• Nuclear Engineering and Technology
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• 제43권2호
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• pp.159-166
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• 2011

Si-rich-layer-coated U-7 wt%Mo plates were prepared in order to evaluate the diffusion barrier performance of the Si-rich layer in U-Mo vs. Al interdiffusion. Pure Si powder was used for coating the U-Mo plates by annealing at $900^{\circ}C$ for 1 h under vacuum of approximately 1 Pa. Si-rich layers containing more than 60 at% of Si were formed on U-7 wt%Mo plates. Diffusion couple tests were conducted in a muffle furnace at $560-600^{\circ}C$ under vacuum using Si-rich-layer-coated U-Mo plates and pure Al plates. Diffusion couple tests using uncoated U-Mo plates and Al-(0, 2 or 5 wt%)Si plates were also conducted for comparison. Si-rich-layer coatings were more effective in suppressing the interaction during diffusion couple tests between coated U-Mo plate and Al, when compared with U-Mo vs. Al-Si diffusion couples, since only small amounts of Al in the coating could be found after the diffusion couple tests. Si-rich-layer-coated U-7wt%Mo particles were also prepared using the same technique for U-7 wt%Mo plates to observe the microsturctures of the coated particles.

• 한국분말재료학회지
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• 제26권2호
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• pp.126-131
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• 2019

In the present work, a new hydrogen added argon heat treatment process that prevents the formation of hydrides and eliminates the dehydrogenation step, is developed. Dissolved hydrogen has a good effect on sintering properties such as oxidation resistance and density of greens. This process can also reduce costs and processing time. In the experiment, commercially available Ti-6Al-4V powders are used. The powders are annealed using tube furnace in an argon atmosphere at $700^{\circ}C$ and $900^{\circ}C$ for 120 min. Hydrogen was injected temporarily during argon annealing to dissolve hydrogen, and a dehydrogenation process was performed simultaneously under an argon-only atmosphere. Without hydride formation, hydrogen was dissolved in the Ti-6Al-4V powder by X-ray diffraction and gas analysis. Hydrogen is first solubilized on the beta phase and expanded the beta phases' cell volume. TGA analysis was carried out to evaluate the oxidation resistance, and it is confirmed that hydrogen-dissolved Ti-6Al-4V powders improves oxidation resistance more than raw materials.

• 대한금속재료학회지
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• 제47권12호
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• pp.860-865
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• 2009

The effect of Co additive on the electrical properties of Fe-Si alloys prepared by a RF inductive furnace was investigated. The electrical conductivity and Seebeck coefficient were measured as a function of the temperature under an Ar atmosphere to evaluate their applicability to thermoelectric energy conversion. The electrical conductivity of the specimens increased as the temperature increased, showing typical semiconducting behavior. The electrical conductivity of Co-doped specimens was higher than that of undoped specimens and increased slightly as the amount of Co additive increased. This is most likely due to the difference in the carrier concentration and the amount of residual metallic phase ${\varepsilon}$-FeSi (The ${\varepsilon}$-FeSi was detected in spite of an annealing treatment of 100 h at $830^{\circ}C$). Additionally, metallic conduction increased slightly as the amount of Co additive increased. On the other hand, Co-doped specimens showed a lower Seebeck coefficient due to the metallic phase. The power factor of Co-doped specimens was higher than that of undoped specimens. This would be affected more by the electrical conductivity compared to the Seebeck coefficient.

• 소성∙가공
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• 제33권4호
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• pp.285-290
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• 2024

Electropulsing treatment (EPT) has been developed as an alternative to furnace heat treatment (FHT) to exploit its engineering advantages in rapidly annealing metallic materials. Conventionally, the separation of thermal and athermal effects of EPT has been attempted by comparing EPT and FHT specimens processed under identical temperature and duration. However, this method inherently introduces experimental and measurement errors. This study proposes a novel approach to distinguish the thermal and athermal effects of EPT-processed metals using T-shaped specimen with two observation points, namely 'C' and 'D'. For verification, the thermal gradient of T-shaped Mg alloys was examined under various EPT conditions. The points C exhibited higher temperatures compared to those at points D at a given electric current density, because only the former received both thermal and athermal effects. It was confirmed from twelve specimens that the point C at an electric current density of 65 A·mm^-2 and point D at 70 A·mm^-2 exhibited similar temperatures. This developed method is expected to reduce measurement errors in distinguishing thermal and athermal effects, thus providing a deeper understanding of their quantitative contributions in future studies.

• 한국진공학회지
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• 제9권2호
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• pp.136-143
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• 2000

RF magnetron sputtering법으로 $SrBi_2Ta_2O_9$ (SBT)박막을 상온에서 p-type Si(100) 기판위에 증착하여 DRO 강유전체 메모리(destructive read out ferroelectric random access memory)에 사용되는 강유전체막으로 Pt/SBT/Pt/Ti/$SiO_2$/Si (MFM)구조의 응용가능성을 확인하였다. 구조적인 특징들이 열처리 시간의 변화와 Ar/$O_2$의 가스 유량비의 변화에 따라서 XRD(x-ray diffractometer)에 의해 관찰되었으며 표면 특성은 FE-SEM(field emission scanning electron microscopy)에 의해서 관찰하고 박막의 전기적 특성들은 P-V(polarization-voltage measurement)와 I-V(current-voltage measurement)를 사용하여 관찰하였다. 스퍼터링 증착시 Ar/$O_2$의 가스 유량비는 1:4에서 4:1까지 변화 시켰고 SBT박막은 상온에서 증착시켰다. XRD 측정시 박막들은 SBT의 (105), (110) peak들을 나타내었다. 상온에서 증착시킨 박막은 1시간, 2시간 동안 산소 분위기에서 $800^{\circ}C$ 열처리를 하여 결정화 시켰다. SBT 박막의 P-V곡선은 이력 곡선의 모양을 갖추었으며 비대칭적인 강유전체 특성을 나타내었다. Ar/$O_2$ 가스유량비가 1 : 1, 2 : 1인 경우에 박막의 누설 전류밀도 값이 제일 좋았으며, 그 값은 3V 5V 7V에서 각각 $3.11\times10^{-8} \textrm{A/cm}^2$, $5\times10^{-8}\textrm{A/cm}^2$, $7\times10^{-8}\textrm{A/cm}^2$ 이었다. 열처리 시간을 2시간으로 증가시킨 후, 그들의 전기적 특성과 결정화특성이 개선됨을 확인하였다. AES 분석 및 EPMA분석으로 SBT박막의 깊이 분포 및 조성을 확인하였다.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2010년도 임시총회 및 하계학술연구발표회
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• pp.79-79
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• 2010

Semimetallic bismuth (Bi) has been extensively investigated over the last decade since it exhibits very intriguing transport properties due to their highly anisotropic Fermi surface, low carrier concentration, long carrier mean free path l, and small effective carrier mass $m^*$. In particular, the great interest in Bi nanowires lies in the development of nanowire fabrication methods and the opportunity for exploring novel low-dimensional phenomena as well as practical application such as thermoelectricity[1]. In this work, we introduce a self-assembled interconnection of nanostructures produced by an on-film formation of nanowires (OFF-ON) method in order to form a highly ohmic Bi nanobridge. A Bi thin film was first deposited on a thermally oxidized Si (100) substrate at a rate of $40\;{\AA}/s$ by radio frequency (RF) sputtering at 300 K. The sputter system was kept in an ultra high vacuum (UHV) of $10^{-6}$ Torr before deposition, and sputtering was performed under an Ar gas pressure of 2m Torr for 180s. For the lateral growth of Bi nanowires, we sputtered a thin Cr (or $SiO_2$) layer on top of the Bi film. The Bi thin films were subsequently put into a custom-made vacuum furnace for thermal annealing to grow Bi nanowires by the OFF-ON method. After thermal annealing, the Bi nanowires cannot be pushed out from the topside of the Bi films due to the Cr (or $SiO_2$) layer. Instead, Bi nanowires grow laterally as a mean s of releasing the compressive stress. We fabricated a self-assembled Bi nanobridge (d=192 nm) device in-situ using OFF-ON through annealing at $250^{\circ}C$ for 10hours. From I-V measurements taken on the Bi nanobridge device, contacts to the nanobridge were found highly ohmic. The quality of the Bi nanobridge was also proved by the high MR of 123% obtained from transverse MR measurements. These results manifest the possibility of self-assembled nanowire interconnection between various nanostructures for a variety of applications and provide a simple device fabrication method to investigate transport properties on nanowires without complex patterning and etching processes.

• 한국산학기술학회논문지
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• 제21권3호
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• pp.576-584
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• 2020

압출기 스크류 소재는 주로 냉간 금형 공구강(SKD11)이 사용되고 있는데, 최근 합성 수지의 발달로 화학적 부식 및 마모 발생이 증가하고 있다. 이를 개선하기 위해 내마모성과 내식성이 우수한 고크롬 주철의 사용이 요구되지만, 난가공성으로 사용이 기피되고 있다. 본 연구에서는 고크롬 합금의 난가공성을 개선하기 위해 Fe-23Cr-2.5C-1.2Si-1.08Mn-0.48Mo-0.3V 조성의 고크롬 주철에 가공성이 우수한 니켈을 0, 0.5, 1.0, 1.5 % 첨가하여 주조하고 열처리를 진행한 후, 선삭 시험과 동전위 분극 시험을 통해 니켈이 피삭성 및 내식성에 미치는 영향을 분석하여 SKD11과 비교하였다. 고크롬 주철은 고주파 진공유도용해로를 사용하여 주조하고, 이후 750 ℃에서 5시간 동안 풀림 처리와 풀림 처리 후 1100 ℃에서 5시간동안 재열처리를 실시하였다. 750 ℃ 풀림 처리 후 선삭 시험을 실시한 결과 니켈의 함량이 1.0% 이상에서 피삭성은 현저히 향상되었다. 5% NaCl 용액에서 동전위 분극 시험 결과 주방상태와 750 ℃ 풀림 처리에서는 니켈의 함량이 증가할수록 내식성은 저하되었으나, 1100 ℃ 재열처리 후에는 1.5% 니켈에서 가장 우수한 내식성을 나타냈다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.75.2-75.2
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• 2010

We studied the fabrication of polycrystalline silicon (pc-Si) films as seed layers for application of pc-Si thin film solar cells, in which amorphous silicon (a-Si) films in a structure of glass/Al/$Al_2O_3$/a-Si are crystallized by the aluminum-induced layer exchange (ALILE) process. The properties of pc-Si films formed by the ALILE process are strongly determined by the oxide layer as well as the various process parameters like annealing temperature, time, etc. In this study, the effects of the oxide film thickness on the crystallization of a-Si in the ALILE process, where the thickness of $Al_2O_3$ layer was varied from 4 to 50 nm. For preparation of the experimental film structure, aluminum (~300 nm thickness) and a-Si (~300 nm thickness) layers were deposited using DC sputtering and PECVD method, respectively, and $Al_2O_3$ layer with the various thicknesses by RF sputtering. The crystallization of a-Si was then carried out by the thermal annealing process using a furnace with the in-situ microscope. The characteristics of the produced pc-Si films were analyzed by optical microscope (OM), scanning electron microscope (SEM), Raman spectrometer, and X-ray diffractometer (XRD). As results, the crystallinity was exponentially decayed with the increase of $Al_2O_3$ thickness and the grain size showed the similar tendency. The maximum pc-Si grain size fabricated by ALILE process was about $45{\mu}m$ at the $Al_2O_3$ layer thickness of 4 nm. The preferential crystal orientation was <111> and more dominant with the thinner $Al_2O_3$ layer. In summary, we obtained a pc-Si film not only with ${\sim}45{\mu}m$ grain size but also with the crystallinity of about 75% at 4 nm $Al_2O_3$ layer thickness by ALILE process with the structure of a glass/Al/$Al_2O_3$/a-Si.

• 한국결정성장학회지
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• 제15권1호
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• pp.1-9
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• 2005

AgGaS₂ 단결정 박막을 수평 전기로에서 합성한 AgGaS₂ 다결정을 증발원으로하여, hot wall epitaxy(HWE) 방법으로 증발원과 기판(반절연성-GaAs(100))의 온도를 각각 590℃, 440℃로 고정하여 성장하였다. 이때 단결정 박막의 결정성은 광발광 스펙트럼과 이중결정 X-선 요동곡선(DCRC)으로 부터 구하였다. AgGaS₂의 광흡수 스펙트럼으로부터 구한 온도에 의존하는 에너지 밴드갭 E/sub g/(T)는 Varshni 공식에 fitting한 결과 E/sub g/(T) = 2.7284 eV - (8.695×10/sup -4/ eV/K)T²/(T + 332 K)를 잘 만족하였다. 성장된 AgGaS₂ 단결정 박막을 Ag, Ga, S 분위기에서 각각 열처리하여 10K에서 photoluminescience(PL) spectrum을 측정하여 점 결함의 기원을 알아보았다. PL 측정으로 부터 얻어진 V/sub Ag/, V/sub s/, Ag/sub int/, 그리고 S/sub int/는 주개와 받개로 분류되어졌다. AgGaS₂ 단결정 박막을 Ag 분위기에서 열처리하면 n형으로 변환됨을 알 수 있었다. 또한, Ga 분위기에서 열처리하면 열처리 이전의 PL 스펙트럼을 보이고 있어서. AgGaS₂ 단결정 박막에서 Ga은 안정된 결합의 형태로 있기 때문에 자연 결함의 형성에는 관련이 없음을 알았다.

• 한국진공학회지
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• 제21권1호
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• pp.12-16
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• 2012

Top-Emitting OLED (Organic Light-Emitting Diode) 디스플레이에서는 반사율이 가장 높은 Ag (silver) 박막이 쓰이고 있지만, 소자에서 요구되는 일함수(work function)가 상대적으로 낮기 때문에 전극과 유기물간에 에너지 장벽이 발생하여 발광효율을 낮추는 요인이 되고 있다. 본 논문에서는 Ag 전극의 일함수를 높이기 위한 연구를 진행하였으며, 박막 형태의 Ag 전극에 대하여 nanotribology 접근법으로 연구를 실행하였다. Ag는 rf magnetron sputter를 이용해 glass 위에 증착한 후 furnace에서 $300^{\circ}C$, 30분간 대기 중에서 열처리하였고, 또 다른 시료는 표면에 산소 상압플라즈마로 처리 시간(30, 60, 90, 120s)을 각기 다르게 하여 시료를 제조하였다. Ag 전극을 nanoindentation을 통해 국부 영역에 대한 물리적 특성의 변화를 측정하였고, Kelvin probe force microscopy을 이용해 시료 표면의 포텐셜을 측정했다. 그 결과 열처리한 시료의 포텐셜값은 가장 크게 증가하였지만 균일도가 낮아졌다. 120s 플라즈마 처리한 시료는 불완전한 산화막의 생성으로 인해 탄성계수 및 경도값과 박막의 Weibull modulus를 극히 낮게 만들었지만, 60s, 90s 플라즈마 처리는 시료의 균일도를 높이고 또한 포텐셜을 증가시켜 T-OLED 성능 개선에 좋은 영향을 미치게 될 것이다.