Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Thermal-Fluid Coupled Analysis for Injection Molding Process by Considering Thermal Contact Resistance

사출금형의 열접촉 저항을 고려한 성형과정의 열-유동 연계해석

  • Sohn, Dong-Hwi (Graduate School of NID Fusion Technology, Seoul Nat'l Univ. Sci. Tech.) ;
  • Kim, Kyung-Min (Graduate School of NID Fusion Technology, Seoul Nat'l Univ. Sci. Tech.) ;
  • Park, Keun (School of Mechanical and Automation Engineering, Seoul Nat'l Univ. Sci. Tech.)
  • 손동휘 (서울과학기술대학교 NID 융합기술대학원) ;
  • 김경민 (서울과학기술대학교 NID 융합기술대학원) ;
  • 박근 (서울과학기술대학교 기계설계자동화공학부)
  • Received : 2011.06.21
  • Accepted : 2011.08.16
  • Published : 2011.12.01
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Abstract

Injection molds are generally fabricated by assembling a number of plates in which the core and cavity components are assembled. This assembled structure has a number of contact interfaces where the heat transfer characteristics are affected by thermal contact resistance. In previous studies, numerical approaches were investigated to predict the effect of thermal contact resistance on the temperature distribution of injection molds. In this study, thermal-fluid coupled numerical analyses are performed to take into account the thermal contact effect on the numerical evaluation of the mold filling characteristics. Comparisons with experimental results show that the proposed coupled analysis provides more reliable results than the conventional analyses in predicting the mold filling characteristics by taking into account the effect of thermal contact resistance inside the injection mold assembly.

사출금형은 일반적으로 다수개의 부품을 조립하여 제작되며, 특히 성형부(Core/Cavity)가 금형 형판 내부에 조립되는 구조를 갖는다. 이러한 구조로 인해 금형 조립부 경계면에서는 열접촉 저항이 발생하여 금형 내부의 열전달 특성에 영향을 미치게 된다. 최근 금형의 열접촉 저항이 성형부의 온도분포에 미치는 영향을 수치적으로 예측하기 위한 선행연구가 수행되었으며, 본 연구에서는 이에 기반하여 열-유동 연계해석을 적용함으로써 금형 내부의 열접촉 저항이 사출성형시 유동특성에 미치는 영향을 분석 하였다. 상기 해석결과와 실험결과와의 비교분석을 통해 금형의 열접촉 저항을 고려한 열-유동 연계해석이 기존의 해석방법과 비교할 때 사출성형 유동특성을 보다 향상된 신뢰성으로 예측할 수 있음을 확인하였다.

Keywords

References

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