• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1995년도 추계학술대회 논문집
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• pp.76-81
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• 1995

MgO single crystal is widely used as a the material of high temperature resistance, but is difficult to grind because of brittleness and crack generation. Therefore, superabrasive diamond wheel is required for mirror like grinding of this material. This study describes a newly proposed optimum in-process electrolytic dressing system for carrying out effective dressing of superbrasive diamond wheel. Using this system the grinding surface of MgO single crystal was improved, the grinding force was very l9ow and crack was removed. In conclusion, this system is good to obtain the efficient grinding and mirror-like grinding without crack of MgO single crystal.

• Design & Manufacturing
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• 제17권2호
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• pp.42-46
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• 2023

Currently, fossil resources are depleting rapidly. We are looking for energy to replace fossil fuels. They are trying to use electricity to replace internal combustion locomotives. Secondary battery raw materials and chemical additives are pulverized by the high-speed rotation of the grinding disc of the Classifier Separator Mill. Grinding Disc Assembly requires characteristics to withstand abrasion, corrosion, high-speed rotational force and impact. Domestic and foreign grinding discs were analyzed through abrasion resistance, hardness, bending strength, and tensile adhesion strength tests.

• 한국정밀공학회지
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• 제30권11호
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• pp.1121-1128
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• 2013

Ultrasonic grinding system is that the ultrasonic vibration by ultrasonic actuator is applied on conventional grinding system during grinding process. The Ultrasonic vibration with a frequency of over 20kHz can reduce grinding forces and increase surface quality, material removal rate (MRR) and grinding wheel life. In addition, ultrasonic vibration assisted grinding can be used for the materials that are difficult to cut. In this paper, methodology for ultrasonic tools is studied based on finite element method, and in turn the ultrasonic tools are designed and fabricated. It is found that the ultrasonic tool can vibrate with a frequency of 20kHz and amplitude of $25{\mu}m$. In order to verify the machining performance, the grinding experiment is performed on titanium alloy. By applying ultrasonic vibration, the grinding force and temperature are reduced and MRR is increased compared with the conventional grinding.

• 한국재료학회지
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• 제28권3호
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• pp.148-158
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• 2018

This study investigated the effect of the grinding media of a ball mill under various conditions on the raw material of copper powder during the milling process with a simulation of the discrete element method. Using the simulation of the three-dimensional motion of the grinding media in the stirred ball mill, we researched the grinding mechanism to calculate the force, kinetic energy, and medium velocity of the grinding media. The grinding behavior of the copper powder was investigated by scanning electron microscopy. We found that the particle size increased with an increasing rotation speed and milling time, and the particle morphology of the copper powder became more of a plate type. Nevertheless, the particle morphology slightly depended on the different grinding media of the ball mill. Moreover, the simulation results showed that rotation speed and ball size increased with the force and energy.

• 보존과학회지
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• 제32권3호
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• pp.417-423
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• 2016

백토안료의 제조 공정 중 분쇄 및 수비단계에서 아교수를 적용하고 이에 따른 영향을 분석하였다. 분쇄 공정에서 아교수를 적용한 경우, 일반 증류수를 사용했을 때보다 미분의 생성량이 감소하고 분급도가 향상되는 것으로 나타났다. 일반적으로 분쇄 성능 및 분쇄 한계에는 마찰력이 많은 영향을 미친다. 따라서 분쇄 조건에 따른 마찰력을 측정한 결과, 아교수를 적용한 경우 상대적으로 마찰력이 감소하는 것으로 확인되었다. 결국 분쇄 공정에서 아교수를 사용하는 것은 마찰력을 감소시켜 결과적으로 분급도를 향상시키기 위한 것으로 판단된다. 안료 제조 공정 중 수비단계에서 아교수를 적용한 결과, 아교수 적용 시 동일한 조건에서 보다 큰 입도의 입자를 수비해 내는 것이 가능한 것으로 나타났다. 이와 같은 결과는 수비액으로 아교수를 사용한 경우, 아교의 농도가 증가함에 따라 수비액의 점도가 증가하여 입자의 침강속도가 감소하기 때문인 것으로 확인되었다. 결국 수비 공정에서 아교수를 사용한 것은 수비액의 점도를 증가시켜 수비를 통해 선별할 수 있는 입도의 범위를 확대하고, 보다 세밀한 입도 구간으로 입자를 선별하기 위한 것으로 판단된다.

• 한국기계가공학회지
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• 제16권2호
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• pp.102-107
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• 2017

This study focuses on the effect of the elasticity modulus of jig material on blade edge shape in the grinding process of a sapphire medical knife. The ELID grinding process was applied as the edge-grinding method for sapphire material. Carbon steel and copper have been selected as the hard and soft jig materials, respectively. The blade edge created by ELID grinding was measured by a surface roughness tester and optical microscope. The shape of the ground edge and surface roughness were compared using the measurement results. As a result, it was found that chipping in the blade edge of the sapphire knife occurred more than in the case of jig material with a high-elasticity modulus because of the high normal force in the grinding process. Moreover, the maximum height surface roughness, $R_{max}$,of the ground surface was higher in the case of the jig material with a high-elasticity modulus due to the difference in elasticelongation. It was considered to lead to chipping from the notch effect.

• 한국기계가공학회지
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• 제21권6호
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• pp.36-43
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• 2022

Automobile brake discs are a major part of automobiles that are directly related to driver safety, and prevention of judder and squall noise is very important. This phenomenon occurs for complex reasons such as the precision and assembly of the brake module, and the material of the brake disc. The purpose of this study is to analyze the effect of the grinding wheel's grain size on the grinding conditions when machining cast iron, the material of the brake disc, and to derive the optimal grinding conditions through this.

• 한국CDE학회논문집
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• 제14권2호
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• pp.77-86
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• 2009

During manual work in shipbuilding such as blasting, grinding, and so on, a large force is acted on the body of a worker. As a result, this work induces musculoskeletal disorders of the worker and it also induces severe social problems. To solve this problem, we are developing a work support robot for the prevention of musculoskeletal disorders in shipbuilding. In this study, a result of conceptual design of this robot is presented. A worker can perform the blasting work with a small force using this robot which can lessen the force acting on the body of the worker.

• The Journal of Advanced Prosthodontics
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• 제6권4호
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• pp.317-324
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• 2014

PURPOSE. This study was to evaluate the effect of grinding of the inner metal surface during the porcelain try-in stage on metal-porcelain bonding considering the maximum temperature and the vibration of samples. MATERIALS AND METHODS. Ninety-one square prism-shaped ($1{\times}1{\times}1.5mm$) nickel-chrome cast frameworks 0.3 mm thick were prepared. Porcelain was applied on two opposite outer axial surfaces of the frameworks. The grinding was performed from the opposite axial sides of the inner metal surfaces with a low-speed handpiece with two types of burs (diamond, tungsten-carbide) under three grinding forces (3.5 N, 7 N, 14 N) and at two durations (5 seconds, 10 seconds). The shear bond strength (SBS) test was performed with universal testing machine. Statistical analyzes were performed at 5% significance level. RESULTS. The samples subjected to grinding under 3.5 N showed higher SBS values than those exposed to grinding under 7 N and 14 N (P<.05). SBS values of none of the groups differed from those of the control group (P>.05). The types of bur (P=.965) and the duration (P=.679) did not affect the SBS values. On the other hand, type of bur, force applied, and duration of the grinding affected the maximum temperatures of the samples, whereas the maximum vibration was affected only by the type of bur (P<.05). CONCLUSION. Grinding the inner metal surface did not affect the metal-porcelain bond strength. Although the grinding affected the maximum temperature and the vibration values of the samples, these did not influence the bonding strength.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.104-107
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• 2005

Recently, according to the development of semiconductor industry, needed to high-integration and high-functionality. These changes are required for silicon wafer of large scale diameter and precision of TTV (Total Thickness variation). So, in this research, suggest that the method of monitoring system is using motor current. This method is needed for observation of silicon wafer grinding process. Motor current sensor is consisted of hall sensor. Hall sensor is known to catching of change of current. Received original signal is converted to the diginal, then, it is calculated RMS values, and then, it is analysed in computer. Generally, the change of force is relative to the change of current, So this reason, in this research tried to monitoring of motor current change, and then, it will be applied to analysis for silicon wafer grinding process. using motor current sensor.