• Title/Summary/Keyword: fracture Toughness

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Constraint Loss Assessment of SA508 PCVN Specimen according to Crack depth (SA508 PCVN 시편의 균열깊이에 따른 구속력 손실 평가)

  • Park, Sang-Yun;Lee, Ho-Jin;Lee, Bong-Sang
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.161-166
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    • 2008
  • In general structures, cleavage fracture may develop under the low constraint condition of larger scale yielding with a shallow surface crack. However, standard procedures for fracture toughness testing require very severe restrictions of specimen geometry. So the standard fracture toughness data makes the integrity assessment irrationally conservative. In this paper, cleavage fracture toughness tests have been made on side-grooved PCVN (precracked charpy V-notch) type specimens (10 by 10 by 55 mm) with varying crack depth, The constraint effects on the crack depth ratios are quantitatively evaluated by scaling model and Weibull stress method using 3-D finite clement method, After correction of constraint loss due to shallow crack depths, the statistical size effect are also corrected according to the standard ASTM E 1921 procedure, The results snowed a good agreement in the geometry correction regardless of the crack size, while some over-corrections were observed in the corrected values of $T_0$.

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A Study on the Dynamic Fracture Toughness of Welding Structural Steels by Instrumented Impact Testing (계장화 충격시험법에 의한 구조용강 용접부의 동적 파괴인성에 관한 연구)

  • 김헌주;김경민;윤의박
    • Journal of Welding and Joining
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    • v.11 no.1
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    • pp.42-51
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    • 1993
  • In this study, investigations were conducted in calculating parameters of elastic-plastic fracture mechanics using single specimen. The validity of these testing methods was judged by the confirmation of multiple specimen method of stop block test. The results were as follows: In order to measure a fracture toughness using the instrumented impact test, two general requirement must be considered; One, setting up proper impact velocity considered the effect of loading and the other, the necessity of low blow test for obtaining true energy by the compliance correction. It was possible to detect a crack initiation point by calculating the compliance changing rate from a load-defection curve. Criterion of a stable crack growth, $T_{mat}$ could be estimated by using key-curve method for a base metal. and combining Kaiser's rebound compliance with Paris-Hutchison's $T_{appl}$ equation for the brittled zone of welding heat affected.at affected.d.

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Temperature Effects on Fracture Toughness Parameters for Pipeline Steels

  • Chanda, Sourayon;Ru, C.Q.
    • International journal of steel structures
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    • v.18 no.5
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    • pp.1754-1760
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    • 2018
  • The present article showcases a temperature dependent cohesive zone model (CZM)-based fi nite element simulation of drop weight tear test (DWTT), to analyse fracture behavior of pipeline steel (PS) at different temperatures. By co-relating the key CZM parameters with known mechanical properties of PS at varying temperature, a temperature dependent CZM for PS is proposed. A modified form of Johnson and Cook model has been used for the true stress-strain behavior of PS. The numerical model, using Abaqus/CAE 6.13, has been validated by comparing the predicted results with load-displacement curves obtained from test data. During steady-state crack propagation, toughness parameters (such as CTOA and CTOD) were found to remain fairly constant at a given temperature. These toughness parameters, however, show an exponential increase with increase in temperature. The present paper offers a plausible approach to numerically analyze fracture behavior of PS at varying temperature using a temperature dependent CZM.

Application of Work Factor to Determine Fracture Toughness of Unidirectional Graphite/Epoxy Composites under Hydrostatic Pressure (정수압을 받는 일방향 탄소섬유/에폭시 복합재의 파괴인성 결정을 위한 일인자 적용)

  • 이경엽
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2001.05a
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    • pp.46-49
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    • 2001
  • In this paper. tile validity of work factor approach was investigated to determine compressive fracture toughness of unidirectional graphite/epoxy composites under hydrostatic pressure environment. The elastic work factor was determined under various pressures as a function of delamination length. It was found that elastic work factor was not affected by hydrostatic pressure.

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Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package (반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용)

  • 김경섭;신영의;장의구
    • Electrical & Electronic Materials
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    • v.10 no.6
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    • pp.519-527
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    • 1997
  • The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

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Mode III Fracture Toughness of Single Layer Graphene Sheet Using Molecular Mechanics (분자역학을 사용한 단층 그래핀 시트의 모드 III 파괴인성)

  • Nguyen, Minh-Ky;Yum, Young-Jin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.2
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    • pp.121-127
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    • 2014
  • An atomistic-based finite bond element model for predicting the tearing mode (mode III) fracture of a single-layer graphene sheet (SLGS) is developed. The model uses the modified Morse potential for predicting the maximum strain relationship of graphene sheets. The mode III fracture of graphene under out-of-plane shear loading is investigated with extensive molecular mechanics simulations. Molecular mechanics is used for describing the displacements of atoms in the area near a crack tip, and linear elastic fracture mechanics is used outside this area. This work shows that the molecular mechanics method can provide a reliable and yet simple method for determining not only the shear properties of SLGS but also its mode III fracture toughness in the armchair and the zigzag directions; the determined mode III fracture toughness values of SLGS are $0.86MPa{\sqrt{m}}$ and $0.93MPa{\sqrt{m}}$, respectively.