• 제목/요약/키워드: gold coating

검색결과 99건 처리시간 0.026초

알루미늄 희생층을 이용한 금속 구조물의 제작 (Fabrication of metal structure using AI sacrificial layer)

  • 김정무;박재형;이상호;신동식;김용권;이윤식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1893-1895
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    • 2001
  • In this paper, novel release technique using wet etch is proposed. The results of this technique and the results of SAMs (Self-Assembled monolayers) coated after release using this technique are compared. Fabricated structure have 100 um in width and experimental length is from 100 um to 1 mm. Thickness of aluminum sacrificial layer is 2 um and structure thickness is 2.5 um. Cantilevers and bridges are fabricated with electroplated gold and silicon nitride deposited on substrate. An aluminium sacrificial layer was evaporated thermally and removed in various wet etching solutions. Detachment length of cantilever is 200 um and detachment length of bridge is 1 mm after isooctane rinsing. And the SAMs coating condition which is appropriate for gold and nitride are studied respectively.

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실리카 코팅 AuNPs의 Langmuir-Blodgett 박막 제조 (Preparation of Langmuir-Blodgett Film of Silica Coated Gold Nanoparticles)

  • 박민성;최재유;정재연;정걸;현진호
    • 접착 및 계면
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    • 제11권4호
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    • pp.144-148
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    • 2010
  • 본 연구에서는 플라즈몬 공명 신호 증폭을 위한 AuNPs의 실리카 표면 개질 및 나노 입자의 안정적인 표면 박막 형성을 목표로 하였다. 직경 10 nm의 AuNPs를 수용액 상에서 제조하였으며, AuNPs 표면에 실리카 층을 단계별로 형성시켰다. Tetraethlyorthosilicate 농도를 조절함으로써 실리카 박막 두께를 조절하였으며, 얻어진 나노 입자들을 수용액 표면에 분산시켜 Langmuir-Blodgett 박막을 제조하였다. 흡광스펙트럼의 변화를 관찰함으로써 AuNPs의 크기 변화를 확인하였으며, 원자 힘 현미경으로 LB 박막의 형성 여부와 표면 균일도를 살펴보았다.

고정화법을 달리하여 제조한 압전류적 항체 센서에 의한 Salmonella spp.의 신속 검출 (Rapid Detection of Salmonella spp. by Antibody-Immobilized Piezoelectric Crystal Biosensor)

  • 박인선;김우연;김남수
    • 한국식품위생안전성학회지
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    • 제13권3호
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    • pp.206-212
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    • 1998
  • Salmonella spp.의 신속한 검출을 위하여 엷은 박막형태의 수정결정을 사용하는 압전류적(piesoelectric) 항체센서 시스템을 개발하고 증류수, 완충용액, 식염용액 등의 여러 매질 중에서 보여주는 진동 특성을 검토하였다. Salmonella spp. 균 구조항원(Common structural antigen)에 대한 항체를 수정결정에 PEI pre-coating, BSA 가교화, 3-APTES silanizaition, protein A와 DTBP thiolation의 5가지 방법에 의해 고정화한 후 항체 센서의 안정성을 살펴보았다. Salmonella 균을 주입하였을 때 Salmonella 균과 수정 결정에 고정화한 항체와의 결함반응에 의해 수정결정의 질량증가와 이에 따른 진동수 감소가 나타났다. 고정화방법 중 protein A와 DTBP를 이용하여 고정화하는 방법이 센서반응을 가장 안정적이고 재현성 있게 나타내줌을 알 수 있었다. $7.45{\times}10^{7}\;CFU/ml$의 Salmonella 균을 반응 cell 내에 주입하였을 때 protein A를 이용한 고정화의 경우 80Hz, DTBP를 이용한 고정화의 경우 283 Hz의 진동수 감소가 나타났으며, 압전류적 항체센서를 이용할 경우 40분 이내에 Salmonella spp.의 검출이 가능하였다.

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타이타늄 표면 코팅이 도재 결합에 미치는 영향 (EFFECTS OF TITANIUM SURFACE COATING ON CERAMIC ADHESION)

  • 김연미;김현승;이광민;이도재;오계정;임현필;서윤정;박상원
    • 대한치과보철학회지
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    • 제45권5호
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    • pp.601-610
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    • 2007
  • Statement of problem: The adhesion between titanium and ceramic is less optimal than conventional metal-ceramic bonding, due to reaction layer form on cast titanium surface during porcelain firing. Purpose: This study characterized the effect of titanium-ceramic adhesion after gold and TiN coating on cast and wrought titanium substrates. Material and method: Six groups of ASTM grade II commercially pure titanium and cast titanium specimens$(13mm{\times}13mm{\times}1mm)$ were prepared(n=8). The conventional Au-Pd-In alloy served as the control. All specimens were sandblasted with $110{\mu}m\;Al_2O_3$ particles and ultrasonically cleaned for 5min in deionized water and dried in air before porcelain firing. An ultra-low-fusing dental porcelain (Vita Titankeramik) was fused on titanium surfaces. Porcelain was debonded by a biaxial flexure test at a cross head speed of 0.25mm/min. The excellent titanium-ceramic adherence was exhibited by the presence of a dentin porcelain layer on the specimen surface after the biaxial flexure test. Area fraction of adherent porcelain (AFAP) was determined by SEM/EDS. Numerical results were statistically analyzed by one-way ANOVA and Student-Newman-Keuls test at ${\alpha}=0.05$. Results: The AFAP value of cast titanium was greatest in the group 2 with TiN coating, followed by group 1 with Au coating and the group 3 with $Al_2O_3$ sandblasting. Significant statistical difference was found between the group 1, 2 and the group 3 (p<.05). The AFAP value of wrought titanium was greatest in the group 5 with TiN coating, followed by the group 4 with Au coating and the group 6 with $Al_2O_3$ sandblasting. Conclusion: No significant difference was observed among the three groups (p>.05). The AFAP values of the cast titanium and the wrought titanium were similar. However the group treated with $Al_2O_3$ sandblasting showed significantly lower value (p<.05).

임플랜트 지대주 나사의 텅스텐 카바이드/탄소 코팅이 전하중에 미치는 영향에 관한 연구 (INFLUENCE OF TUNGSTEN CARBIDE/CARBON COATING ON THE PRELOAD OF IMPLANT ABUTMENT SCREWS)

  • 최진욱;정창모;전영찬;임장섭;정희찬;엄태관
    • 대한치과보철학회지
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    • 제44권2호
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    • pp.229-242
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    • 2006
  • Statement of problem: In order to increase preload with reducing the friction coefficient, abutment screws coated with pure gold and Teflon as dry lubricant coatings have been introduced. But the reported data indicate that if screw repeated tightening and loosening cycle, an efficiency of increasing preload was decreased by screw surface wearing off. Purpose: This study was to evaluate the influence of tungsten carbide/carbon coating, which has superior hardness and frictional wear resistance, on the preload of abutment screws and the stability of coating surface after repeated closures. Material and method: The rotational values of abutment screws and the compressive forces between abutment and fixture were measured in implant systems with three different joint connections, one external butt joint and two internal cones. Moreover the stability and the alteration of coating surface were examined by comparison of the compressive force and the removable torque values during 10 consecutive trials, observation with scanning electron microscope and analyzed the elemental composition with energy dispersive x-ray spectroscopy Results and conclusion: 1. Application of coating resulted in significant increase of compressive force in all implant systems(P<.05). The increasing rate of compressive force by coating in external butt joint was gloater than those in internal cones (P<.05). 2. Coated screw showed the significant additional rotation compared to non-coated screw in all implant systems (P<.05). There were no significant differences in the increasing rate of rotation among implant systems (P>.05). 3. Removable torque values were greater with non-coated screw than that with coated screw (P<.05). 4. Coated screw showed insignificant variations in the compressive forces during 10 consecutive trials(P>.05) 5. After repeated trials, the surface layer of coated screw was maintained relatively well. However surface wearing and irregular titanium fragments were found in non-coated screw.

잉크젯 프린팅을 이용한 저항형 고분자 습도센서 (Resistive Polymeric Humidity Sensor Fabricated with Ink-Jet Printing Technique)

  • 공명선;금내리
    • 마이크로전자및패키징학회지
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    • 제11권1호
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    • pp.49-57
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    • 2004
  • 습도센서의 감습막으로 응용하기 위하여 폴리이온넨계 전해질 잉크를 제조하였다. 감습필름 은 금전극이 인쇄된 알루미나 기판 위에 잉크젯 인쇄 기법을 사용하여 도포 하였다. 또한 methyl methacrylate, acrylic acid, 2-hydroxyethyl methacrylate 그리고 [(2-methacryloyloxy)ethyl)ethyl]trimethylammonium chloride의 공중합체를 합성하였으며, 이것은 침적코팅에 의한 감습막 제조에 사용하였다. 상대습도에 따른 전기적 특성을 측정하였으며 침적코팅에 의한 습도센서와 비교하였다. 습도센서는 상대습도가 증가함에 따라서 저항의 감소함을 보여주었으며 그들의 저항특성은 시료간에 가깝게 일치함을 보여주었다.

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PEDOT:PSS 정공 수송층에 금 나노입자를 첨가한 유기태양전지의 제작 및 특성 연구 (Fabrication and Characterization of Organic Solar Cells with Gold Nanoparticles in PEDOT:PSS Hole Transport Layer)

  • 김성호;최재영;장호정
    • 마이크로전자및패키징학회지
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    • 제20권2호
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    • pp.39-46
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    • 2013
  • 본 논문은 캐리어의 이동도 및 전도도를 개선하고, 흡수된 빛의 이동 경로를 증가시켜 광흡수도를 높이기 위하여 정공 수송층 재료에 금 나노입자를 첨가하여 유기태양전지를 제작하였다. 광활성층으로는 P3HT와 PCBM의 bulk-heterojunction 구조를 사용하였다. 유기태양전지에서 금 나노입자를 첨가한 정공 수송층의 효과를 관찰하기 위하여 금 나노입자의 첨가량(0, 0.5, 1.0 wt% Au)과 열처리온도(상온, $110^{\circ}C$, $130^{\circ}C$, $150^{\circ}C$)에 따른 광학적 전기적 특성을 조사하였다. 최대전력변환효율을 갖는 유기태양전지는 0.5 wt% 금 나노입자 첨가한 소자와 $130^{\circ}C$에서 열처리한 소자에서 관찰되었다. 이때 유기태양전지의 전기적 특성은 금 나노입자를 0.5 wt% 첨가한 경우, 단락전류밀도, 곡선인자 및 전력변환효율은 각각 10.2 $mA/cm^2$, 55.8% 및 3.1%로 나타났으며, $130^{\circ}C$에서 열처리한 경우, 12.0 $mA/cm^2$의 단락전류밀도와 64.2%의 곡선인자를 가지며, 4.0%의 전력변환효율이 관찰되었다.

Film Coating and Micro - Pattering Process of Nano-particle Conductive Ink System by Using ESD Method

  • 양종원;조상현;신나리;김진열
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.238.1-238.1
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    • 2011
  • 본 연구에서는 non-contact deposition method의 일환인 ESD (electroctatic deposition)의 박막공정을 이용하여 Conductive layer 위에 Gold nanoparticles 및 Silver nanoparticles 등 organic/inorganic nano particle conductive ink system의 단분산 2D 박막을 제조를 연구하였다. ESD head를 통해 여러가지 organic / inorganic nano particle conductive ink system을 Deposition하였으며 분산도가 높고 균일한 단분산의 2차원 박막 구조를 얻을 수 있었으며, 전도성 PEDOT과의 Hybridization을 통해 균일상의 표면 Morphology를 갖는 고 전도성 투명 필름을 제작하였다. ESD technique를 이용하는 박막공정 기술은 나노입자 및 나노구조물의 박막화 패턴화를 포함하는 새로운 Deposition 기술로써 이를 응용하여 금속 나노입자의 2차원의 패턴화된 박막 구현을 통해 유기반도체 및 전자소자에의 응용성을 증거할 수 있었다.

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Nanoparticles Modified With Cationic Thiol Surfactant as Efficient Inhibitors for the Corrosion of Carbon Steel

  • Azzam, Eid M.S.;Sami, Radwa M.;Alenezi, Khalaf M.;El Moll, Hani;Haque, A.
    • Journal of Electrochemical Science and Technology
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    • 제12권3호
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    • pp.308-316
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    • 2021
  • In this work, we report synthesis, characterization and corrosion inhibition properties of cationic thiol surfactant-capped silver (SC-Ag-NPs) and gold (SC-Au-NPs) nanoparticles. SC-Ag-NPs and SC-Au-NPs were characterized using regular techniques include TEM. Corrosion study was carried out using carbon steel (CS) in 3.5% NaCl aqueous solution and characterized using multiple electrochemical techniques. Our results suggest that the paint containing SC-Ag-NPs and SC-Au-NPs endow efficient corrosion protection to the CS. Especially, SC-Au-NPs based paint form a stronger barrier between the metal and the corrosive ions, leading to better inhibition properties.

비시안 무전해 Au 도금의 석출거동에 미치는 하지층 무전해 Ni-P 도금 조건의 영향 (Effect of underlayer electroless Ni-P plating on deposition behavior of cyanide-free electroless Au plating)

  • 김동현;한재호
    • 한국표면공학회지
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    • 제55권5호
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    • pp.299-307
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    • 2022
  • Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.