curved hull plates forming process replacing gas heat source.

A Study on the ZVS-SEPP Type High Frequency Resonant Inverter with induction Heating Jar(I) (IH-Jar용 ZVS-SEPP 고주파 공진 인버터에 관한 연구(I))

  • Kim, Jong-Hae;Kim, Dong-Hee;No, Chae-Gyan;Bae, Young-Ho;Baek, Seung-Myun;Moon, Chang-Soo
    • The Transactions of the Korean Institute of Electrical Engineers B
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    • v.48 no.2
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    • pp.69-74
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    • 1999
  • This paper presents about a example of circuit design and characteristics of proposed circuit in the case of adopted the high frequency resonant Inverter of SEPP type using ZVS(Zero-Voltage-Switching) to the Induction heating load. The soft switching technology known as ZVS is used to reduce turn on and off loss at switching. Also, this paper realizes quantitative circuit analysis which has change the equivalent of Induction heating load to the electric circuit. According to the calculated characteristics value, a method of the circuit designs and operation characteristics of the Inverter is proposed. In addition, this paper proves the propriety of theoretical analysis through the experiment. The proposed inverter shows it can be practically used as power source system for induction heating Jar etc.

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