• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.235-236
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• 2006

The contact resistance and grain boundary potential barrier of ceramic $BaTiO_3$ PTCR were investigated. The electroless plated Ni, evaporated Al, and Ag paste were chosen as electrode materials of PTCR device for comparison analysis before and after heat treatment. The contact resistance of electrode were measured by electrometer (dc), digital multimeter (dc), and LCR meter (ac). In the case of Al electroded samples, the heat treatment and protective oxide layer had high resistance and effect on the stability of PTCR effect against contact resistance degradation, but the Ag-paste had comparably high contact resistance before heat treatment and decreased after heat treatment with safe. On the other hand, the samples with electroless plated Ni electrode had good properties of contact resistance against aging.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.35-40
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• 2008

Investigation on immersion gold layers was carried out using TEM analysis for the purpose of understanding the defect of immersion gold layer. The immersion gold layers prepared with three different types of baths were observed. The results showed that the defect structure of immersion gold layer is strongly dependent on the types of gold baths. Spherical defects of average 10 nm size were located along the grain boundaries for the specimen formed at KAu$(CN)_2$ bath containing no reducing agent. In the case of the specimen processed at KAu$(CN)_2$ bath containing a reducing agent, the spherical defects of 5-10 nm size were distributed randomly in grains as well as at grain boundaries. However, such defects disappeared almost completely when $Na_{3}Au(SO_3)_2$ bath was used to fabricate an immersion gold.

• Journal of Welding and Joining
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• v.34 no.5
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• pp.77-82
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• 2016

In this study, Microstructure and hardness of 1st layer with crystallographic orientation were investigated about solidification structure in multipass weld using high Mn-Ni flux cored wire. Microstructure of solidification consisted of austenite matrix and a little ${\varepsilon}-phase$ in grain boundaries. Orientation of grains was usually (001), (101), (111). According to crystallographic orientation, morphology of primary dendrite was different. The depletion of Fe and the segregation of Mn, C, Ni, Si, Cu, Cr, O were found along the grain boundaries. The area of segregation was wide with an order of (001), (101), (111) grains. And hardness of grains with crystallographic orientation increased with an order of (001), (101), (111) grains because of the segregation along dendrite boundary.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.107-107
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• 2012

Recently, large-area synthesis of high-quality but polycrystalline graphene has been advanced as a scalable route to applications including electronic devices. The presence of grain boundaries (GBs) may be detrimental on some electronic, thermal, and mechanical properties of graphene, including reduced electronic mobility, lower thermal conductivity, and reduced ultimate mechanical strength, yet on the other hand, GBs might be beneficially exploited via controlled GB engineering. The study of graphene grains and their boundary is therefore critical for a complete understanding of this interesting material and for enabling diverse applications. I present that scanning electron diffraction in STEM mode makes possible fast and direct identification of GBs. We also demonstrate that dark field TEM imaging techniques allow facile GB imaging for high-angle tilt GBs in graphene. GB mapping is systematically carried out on large-area graphene samples via these complementary techniques. The study of the detailed atomic structure at a GB in suspended graphene uses aberration-corrected atomic resolution TEM at a low kV.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.299-303
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• 1996

In this Study, the capacitance-voltage properties of the (Sr$\_$1-x/$.$Ca$\_$x/)$\_$m/TiO$_3$(0.05$\leq$x$\leq$0.2, m=0.996, 1, 1.004) ceramics were investigated. The results of the capacitance-voltage measurements indicated that the grain boundary was composed of the continuous insulating layers. The capacitance is almost unchanged below about 20[V] but it decreases slowly about 20[V]. The thick of the effective depleation layer was calculated by using the average grain size, it was in the range of 760∼3400[${\AA}$].

• Progress in Superconductivity
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• v.14 no.1
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• pp.30-33
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• 2012

We have grown $MgB_2$ superconducting thin films on the SiC buffer layers by means of hybrid physical-chemical vapor deposition (HPCVD) technique. Prior to that, SiC was first deposited on $Al_2O_3$ substrates at various temperatures from room temperature to $600^{\circ}C$ by using the pulsed laser deposition (PLD) method in a vacuum atmosphere of ${\sim}10^{-6}$ Torr pressure. All samples showed a high transition temperature of ~40 K. The grain boundaries of $MgB_2$ samples with SiC layer are greater in amount, compare to that of the pure $MgB_2$ samples. $MgB_2$ with SiC buffer layer samples show interesting change in the critical current density ($J_c$) values. Generally, at both 5 K and 20 K measurements, at lower magnetic field, all $MgB_2$ films deposited on SiC buffer layers have low $J_c$ values, but when they reach higher magnetic fields of nearly 3.5 Tesla, $J_c$ values are enhanced. $MgB_2$ film with SiC grown at $600^{\circ}C$ has the highest $J_c$ enhancement at higher magnetic fields, while all SiC buffer layer samples exhibit higher $J_c$ values than that of the pure $MgB_2$ films. A change in the grain boundary morphologies of $MgB_2$ films due to SiC buffer layer seems to be responsible for $J_c$ enhancements at high magnetic fields.

• Journal of the Korean Ceramic Society
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• v.50 no.1
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• pp.87-91
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• 2013

The doping effect of Sn on the microstructure evolution and dielectric properties was studied in $CaCu_3Ti_{4-x}Sn_xO_{12}$ polycrystals. Samples were produced by a conventional solid-state reaction method. Sintering was carried out at $1115^{\circ}C$ for 2-16 h in air. The dielectric constant and loss were examined at room temperature over a frequency range between $10^2$ and $10^6$ Hz. The microstructure was found to evolve into three stages. Addition of $SnO_2$ led to an increase in density and advanced formation of abnormal grains. The formation of coarse grains with a reduced thickness of the boundary brought about an enhanced dielectric constant and a lower dielectric loss below ~1 kHz. EDS data showed the Cu-rich phase along the grain boundary, which should contribute to the improved dielectric constant according to the internal barrier layer capacitor model. After all, $SnO_2$ was an effective dopant to elevate the dielectric characteristics of $CaCu_3Ti_{4-x}Sn_xO_{12}$ polycrystals as a promoter for abnormal grain growth.

• The Korean Journal of Ceramics
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• v.1 no.1
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• pp.13-20
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• 1995

Effects of thermal annealing on the dielectric/piezoelectric properties of $Pb(Zn, Mg)_{1/3}Nb_{2/3}O_3-PbTiO_3$ ceramics (PZMNPT) with Zn/Mg=6/4) were examined across the rhombohedral/tetragonal morphotropic phase boundary (MPB). Both the relative dielectric permittivity ($\varepsilon$r)and the piezoelectric constant($d_33$)/electromechanical coupling constant ($k_p$)were increased by thermal annealing ($800^{\circ}$~$900^{\circ}C$) after sintering at $1150^{\circ}C$ for 1 hr. Based on the dielectric analysis using the series mixing model and the concept of a random distribution of the local Curie points, the observed improvements in the dielectric and piezoelectric properties of PZMN-PT were interpreted in terms of the elimination of PbO-rich amorphous intergranular layers(~1nm) induced by thermal annealing. A concrete evidence of the presence of amorphous grain-boundary layers in the unannealed (as-sintered) specimen was obtained by examining the structure of intergranular region using a TEM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.251-254
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• 1998

The ($0.8BaTiO_3-0.1SrTiO_3-0.1MgTiO_3$)+$0.006Nb_2O_5$ ceramics were fabricated by conventional ceramic process. The dielectric property of specimen was investigated that the specimen was sintering temperature at 1,300C for 3hours and then annealed at $1,100^{\circ}C$ for 3hours in a atmosphere (air) to be painted on the surface with CuO paste. The results of the temperature and frequency are varied, the dielectric constant and loss tangent are unsuitable for BL capacitor. The dielectric constants were varied to be negative temperature coefficient(2.000-3,000) in the temperature range between -10 and $140^{\circ}C$, the dissipation factors (tan $\delta$) were some high(0.1-0.3). It was not grain insulation, in cause of the some difficult to be annealed temperature with CuO paste and fired atmosphere. But, we have some different annealing temperature and fired atmosphere, it will be suitable BL(Boundary Layer)capacitor.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.175-182
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• 2022

Rare-earth elements were doped with Mg to enhance the temperature stability of dielectric properties of BaTiO₃ for its application to MLCC (Multi-Layer Ceramic Capacitor). The additives strongly affect both grain growth and densification behaviors during sintering, and hence dielectric properties. The additive effects therefore should be examined in each system with different additives. This study investigated the crystal structure, grain growth and densification behaviors and related variations in dielectric constant with respect to sintering temperature. Dielectric constant appears to be varied with grain size in a temperature range between 1200 and 1300℃, suggesting the importance of grain size control. The temperature dependence of grain size variation was well explained by an established theory correlating the grain growth behavior with grain boundary structure. This accordance provides a basis for sintering technique to control grain growth thus to improve dielectric constant in rare-earth doped BaTiO₃.