• Polymer(Korea)
• /
• v.39 no.1
• /
• pp.144-150
• /
• 2015

Gellan gum as a natural polysaccharide has good heat resistance, acid resistance and enzymes resistance. However, one of the drawbacks of gellan gum might be the lower mechanical strength. In this work, gellan gum scaffolds were mixed with poly(lactic-co-glycolic acid) (PLGA) microsphere in order to improve mechanical properties. The gellan gum scaffolds with various contents of PLGA microsphere were prepared for the regeneration of disc tissues. To evaluate the mechanical strength of hybrid structure of gellan gum and PLGA microsphere, compression strength of the fabricated scaffolds was measured. MTT analysis, SEM observation, histological evaluation and RT-PCR were performed to confirm the effect on the cell growth and extracellular matrix secretion. As a result, it showed the best cell proliferation and extracellular matrix secretion in gellan gum sponge containing 50% PLGA microspheres. In conclusion, this study confirmed that the hybrid structure of gellan gum and PLGA microspheres was found suitable in regeneration of the intervertebral disc.

• Journal of Powder Materials
• /
• v.18 no.1
• /
• pp.64-72
• /
• 2011

Nondestructive instrumented indentation test is the method to evaluate the mechanical properties by analyzing load - displacement curve when forming indentation on the surface of the specimen within hundreds of micro-indentation depth. Resistance spot welded samples are known to difficult to measure the local mechanical properties due to the combination of microstructural changes with heat input. Particularly, more difficulties arise to evaluate local mechanical properties of resistance spot welds because of having narrow HAZ, as well as dramatic changed in microstructure and hardness properties across the welds. In this study, evaluation of the local mechanical properties of resistance spot welds was carried out using the characterization of Instrumented Indentation testing. Resistance spot welding were performed for 590MPa DP (Dual Phase) steels and 780MPa TRIP (Transformation Induced Plasticity) steels following ISO 18278-2 condition. Mechanical properties of base metal using tensile test and Instrumented Indentation test showed similar results. Also it is possible to measure local mechanical properties of the center of fusion zone, edge of fusion zone, HAZ and base metal regions by using instrumented indentation test. Therefore, measurement of local mechanical properties using instrumented indentation test is efficient, reliable and relatively simple technique to evaluate the tensile strength, yield strength and hardening exponent.

• Korean Journal of Materials Research
• /
• v.22 no.10
• /
• pp.499-503
• /
• 2012

The present study is intended to comparatively investigate the changes in microstructure and tensile properties at room and elevated temperatures in commercial AM50(Mg-5%Al-0.3%Mn) and 0.3 wt%CaO added ECO-AM50 alloys produced by permanent mould casting. The typical microstructure of AM50 alloy was distinctively characterized using two intermetallic compounds, ${\beta}(Mg_{17}Al_{12})$ and $Al_8Mn_5$, along with ${\alpha}$-(Mg) matrix in an as-cast state. The addition of a small amount of CaO played a role in reducing dendrite cell size and quantity of the ${\beta}$ phase in the AM50 alloy. It is interesting to note that the added CaO introduced a small amount of $Al_2Ca$ adjacent to the ${\beta}$ compounds, and that inhomogeneous enrichment of elemental Ca was observed within the ${\beta}$ phase. The ECO-AM50 alloy showed higher hardness and better YS and UTS at room temperature than did the AM50 alloy, which characteristics can be mainly ascribed to the finer-grained microstructure that originated from the CaO addition. At $175^{\circ}C$, higher levels of YS and UTS and higher elongation were obtained for the ECO-AM50 alloy, demonstrating that even 0.3 wt%CaO addition can be beneficial in promoting the heat resistance of the AM50 alloy. The combinational contributions of enhanced thermal stability of the Ca-containing ${\beta}$ phase and the introduction of a stable $Al_2Ca$ phase with high melting point are thought to be responsible for the improvement of the high temperature tensile properties in the ECO-AM50 alloy.

• Molecules and Cells
• /
• v.24 no.3
• /
• pp.316-322
• /
• 2007

Glutaredoxins (Grxs), also known as thioltransferases (TTases), are thiol oxidoreductases that regulate cellular redox state in a variety of organisms. In the budding yeast Saccharomyces cerevisiae, Grx1 and 2 are cytosolic dithiol Grxs, while Grx3, 4 and 5 are monothiol Grxs. A gene encoding a new monothiol Grx, Grx6, was cloned from the genomic DNA of S. cerevisiae by PCR. Its DNA sequence contains 1,080 bp, and encodes a putative protein of 203 amino acid residues containing Cys-Phe-Tyr-Ser at the active site. Grx6 is similar to other monothiol Grxs in the same organism and to Grx3 in the fission yeast Schizosaccharomyces pombe. and its predicted three-dimensional structure resembles that of S. pombe Grx3. S. pombe cells harboring plasmid pFGRX6 containing the Grx6 gene had about 1.3-fold elevated Grx activity in the exponential phase, and grew better than the control cells under some stressful conditions. Synthesis of ${\beta}$-galactosidase from a Grx6-lacZ fusion gene in S. pombe was enhanced by potassium chloride, aluminum chloride and heat ($37^{\circ}C$) treatment. S. pombe cells harboring plasmid pFGRX6 had elevated ROS levels whereas S. pombe cells harboring extra copies of Grx3 had reduced ROS levels.

• Journal of the Korean earth science society
• /
• v.38 no.7
• /
• pp.469-480
• /
• 2017

Controversy has surrounded the potential impacts of phytoplankton on the tropical climate, since climate models produce diverse behaviors in terms of the equatorial mean state and El $Ni{\tilde{n}}o$-Southern Oscillation (ENSO) amplitude. We explored biophysical impacts on the tropical ocean temperature using an ocean general circulation model coupled to a biogeochemistry model in which chlorophyll can modify solar attenuation and in turn feed back to ocean physics. Compared with a control model run excluding biophysical processes, our model with biogeochemistry showed that subsurface chlorophyll concentrations led to an increase in sea surface temperature (particularly in the western Pacific) via horizontal accumulation of heat contents. In the central Pacific, however, a mild cold anomaly appeared, accompanying the strengthened westward currents. The magnitude and skewness of ENSO were also modulated by biophysical feedbacks resulting from the chlorophyll affecting El $Ni{\tilde{n}}o$ and La $Ni{\tilde{n}}a$ in an asymmetric way. That is, El $Ni{\tilde{n}}o$ conditions were intensified by the higher contribution of the second baroclinic mode to sea surface temperature anomalies, whereas La $Ni{\tilde{n}}a$ conditions were slightly weakened by the absorption of shortwave radiation by phytoplankton. In our model experiments, the intensification of El $Ni{\tilde{n}}o$ was more dominant than the dampening of La $Ni{\tilde{n}}a$, resulting in the amplification of ENSO and higher skewness.

• Journal of Welding and Joining
• /
• v.26 no.3
• /
• pp.30-36
• /
• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.11
• /
• pp.1256-1263
• /
• 2012

The present study covers the ultrasonic patterning process to replicate micro-patterns on a polymer substrate. The ultrasonic patterning process uses ultrasonic waves to generate frictional heat between an ultrasonic horn and the polymer substrate, from which the surface region of the polymer substrate is softened sufficiently for the replication of micro-patterns. The ultrasonic patterning process can divided into two categories according to the direction of vibration transmission: direct patterning and indirect patterning. The direct patterning uses a patterned horn, and the ultrasonic vibration is transferred directly from the patterned horn to the substrate. On the contrary, the indirect patterning process uses a plain horn, and the micro-patterns are engraved on a mold that is located below the substrate. Thus, the micro-patterns are replicated as an indirect manner. In this study, these direct and indirect patterning processes are compared in terms of the replication characteristics. Additionally, the possibility of double-side patterning is also discussed in comparison with the conventional single-side patterning process.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.35 no.12
• /
• pp.1627-1633
• /
• 2011

Injection molds are generally fabricated by assembling a number of plates in which the core and cavity components are assembled. This assembled structure has a number of contact interfaces where the heat transfer characteristics are affected by thermal contact resistance. In previous studies, numerical approaches were investigated to predict the effect of thermal contact resistance on the temperature distribution of injection molds. In this study, thermal-fluid coupled numerical analyses are performed to take into account the thermal contact effect on the numerical evaluation of the mold filling characteristics. Comparisons with experimental results show that the proposed coupled analysis provides more reliable results than the conventional analyses in predicting the mold filling characteristics by taking into account the effect of thermal contact resistance inside the injection mold assembly.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.2
• /
• pp.37-41
• /
• 2014

One of the important developments in next generation electronic devices is the technology for power delivery and heat dissipation. In this study, the Cu-to-Cu flip chip bonding process was evaluated using the square ABL power bumps and circular I/O bumps. The difference in bump height after Cu electroplating followed by CMP process was about $0.3{\sim}0.5{\mu}m$ and the bump height after Cu electroplating only was about $1.1{\sim}1.4{\mu}m$. Also, the height of ABL bumps was higher than I/O bumps. The degree of Cu bump planarization and Cu bump height uniformity within a die affected significantly on the misalignment and bonding quality of Cu-to-Cu flip chip bonding process. To utilize Cu-to-Cu flip chip bonding with ABL bumps, both bump planarization and within-die bump height control are required.

• Journal of the Korea Society of Computer and Information
• /
• v.25 no.7
• /
• pp.9-16
• /
• 2020

In this paper, we propose a prototype design and implementation of a fire detection algorithm using multiple sensors. The proposed topic detection system determines fire by applying rules based on data from multiple sensors. The fire takes about 3 to 5 minutes, which is the optimal time for fire detection. This means that timely identification of potential fires is important for fire management. However, current fire detection devices are very vulnerable to false alarms because they rely on a single sensor to detect smoke or heat. Recently, with the development of IoT technology, it is possible to integrate multiple sensors into a fire detector. In addition, the fire detector has been developed with a smart technology that can communicate with other objects and perform programmed tasks. The prototype was produced with a success rate of 90% and a false alarm rate of 10% based on 10 actual experiments.