• 제목/요약/키워드: flexible substrates

검색결과 382건 처리시간 0.032초

Simple Tools for Ink Jet Printing of Functional Fluids

  • Schoeppler, Martin W.;Creagh, Linda T.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1657-1659
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    • 2006
  • Success in moving ink jets into newer areas such as printing on to-be-defined flexible substrates or developing new functional fluids requires both process and fluid research and engineering. Today, leading-edge concepts are slow to be explored because of the expense and complexity of commercially available ink jet deposition systems, time and resources required to specify and acquire commercial ink jet systems and the expertise required to operate commercial ink jet systems.

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Fabrication of Conductive Patterns by Ink-Jet Prining of Copper Ink

  • Park, Bong-Kyun;Kim, Don-Jo;Jeong, Sun-Ho;Lee, Seul;Moon, Joo-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1382-1385
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    • 2006
  • We have studied ink-jet printing method for patterning of conductive line on flexible plastic substrates. Synthesized copper nano-particles of ${\sim}40\;nm$ were used for the conductive ink and the printed patterns exhibit a smooth line whose line width is about $100\;{\mu}m$.

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LSI Packaging Technologies for High-End Computers and Other Applications

  • Inoue, Tatsuo
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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    • pp.147-164
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    • 2001
  • 1. "MLS", state of the art MCM-D wiring substrate. 2. High pin-count LSl assembly. 3. Higher speed needs higher packaging density. 4. Wiring substrate, the key of LSl packaging device. 5. "Inter-Layer Transferability", a new index for the performance of wiring substrates. 6. "MLTF package", a core-less flexible package for high pin-count LSl.

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압전 나노발전기: 에너지 수확 기술 (Piezoelectric Nanogenerators: Energy Harvesting Technology)

  • 신동명;황윤회
    • 진공이야기
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    • 제3권2호
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    • pp.17-20
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    • 2016
  • Piezoelectric nanogenerators are energy harvesting device to convert a mechanical energy into an electric energy using nanostructured piezoelectric materials. This review summarizes works to date on piezoelectric nanogenerators, starting with a basic theory of piezoelectricity and working mechanism, and moving through the reports of numerous nanogenerators using nanorod arrays, flexible substrates and alternative materials. A sufficient power generated from nanogenerators suggests feasible applications for either power supplies or strain sensors of highly integratedl nano devices. Further development of nanogenerators holds promise for the development of self-powered implantable and wearable electronics.

Advances in Microplasma Technologies for Display Applications

  • Park, Sung-Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.333-336
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    • 2009
  • A series of microcavity plasma devices having various electrode geometries were investigated for the display and lighting applications. Addressable, self-assembled Al/$Al_2O_3$ electrodes were fabricated in a thin, flexible single sheet of Al foil. And, enhanced luminance and efficient microplasmas are achieved by precise control of the cross-sectional geometry and surface morphology of the cavities within the microplasma devices. New microdischarge system fabricated in various substrates will be introduced.

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기포 제거 공정을 통한 유연한 디스플레이 합착 면의 투과율 및 접착력 향상 (Enhancement of Transmittance and Adhesion of Flexible Display Adhesion Surface by Bubble Removing Process)

  • 김정수;장경수;;박희준;신동기;이윤정;이준신
    • 한국전기전자재료학회논문지
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    • 제31권5호
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    • pp.330-334
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    • 2018
  • With the development of the Internet of Things, the use of flexible displays has become widespread. In particular, the use of curved, bendable, and rollable displays is increasing. Flexible display production processes include various important components such as lamination material, flexible substrates, and adhesives. Among them, improvement of the lamination process comprises a large proportion of efforts for further development. In this paper, we attempt to improve the transmittance of the display substrate by performing a bubble removal process after adhesion. The transmittance of the glass substrate with the bubble removal process was 5~12% higher than that of the substrate without the bubble removal process. The fill-strength after the bubble removal process was improved by 21.4%, and the shear-strength was improved by 43.9%.

Direct Transfer Printing of Nanomaterials for Future Flexible Electronics

  • 이태윤
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.3.1-3.1
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    • 2011
  • Over the past decade, the major efforts for lowering the cost of electronics has been devoted to increasing the packaging efficiency of the integrated circuits (ICs), which is defined by the ratio of all devices on system-level board compared to the area of the board, and to working on a larger but cheaper substrates. Especially, in flexible electronics, the latter has been the favorable way along with using novel nanomaterials that have excellent mechanical flexibility and electrical properties as active channel materials and conductive films. Here, the tool for achieving large area patterning is by printing methods. Although diverse printing methods have been investigated to produce highly-aligned structures of the nanomaterials with desired patterns, many require laborious processes that need to be further optimized for practical applications, showing a clear limit to the design of the nanomaterial patterns in a large scale assembly. Here, we demonstrate the alignment of highly ordered and dense silicon (Si) NW arrays to anisotropically etched micro-engraved structures using a simple evaporation process. During evaporation, entropic attraction combined with the internal flow of the NW solution induced the alignment of NWs at the corners of pre-defined structures. The assembly characteristics of the NWs were highly dependent on the polarity of the NW solutions. After complete evaporation, the aligned NW arrays were subsequently transferred onto a flexible substrate with 95% selectivity using a direct gravure printing technique. As proof-of-concept, flexible back-gated NW field effect transistors (FETs) were fabricated. The fabricated FETs had an effective hole mobility of 0.17 $cm2/V{\cdot}s$ and an on/off ratio of ${\sim}1.4{\times}104$. These results demonstrate that our NW gravure printing technique is a simple and effective method that can be used to fabricate high-performance flexible electronics based on inorganic materials.

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PDMS 충진법을 이용하여 형성한 유연열전모듈의 발전특성과 굽힘특성 (Power Generation Properties and Bending Characteristics of a Flexible Thermoelectric Module Fabricated using PDMS Filling Method)

  • 한기선;오태성
    • 마이크로전자및패키징학회지
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    • 제26권4호
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    • pp.119-126
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    • 2019
  • 18쌍의 Bi2Te3계 p-n 가압소결체 열전레그들로 구성되어 있으며 상하부 기판이 없고 내부는 polydimethylsiloxane (PDMS)로 충진되어 있는 유연열전모듈을 형성하고, 이의 발전특성과 굽힘특성을 분석하였다. 유연열전모듈을 팔목에 부착하였을 때 서있는 정적인 상태에서는 2.23 mV의 open circuit 전압과 1.69 ㎼의 최대출력전력이 얻어졌으며, 걸어가는 동적인 상태에서는 3.32 mV의 open circuit 전압과 3.41 ㎼의 최대출력전력이 얻어졌다. 유연열전모듈에 굽힘곡률반경 25 mm로 30,000회까지 반복굽힘 싸이클을 인가하여도 저항변화율이 1% 미만으로 유지되었다.

유한요소해석을 통한 유연기판 위의 금속 박막의 최대 굽힘 변형률 예측 (Prediction of Maximum Bending Strain of a Metal Thin Film on a Flexible Substrate Using Finite Element Analysis)

  • 이종협;김영천
    • 마이크로전자및패키징학회지
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    • 제31권1호
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    • pp.23-28
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    • 2024
  • 유연소자를 이용한 전자제품은 실사용환경에서 가혹한 기계적 변형을 경험한다. 이에 따라 유연소자의 기계적 신뢰성에 대한 연구가 많은 연구자들의 관심을 받고 있다. 본 연구에서는 유연기판에 증착된 금속 박막의 최대 굽힘 변형률을 예측하기 위하여 기존에 사용하는 굽힘 변형률 모델과 유한요소해석을 이용하였다. 박막의 소재 및 두께, 기판의 두께를 달리하여 유한요소해석으로 굽힘 실험을 모사하였고, 기존 모델로 예측된 변형률과 해석결과를 서로 비교하였다. 굽힘 변형 시 박막 첨단과 주위의 변형률 분포를 확인하였고, 굽힘 정도에 따른 기존 모델의 오차율을 정리하였다. 신규수학적 모델을 제시하여 각 경우의 수에 따른 상수를 제시하였다.

$CeO_2$의 상전이에 따른 YBCO 박막의 결정성 및 특성의 변화 (Change of crystallization and properties of YBCO thin film by phase transition of $CeO_2$)

  • 김성민;이상렬
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 D
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    • pp.1590-1592
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    • 1999
  • We have fabricated good quality superconducting $YBa_2Cu_3O_{7-{\delta}}$ thin films on Hastelloy(Ni-Cr-Mo alloys) with $CeO_2$ buffer layers by in-situ pulsed laser deposition in a multi-target processing chamber. Using one of electrical properties of YBCO superconducting which the resistance approaches to zero dramatically on transition temperature, we have researched to make power transmission line, we have deposited YBCO thin film on flexible metallic substrate. However, it is difficult to make films on flexible metallic substrates due to both interdiffusion problem between metallic substrate and superconducting layer and non-crystallization of YBCO on amorphous substrate. From early research, two ways-using textured metallic substrate and buffer layer-were proposed to overcome theses difficulties. We have chosen $CeO_2$ as a buffer layer which has cubic structure of $5.41{\AA}$ lattice parameter and only 0.2% of lattice mismatch with $3.82{\AA}$ of a-axis lattice parameter of YBCO on (110) direction of $CeO_2$. In order to enhance the crystallization of YBCO films on metallic substrates we deposited $CeO_2$ buffer layers at varying temperature $700^{\circ}C$ to $800^{\circ}C$ and $O_2$ pressure. By X-ray diffraction, we found that each domination of (200) and (111) orientations were strongly relied upon the deposition temperature in $CeO_2$ layer and the change of the domination of orientation affects the crystallization of YBCO upper layer.

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