• Title/Summary/Keyword: grain boundaries

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Possible pinning of grain-boundary vortices by neighboring Abrikosov vortices in the nearby grains (Abrikosov 볼텍스에 의한 결정입계 볼텍스의 속박 현상)

  • Kim, Dong-Ho
    • 한국초전도학회:학술대회논문집
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    • v.9
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    • pp.1-5
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    • 1999
  • The critical currents I$_c$ of the YBCO grain boundaries of 90-degree [100] symmetric tilt showed a hysteretic behavior depending on how the external magnetic fields were applied. Near 77K for fields less than ${\sim}$1 T, the field-cooled I$_c$ of grain boundaries was larger than the zero-field-cooled I$_c$. This result is consistent with the model in which the grain-boundary vortices can be pinned by neighboring Abrikosov vortices in the nearby grains.

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Microstructure and Electrical Properties of $SiO_2$-Doped Zinc Oxide Varistors ($SiO_2$가 첨가된 산화아연 바리스터의 미세구조 및 전기적 특성)

  • 남춘우;정순철
    • Electrical & Electronic Materials
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    • v.10 no.7
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    • pp.659-667
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    • 1997
  • The influence of SiO$_2$on the microstructure and electrical properties of zinc oxide varistor was investigated. Zn$_2$SiO$_4$third phase in the sintered body was found at grain boundaries, multiple grain junctions, and occasionally within ZnO grains. This phase acted as a grain growth inhibitor, which retard the grain growth of the ZnO matrix by impeding migration on the grain boundaries. As SiO$_2$ addition increases, average grain size decreased from 40.6${\mu}{\textrm}{m}$ to 26.9${\mu}{\textrm}{m}$ due to the pinning effect by Zn$_2$SiO$_4$ and drag effect by Si segregation at grain boundaries, the breakdown voltage consequently increased. When SiO$_2$ addition is increased, interface state density decreased, however, the barrier height increased by decrease of donor concentration, as a result, the nonlinear exponent increased and leakage current decreased. While, as SiO$_2$ addition increase, it was found that the apparent dielectric loss factor shows a tendency of decrease. Wholly, electrical properties of zinc oxide varistor can be said to be improved by SiO$_2$addition.

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INTERGRANULAR CORROSION-RESISTANT STAINLESS STEEL BY GRAIN BOUNDARY ENGINEERING

  • Hiroyuki Kokawa;Masayuki Shimada;Wang, Zhan-Jie;Yutaka S. Sato
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.250-254
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    • 2002
  • Intergranular corrosion of austenitic stainless steels is a conventional and momentous problem during welding and high temperature use. One of the major reasons for such intergranular corrosion is so-called sensitization, i.e., chromium depletion due to chromium carbide precipitation at grain boundaries. Conventional methods for preventing sensitization of austenitic stainless steels include reduction of carbon content in the material, stabilization of carbon atoms as non-chromium carbides by the addition of titanium, niobium or zirconium, local solution-heat-treatment by laser beam, etc. These methods, however, are not without drawbacks. Recent grain boundary structure studies have demonstrated that grain boundary phenomena strongly depend on the crystallographic nature and atomic structure of the grain boundary, and that grain boundaries with coincidence site lattices are immune to intergranular corrosion. The concept of "grain boundary design and control", which involves a desirable grain boundary character distribution, has been developed as grain boundary engineering. The feasibility of grain boundary engineering has been demonstrated mainly by thermomechanical treatments. In the present study, a thermomechanical treatment was tried to improve the resistance to the sensitization by grain boundary engineering. A type 304 austenitic stainless steel was pre-strained and heat-treated, and then sensitized, varying the parameters (pre-strain, temperature, time, etc.) during the thermomechanical treatment. The grain boundary character distribution was examined by orientation imaging microscopy. The intergranular corrosion resistance was evaluated by electrochemical potentiokinetic reactivation and ferric sulfate-sulfuric acid tests. The sensitivity to intergranular corrosion was reduced by the thermomechanical treatment and indicated a minimum at a small roll-reduction. The frequency of coincidence-site-lattice boundaries indicated a maximum at a small strain. The ferric sulfate-sulfuric acid test showed much smaller corrosion rate in the thermomechanically-treated specimen than in the base material. An excellent intergranular corrosion resistance was obtained by a small strain annealing at a relatively low temperature for long time. The optimum parameters created a uniform distribution of a high frequency of coincidence site lattice boundaries in the specimen where corrosive random boundaries were isolated. The results suggest that the thermomechanical treatment can introduce low energy segments in the grain boundary network by annealing twins and can arrest the percolation of intergranular corrosion from the surface.

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Investigation of GaAs Tilt Grain Boundaries by High-resolution Transmission Electron Microscopy (HITEM을 이용한 GaAs 기울임입계 구조 연구)

  • ;C. B. Carter
    • Korean Journal of Crystallography
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    • v.6 no.2
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    • pp.69-74
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    • 1995
  • GaAs tilt grain boundaries were propared by growing GaAs epilayers on Ge bicrystals by an organometallic vapor phase epitaxy (OMVPE) method ∑ =9 tilt grain boundaries were produced when two different first-order twin boundaries interacted with one another in GaAs epilayers. Structural investigations were performed for the coherent and second-order twin boundaries of GaAs by high-resolution transmission electron microscopy (HRTEM). Polarities of cross-boundary bondings were determined from the high-order Laue zone (HOLZ) lines in the (200) convergent beam disks : these were recorded from the two grains on either side of the boundaries, respectively, at particular diffraction conditions.

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Electrical and Chemical Characteristics of the Grain Boundaries of Semiconducting $BaTiO_3$ Ceramics Prepared with Surface-Coated Powders (표면 코팅된 분말을 이용하여 제조된 반도성 $BaTiO_3$ 소결체의 입계 화학 및 전기적 특성)

  • 박명범;김정돈;조남희
    • Journal of the Korean Ceramic Society
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    • v.37 no.4
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    • pp.338-344
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    • 2000
  • Grain boundary chemistry and electrical characteristics of polycrystalline BaTiO3 ceramics, which were prepared with sol-gel surface-coated semiconducting powders, were investigated. Mn ions were coated on the powder surface by sol-gel coating-techniques. The additives coated on the surface of the powders were observed to be present near the grain boundaries of the ceramics. The ceramics exhibit the PTCR characteristics with a resistivity jump ratio(Pmax/Pmin) of about 2$\times$103. With raising the temperature from room temprature to 20$0^{\circ}C$, the oxidation state of the Mn ions varied from Mn3+ to Mn2+ in the coating layers. Near the grain boundaries an excessive negative charge layer of about 20nm was formed.

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Chemically Induced Grain Boundary Migration of MgAl2O4 by ZnO (ZnO의 화학구동력에 의한 $MgAl_2O_4$의 입계이동)

  • Choi, Kyoon;Cho, Eu-Seong;Kang, Suk-Joong
    • Journal of the Korean Ceramic Society
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    • v.29 no.11
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    • pp.888-892
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    • 1992
  • The chemically induced grain-boundary migration has been studied in MgAl2O4 spinel under ZnO atmosphere. MgAl2O4 compacts been prepared by sintering powder mixture of Al2O3 and MgO at 1$600^{\circ}C$ for 60 h in air. The sintered MgAl2O4 has been heat-treated at 150$0^{\circ}C$ in a ZnO atmosphere. During the heat-treatment grain boundaries have become curved or faceted, and the total area of grain boundaries have increased. In the migrated region, the ZnO content is higher by 6 wt% than that in other regions, indicating that the migration was induced by addition of ZnO. In some shrinking grains, the faceted planes of different grain boundaries for the same grain are parallel to each other. This result provide an experimental support for the coherency strain energy in diffusion layer of the shrinking grain as being the major driving force. Calculated coherency strain energy of MgAl2O4 shows the maximum at {111} planes and the minimum at {100} planes. Although the minimum surface energy is at {111} planes, the faceted moving boundaries are expected to be {100} planes because of lowest driving force for the grain-boundary migration.

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Effects of Microstructure on the Fretting Wear of Inconel 690 Steam Generator Tube

  • Hong, Jin-Ki;Kim, In-Sup;Park, Chi-Yong;Kim, Jin-Weon
    • Nuclear Engineering and Technology
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    • v.34 no.2
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    • pp.132-141
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    • 2002
  • The effects of microstructure on fretting wear were investigated in Inconel 690 tube. The microstructure observation indicated that the solution annealing temperature and time affected the grain size of the Inconel 690 tubes. The carbide morphology, along grain boundaries, was mainly affected by thermal treatment time and temperature. The wear test results showed that specimens with larger grain size and with coarse carbides along grain boundaries had better wear resistance. Cracks were found in specimens with carbides along the grain boundary, while few cracks were found in carbide free specimens. It seemed that the carbides on grain boundary assisted crack formation and propagation in carbide containing specimens. On the other hand, the micro-hardness of specimen did not have a major role in fretting wear. It could be inferred from the SEM images of worn surfaces that the main wear mechanism of carbide containing specimen was delamination, while that of carbide free specimen was abrasion.

A Development of High-Durability Copper Foil Materials for Clock Spring Cable Using Grain Size Control Techniques (결정립 제어 기술을 이용한 클락스프링 케이블용 고내구 동박 소재 개발)

  • Chae, Eul Yong;Lee, Ho Seung
    • Journal of Auto-vehicle Safety Association
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    • v.13 no.3
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    • pp.20-25
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    • 2021
  • Flexural resistance evaluation of FFC (Flexible Flat Cable) was performed according to the grain size of rolled copper foil by adding 0.1wt% silver (Ag) and electrodeposited copper foil by slitting method after heat-treatment. These methods are aimed at enhancing the flexural durability of the FFC by growing the grain size of copper foil. By increasing the grain size of the copper foil and minimizing the miss-orientation at grain boundaries, the residual stress at the grain boundaries of the copper foil is reduced and the durability of the FFC is improved. Maximizing an average grain size of copper foil can be got a good solution in order to enhance the durability of the FFC or FPCB (Flexible Printed Circuit Board).

Effect of SiC Particle Size on Microstructure of $Si_3N_4/SiC$ Nanocomposites ($Si_3N_4/SiC$ 초미립복합체의 미세조직에 미치는 SiC 입자크기의 영향)

  • 이창주;김득중
    • Journal of the Korean Ceramic Society
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    • v.37 no.2
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    • pp.152-157
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    • 2000
  • Si3N4/SiC nanocomposite ceramics containing 5 wt%dispersed SiC particles were prepared by gas-pressure-sintering at 200$0^{\circ}C$ under nitrogen atmosphere. SiC particles with average sizes of 0.2 and 0.5${\mu}{\textrm}{m}$ were used, and the effect of the SiC particle size on the microstructure was investigated. The addition of SiC particles effectively suppressed the growth of the Si3N4 matrix grains. The effect of grain growth inhibition was higher in the nanocomposites dispersed with fine SiC. SiC particles were dispersed uniformly inside Si3N4 matrix grains and on grain boundaries. When the fine SiC particles were added, large fraction of the SiC particles was trapped inside the grains. On the other hand, when the large SiC particles were added, most of the SiC particles were located on grain boundaries. Typically, the fraction of SiC particles located at grain boundaries was higher in the specimen prepared from $\beta$-Si3N4 than in the specimen prepared from $\alpha$-Si3N4.

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Microstructure and Mechanical Behavior of Ultrafine Grained Bulk Al Processed by High Pressure Torsion of the Al Powders (고압비틀림 성형 공정에 의한 Al 분말의 초미세결정 벌크화 및 특성 평가)

  • Joo, Soo-Hyun;Yoon, Seung-Chae;Lee, Chong-Soo;Kim, Hyong-Seop
    • Journal of Powder Materials
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    • v.17 no.1
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    • pp.52-58
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    • 2010
  • Bulk nanostructured metallic materials are generally synthesized by bottom-up processing which starts from powders for assembling bulk materials. In this study, the bottom-up powder metallurgy and High Pressure Torsion (HPT) approaches were combined to achieve both full density and grain refinement at the same time. After the HPT process at 473K, the disk samples reached a steady state condition when the microstructure and properties no longer evolve, and equilibrium boundaries with high angle grain boundaries (HAGBs) were dominant. The well dispersed alumina particles played important role of obstacles to dislocation glide and to grain growth, and thus, reduced the grain size at elevated temperature. The small grain size with HAGBs resulted in high strength and good ductility.