• Journal of Advanced Marine Engineering and Technology
• /
• v.35 no.4
• /
• pp.475-482
• /
• 2011

This study, a basic study to improve aerodynamic characteristic of a wind blade, explored through CFD how much the lift to drag ratio improves according to the shape of groove formed on the surface of airfoil NACA0015. This study found out that the ratio improves by 8.7% when the ratio between boundary layer(${\delta}$) and the depth of groove(h), the ratio between the depth of groove(h) and the width of groove(d) and the ratio between the length(p) from one groove to the other and the width of groove are 1.1, 0.1 and 1.2 respectively. The number of grooves is two. It was also confirmed that the improvement of the lift to drag ratio is maintained after certain angle of attack.

• Tribology and Lubricants
• /
• v.20 no.2
• /
• pp.68-76
• /
• 2004

Applying a general Galerkin FE lubrication analysis method to spiral groove dry gas seals, this study intends to analyze in detail the effects of groove design parameters, such as a spiral angle, groove width ratio, groove radius ratio, groove depth ratio, and groove taper ratio, on the lubrication performances of an opening force, leakage, axial stiffness and damping, and angular stiffness and damping at low and high rotating speeds: 3,600 and 15,000 nm. Results show that, for the primary design consideration performances such as the opening force and axial and angular stiffnesses, a spiral angle of $25^{\circ}$, a groove width ratio of 0.46, a groove radius ratio of 1.1, a groove depth ratio of 1.0, and a groove taper ratio of 0.0 are preferred. Where the recommended relatively low values of groove depth and taper ratios are to keep the axial and angular dampings positive or higher than 0 particularly at the high rotating speed.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.7 no.3
• /
• pp.294-300
• /
• 1983

The purpose of this study is to investigate the radiant emission characteristics of diffuse equi-lateral trapezoid groove cavity for the case of uniform surface temperature. The theoretically developed results for the apparent emissivity are presented and the values of apparent emissivity for the trapezoid groove cavity were compared with those of the V-groove cavity. In the experimental part of this study, the test models were manufactured from 100x 100x 15mm copper plates on which the equi-lateral trapezoid cavities were grooved. The inclined angles of the groove were 30,45 and 60 degrees and the ratio of groove depth to base surface width varied from 1 to 5 for each inclined angle. As a result of this work, it was found that the trapezoid groove cavity was more general form of V-groove and the apparent emissivity of trapezoid groove cavity was greater than that of V-groove cavity. The resulting equation for the apparent emissivity in the trapezoid groove cavity was valid for the angles greater than 40 degrees.

• Tribology and Lubricants
• /
• v.32 no.4
• /
• pp.119-124
• /
• 2016

In the sapphire wafering process, lapping is a crucial operation in order to reduce the damaged layer and achieve the target thickness. Many parameters, such as pressure, velocity, abrasive, slurry and plate, affect lapping characteristics. This paper presents an experimental investigation on the effect of the plate groove on the material removal rate and roughness of the wafer. We select the spiral pattern and rectangular type as the groove shapes. We vary the groove density by controlling the groove shape dimension, i.e., the groove width and pitch. As the groove density increases to 0.4, the material removal rate increases and gradually reaches a saturation point. When the groove density is low, the pressing load is mostly supported by the thick film, and only a small amount acts on the abrasives resulting to a low material removal rate. The roughness decreases on increasing the groove density up to 0.3 because thick film makes partial participations of large abrasives which make deep scratches. From these results, we could conclude that the groove affects the contact condition between the wafer and plate. At the same groove density, the pitch has more influence on reducing the film thickness than the groove width. By decreasing the groove density with a smaller pitch and larger groove width, we could achieve a high material removal rate and low roughness. These results would be helpful in understanding the groove effects and determining the appropriate groove design.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07b
• /
• pp.1308-1311
• /
• 2004

It is very important that get polishing characteristic that to be stable that accomplish planarization of high efficiency in chemical mechanical polishing, and there is repeatability Groove of pad causes much effects in flow of slurry among various factors that influence in polishing characteristic, is expected to cause change of lubrication state and polishing characteristic in contact between wafer and pad. Therefore, divided factors of pad groove by groove pattern, groove profile, groove dimensions. This research wishes to study effect that dimension of pad groove gets in polishing performance. When changed dimension (width, depth, pitch of groove) of groove, measured change of removal rate and friction force. According as groove dimension changes, could confirm that removal rate and friction force change. While result of this experiment studies effect of pad groove in CMP, it is expected to become small help.

• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.8 s.173
• /
• pp.27-33
• /
• 2005

Polishing pads play an important role in chemical mechanical polishing(CMP) which has recently been recognized at the most effective method to achieve global planarization. In this paper, we have investigated CMP characteristics as a change of groove density of polishing pads. The parameter $(K_n)$ is proposed to estimate groove density of pad. The $K_n$ is defined as groove area divided by pitch area. As the groove density value increased, removal rate increased to some point and then gradually saturated in case of increasing the groove density excessively. In addition Within wafer non-uniformity(WIWNU) worse as groove density increased excessively, although WIWNU improved as groove density increased. Also the uniformity of temperature of pad surface decreased as the groove density increased. It was because that the cooling effect increased as groove density increased. In other words, increasing the groove density which means the apparent contact area of pad has influence on amount of discharge of slurry during polishing process.

• Journal of Welding and Joining
• /
• v.17 no.6
• /
• pp.53-61
• /
• 1999

The use of thick plate in increasing in recent years due to the rapid expansion of chemical plants, nuclear plants, ships and other industrial plants. Welding is the most popular joining techniques employed in manufacturing industrial machineries and structures. Normally, Groove shapes are prepared according to appropriate rules and regulations such as KS, JIS, AWS, LR, DNV and etc. for various thicknesses of plate. However those groove angles tend to be too large. As a result of large groove angle, residual stress, deformation of material and strength reduction is obtained. Therefore, the reliability and safety of structures and machinery tend to be decreasing. Therefore, in this paper, theoretical as well as experimental study are carried out to find optimum groove shapes for T-welded joint of mild steel. The test specimen are made in same condition with simulation model. Welding residual stresses measurement by sectional cutting method. ⅰ) The mechanical difference for change the thickness of plate and groove angle are not appeared. ⅱ) In a mechanical point of view minimum preparation angle(40°) is more suitable than maximum groove angle(60℃). ⅲ) The measurement value and distribution of welding residual stresses are not effected largely by groove angle. It is mechanical restraint that mainly affect welding residual stresses distribution. In mechanical point of view minimum groove angle is more suitable than maximum groove angle. Therefore, it is appropriate to minimize the size of groove shape in strength and safety.

• Proceedings of the KSME Conference
• /
• 2004.11a
• /
• pp.1522-1527
• /
• 2004

In this paper, slurry fluid motion, abrasive particle motion, and effects of groove sizing on the pads are numerically investigated in the 2D geometry. Groove depth is optimized in order to maximized the abrasive effect. The simulation results are analyzed in terms of shear stress on pad, groove and wafer, streamline and velocity vector. The change of groove depth entails vortex pattern change, and consequently affects material removal rate. Numerical analysis is very helpful for disclosing polishing mechanism and local physics.

• Proceedings of the KSME Conference
• /
• 2004.04a
• /
• pp.2123-2128
• /
• 2004

In this study, analysis is made for the effects of groove shape on the thermal performance of a axial groove heat pipe. The mathematical models of two-phase flow in grooved heat pipe are presented for the capillary limitation in steady state. Generally, the heat pipe performance depends on the capillary pressure and liquid flow. The friction force of liquid flow through the groove increases with the groove width decreased, and then the capillary pressure is improved in the gas-liquid interface of groove. Therefore, the optimal groove width shaper exists for the maximum thermal performance of heat pipe. In this paper, the optimal groove shape and scale are presented by considering both capillary pressure and liquid flow.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.29 no.3 s.234
• /
• pp.432-438
• /
• 2005

CMP characteristics such as material removal rate and edge effect were measured and investigated in accordance with pad grooving effect, groove width, depth and pitch. GSQ (Groove Stiffness Quotient) and GFQ (Groove Flow Quotient) were proposed to estimate pad grooving characteristics. GSQ is defined as groove depth(D) divided by pad thickness(T) and GFQ is defined as groove width(W) divided by groove pitch(P). As GFQ value increased, material removal rate increased some point but gradually saturated. It seems that material removal rate is not affected by each parameter respectively but by interaction of these parameters such as groove dimensions. In addition, an increase in GFQ and GSQ causes edge effect to be improved. Because, pad stiffness decreases as GSQ and GFQ increase. In conclusion, groove influences relative pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. The change of groove dimensions has influence on pad stiffness and slurry flow, so that polishing results such as removal rate and edge effect become changed.