• 한국세라믹학회지
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• 제37권1호
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• pp.102-109
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• 2000

When PbZrO3 (PZ) and PbTiO3 (PT) particles were scattered on polished surfaces of sintered Pb(Zr0.52Ti0.48)O3 (PZT; Zr/Ti=1.08) and then annealed, the PZT grain boundaries migrated. Near the scattered particles, grain boundaries were corrugated and thus the grain shape changed from a normal one to irregular ones. Especially, near the scattered PZ particles, fast grain growth occurred. In the regions swept by moving grain boundaries, the Zr/Tiratio was measured to be about 1.35 for of PZ scattering and about 0.8 for PT scattering, respectively. This result indicates that the grain boundary migration was induced by alloying of Zr and Ti ions in PZT grains, as in usual diffusion induced grain boundary migration(DIGM). A calculation showed that higher coherency strain energy was induced for PT scattering because of higher alloying of Ti than of Zr.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.243.2-243.2
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• 2016

Tungsten (W) is recently gaining attention as a potential candidate to replace Cu in semiconductor metallization due to its expected improvement in material reliability and reduced resistivity size effect. In this study, the impact of electron scattering at grain boundaries in a polycrystalline W thin film was investigated. Two nominally 300 nm-thick films, a (110)-oriented single crystal film and a (110)-textured polycrystalline W film, were prepared onto (11-20) Al2O3 substrate and thermally oxidized Si substrate, respectively in identical fabrication conditions. The lateral grain size for the polycrystalline film was determined to be $119{\pm}7nm$ by TEM-based orientation mapping technique. The film thickness was chosen to significantly exceed the electron mean free path in W (16.1 and 77.7 nm at 293 and 4.2 K, respectively), which allows the impact of surface scattering on film resistivity to be negligible. Then, the difference in the resistivity of the two films can be attributed to grain boundary scattering. quantitative analyses were performed by employing the Mayadas-Shatzkes (MS) model, where the grain boundary reflection coefficient was determined to be $0.42{\pm}0.02$ and $0.40{\pm}0.02$ at 293 K and 4.2 K, respectively.

• 비파괴검사학회지
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• 제10권1호
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• pp.18-23
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• 1990

In materials with the large grain size, ultrasonic waves are highly attenuated by the grain boundary acting as scattering centers due to discontinuity of elastic constant. In this study, the improved probes were developed so that they minimized the effect of grain scattering in order to detect deep flaws in coarse grained materials. As the result, the developed ultrasonic transducers showed the better sensitivity and signal to noise ratio when compared with the commercial probes in testing the interior of coarse grained material.

• 대한금속재료학회지
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• 제49권12호
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• pp.924-929
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• 2011

It is well known that grain boundary cavitation is the main failure mechanism in austenitic stainless steel under tensile hold creep-fatigue interaction conditions. The cavities are nucleated at the grain boundary during cyclic loading and grow to become grain boundary cracks. The attenuation of ultrasound depends on scattering and absorption in polycrystalline materials. Scattering occurs when a propagation wave encounters microstructural discontinuities, such as internal voids or cavities. Since the density of the creep-fatigue cavities increases with the fatigue cycles, the attenuation of ultrasound will also be increased with the fatigue cycles and this attenuation can be detected nondestructively. In this study, it is found that individual grain boundary cavities are formed and grow up to about 100 cycles and then, these cavities coalesce to become cracks. The measured ultrasonic attenuation increased with the cycles up to cycle 100, where it reached a maximum value and then decreased with further cycles. These experimental measurements strongly indicate that the open pores of cavities contribute to the attenuation of ultrasonic waves. However, when the cavities develop, at the grain boundary cracks whose crack surfaces are in contact with each other, there is no longer any open space and the ultrasonic wave may propagate across the cracks. Therefore, the attenuation of ultrasonic waves will be decreased. This phenomenon of maximum attenuation is very important to judge the stage of grain boundary crack development, which is the indication of the dangerous stage of the structures.

• 열처리공학회지
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• 제12권2호
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• pp.157-165
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• 1999

Grain size of steels is one of the most important parameters which influence yield strength and fracture toughness. Ultrasonic wave propagating in polycrystalline materials is mostly attenuated by scattering at grain boundary. Effect of ultrasonic attenuation on average ferrite grain size of carbon steels with tensile strength $40{\sim}60kgf/mm^2$ consisting of multi phases such as ferrite + pearlite and ferrite + pearlite + bainite was evaluated. The attenuation of these steels rapidly increased with average ferrite grain diameter. Average ferrite grain diameter ($D_{av}$, ${\mu}m$) could be expressed as $1.79+22.97*a^{1/2.03}$, where a is attenuation with unit of nepers/cm. From this study, it was confirmed that nondestructive ultrasonic method could be used in measuring average ferrite grain size indirectly.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.429-429
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• 2010

TFT 제조 방법 중 LTPS (Low Temperature Polycrystalline Silicon)는 저온과 저비용 등의 이점으로 인하여 flat panel display 제작에 널리 사용된다. 이동도와 전류 점멸비 등에서 이점을 가지는 ELA(Excimer Laser Annealing)가 널리 사용되고 있지만, 이 방법은 uniformity 등의 문제점을 가지고 있다. 이를 극복하기 위한 방법으로 MICC(Metal Induced Capping Crystallization)이 사용되고 있다. 이 방법은 $SiN_x$, $SiO_2$, SiON등의 capping layer를 diffusion barrier로 위치시키고, Ni 등의 금속을 capping layer에 도핑 한 뒤, 다시 한번 열처리를 통하여 a-Si에 Ni을 확산시키킨다. a-Si 층에 도달한 Ni들이 seed로 작용하여 Grain size가 매우 큰 film을 제작할 수 있다. 채널의 grain size가 클 경우 grain boundary에 의한 캐리어 scattering을 줄일 수 있기 때문에 MIC 방법을 사용하였음에도 ELA에 버금가는 소자의 성능과 안정성을 얻을 수있었다. 본 연구에서는 large grain TFT의 Gate bias stress에 따른 소자의 안정성 측정 및 분석에 목표를 두었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.304.2-304.2
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• 2014

Chalcogenides (Te,Se) and pnictogens(Bi,Sb) materials have been widely investigated as thermoelectric materials. Especially, Bi2Te3 (Bismuth telluride) compound thermoelectric materials in thin film and nanowires are known to have the highest thermoelectric figure of merit ZT at room temperature. Currently, the thermoelectric material research is mostly driven in two directions: (1) enhancing the Seebeck coefficient, electrical conductivity using quantum confinement effects and (2) decreasing thermal conductivity using phonon scattering effect. Herein we demonstrated influence of annealing temperature on structural and thermoelectrical properties of Bismuth-telluride-selenide ternary compound thin film. Te-rich Bismuth-telluride-selenide ternary compound thin film prepared co-deposited by thermal evaporation techniques. After annealing treatment, co-deposited thin film was transformed amorphous phase to Bi2Te3-Bi2Te2Se1 polycrystalline thin film. In the experiment, to investigate the structural and thermoelectric characteristics of Bi2Te3-i2Te2Se1 films, we measured Rutherford Backscattering spectrometry (RBS), X-ray diffraction (XRD), Raman spectroscopy, Scanning eletron microscopy (SEM), Transmission electron microscopy (TEM), Seebeck coefficient measurement and Hall measurement. After annealing treatment, electrical conductivity and Seebeck coefficient was increased by defect states dominated by selenium vacant sites. These charged selenium vacancies behave as electron donors, resulting in carrier concentration was increased. Moreover, Thermal conductivity was significantly decreased because phonon scattering was enhanced through the grain boundary in Bi2Te3-Bi2Te2Se1 polycrystalline compound. As a result, The enhancement of thermoelectric figure-of-merit could be obtained by optimal annealing treatment.

• 한국정보통신학회논문지
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• 제18권3호
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• pp.638-642
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• 2014

본 연구에서는 비스무스(Bi) 박막의 스핀전자소자로의 응용가능성을 확인하기 위해서 열처리 공정에 의한 비스무스 박막의 결정 구조 및 자기저항변화를 조사하였다. 비스무스 박막은 초기에 결정성이 없이 약 100 nm의 결정립과 낮은 자기저항 비(MR)가 상온에서 4.7 % 로 보였으나, 열처리 공정 후 결정립이 확장되고 방위의 재배열이 일어나며 결정립이 형성 되었고, 이로 인해서 자기저항 비가 상온에서 404 %로 크게 향상 되었다. 이러한 자기저항 비의 큰 향상은 크게 확장된 결정립으로 인해서 스핀의 평균산란시간이 크게 증가했기 때문이다. 본 연구를 통해서 열처리 공정이 비스무스 박막의 결정립 형성 및 자기저항 비의 향상에 큰 영향을 보임을 확인하였고, 비스무스 박막의 스핀전자소자로서의 응용 가능성을 증명하였다.

• 대한금속재료학회지
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• 제49권8호
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• pp.649-656
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• 2011

The present study evaluated the microstructures and mechanical properties of severely deformed Ni-30Cr alloys. Cross-roll rolling (CRR) process was introduced as a severe plastic deformation (SPD), and Ni-30Cr alloy sheets were cold rolled to 90% thickness reduction and subsequently annealed at $700^{\circ}C$ for 30 min to obtain the recrystallized microstructure. Electron back-scattering diffraction (EBSD) was introduced to analyze grain boundary character distributions (GBCDs). The application of CRR to the Ni-30Cr alloy was effective in enhancing the grain refinement through heat treatment; consequently, the average grain size was significantly refined from $33{\mu}m$ in the initial material to $0.6{\mu}m$. This grain refinement directly improved the mechanical properties, in which yield and tensile strengths significantly increased relative to those of the initial material. We systematically discuss the grain refinement and accompanying improvement of the mechanical properties, in terms of the effective strain imposed by CRR relative to conventional rolling (CR).

• 한국세라믹학회지
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• 제40권6호
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• pp.560-565
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• 2003

방전 플라즈마 소결법(SPS: Spark Plasma Sintering)을 이용하여 800~100$0^{\circ}C$의 낮은 소결 온도에서 완전 치밀화를 이루는 M-doped ZnO를 (M=Al, Ni) 제조하여 그 소결 특성과 미세구조를 분석하였다. 전자현미경 분석 결과, NiO의 첨가는 ZnO 결정격자와의 고용체 형성을 촉진시키고 결정립 성장을 유발하였고, A1$_2$O$_3$는 순수한 ZnO 소결 시 나타나는 입계에서의 증발현상을 제어하고, 이차상 형성을 통하여 결정립 성장을 억제함을 확인할 수 있었다 NiO와 $Al_2$O$_3$를 동시에 첨가한 시편이 가장 우수한 미세구조가 형성됨을 확인하였고, SEM-EBSP (Electron Back-scattered Diffraction Pattern) 분석 결과 또한 우수한 결정립계 분포를 가지고 있음을 확인하였다. 이러한, 소결체의 우수한 미세구조적 특징은 carrier 농도 증가에 따른 전기 전도도와 증가 및 phonon scattering 효과에 의한 열전도도의 감소 효과를 유발하여 ZnO의 열전 특성을 향상시키리라 사료된다.