• Journal of Sensor Science and Technology
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• v.32 no.6
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• pp.386-390
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• 2023

Stiffness-engineered stretchable substrate technology has been widely used to produce stretchable displays, transistors, and integrated circuits because it is compatible with various flexible electronics technologies. However, the stiffness-engineering technology has never been applied to transistor-based stretchable strain sensors. In this study, we developed thin-film transistor-based strain sensors on stiffness-engineered stretchable substrates. We designed and fabricated strain-sensitive stretchable resistors capable of inducing changes in drain currents of transistors when subjected to stretching forces. The resistors and source electrodes of the transistors were connected in series to integrate the developed stretchable resistors with thin-film transistors on stretchable substrates by printing the resistors after fabricating transistors. The thin-film transistor-based stretchable strain sensors demonstrate feasibility as strain sensors operating under strains of 0%-5%. This strain range can be extended with further investigations. The proposed stiffness-engineering approach will expand the potential for the advancement and manufacturing of innovative stretchable strain sensors.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.637-640
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• 2006

DuPont Teijin Films (DTF) have developed engineered substrates specifically for the flexible electronics market. $Teonex^{(R)}Q65$ is a biaxially oriented crystalline polyester with a tailored surface and it is emerging as a competitive material for the base substrate in OLED displays and active matrix backplanes. Given the dimensional reproducibility requirements in the display applications, uncontrolled moisture absorption during the processing cycle could potentially be far more significant than the inherent shrinkage of the base substrate. Understanding these effects and optimising the processing steps involved in device manufacture will be critical to achieving the ultimate performance that can be achieved with the base substrate.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.641-643
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• 2006

Add-Vision has developed a low-cost print technology for P-OLED displays on flexible substrates that meets several essentials for a new technology including: (1) Functionality including low DC voltage and wide color gamut; (2) Utilization of inexpensive tools; (3) Performance matching entry applications and markets. AVI's process is based on large-area printing of a combination of doped emissive and air-stable cathode inks utilizing truly low-cost tools to create printed P-OLEDs.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1539-1543
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• 2006

We have developed self-aligned imprint lithography (SAIL) technology, an innovative method for roll-to-roll (R2R) fabrication of electronic devices on flexible plastic substrates. In this paper, we present the first R2R-produced ${\alpha}$-Si TFTs built on a polyimide substrate using the SAIL process, and prove the feasibility of this technology to enable R2R fabrication of flexible display active matrix (AM) backplanes with high precision and throughput.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1189-1192
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• 2006

We have demonstrated the novel technique for spacing two flexible substrates in stable by using rigid pillar spacer array and micro-contact printing assembling technique. Specially designed columnar structure generates self-collected adhesive polymer feature results in a good adhesion and a high mechanical stability to the external bending deformations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.185-189
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• 2002

Flexible displays such as plastic based LCDs and organic light-emitting diodes for mobile communication devices have been researched and developed at KETI in KOREA since 1997. The Plastic film substrate has so poor thermal tolerance and non-rigidness that the fabrication of active devices and panel assembly have to perform at low temperature and pressure. In addition, high thermal expansion of the substrate is also a serious problem for reliable metallic film deposition. In this paper, we investigated particularly on the fundamental characteristics of various plastic substrates and then, suggested novel methods that improve the fabrication processes of plastic LCD panel. In order to maintain stable substrate surface and uniform cell gap during panel assembly, we utilized newly-invented iii and vacuum chuck. Electro-optical characteristics of fabricated plastic LCD are better than or equivalent to those of typical glass based LCDs though it is thinner, lighter-weight and more robust.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.25-28
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• 2000

In this paper, three types of organic electroluminescent devices(OELD) were fabricated on mechanically flexible plastic substrate by using vacuum deposition method. The devices consist of a hole transporting material such as TPD, a light-emitting material such as Alq$\sub$3/ and an electron transporting material, blocking material such as PBD. Electrical and optical properties of these OELDs were measured. This paper shows that organic small molecules based on OELD can be successfully deposited on a flexible plastic substrate. This points open the potential for low cost mass production of flexib]e displays, including roll to roll processing.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1553-1555
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• 2008

Super-hydrophobic treated Polyimide film was used as a flexible substrate for developing a new method of metallization. Hydrophilic patterns were fabricated by IN irradiation through shadow mask. Patterned super-hydrophobic substrate was dipped into a bath containing silver nano ink Silver ink was only coated on hydrophilic patterned area. Metal lines of $600{\mu}m$ pitch were fabricated successfully. However, their thickness was too thin to serve as interconnection. To overcome this problem, iterative dipping was conducted. After repeating five times, the thickness of silver metal lines were increased to over than $2{\mu}$. After heat treatment of silver lines, their resistivities were reduced to order of $30{\mu}{\Omega}$-cm the similar level of values reported in other literatures. So, a new method of metallization has high potential for application of RFID antenna and flexible electronics substrates.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.475-475
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• 2014

Dye sensitized solar cells (DSSCs) are regarded as potential inexpensive alternatives to conventional solid-state devices. The flexible version, employing conductive-plastic-film substrates, is appealing for commercialization of DSSCs because it not only reduces the weight and cost of the device but also extends their applications. However, the need for high temperature does not permit the use of plastic-film substrate. So, development of low-temperature methods is therefore realization of flexible DSSCs. In this work, the electrophoretic deposition combined with hydrothermal treatment was employed to prepare nanocrystalline $TiO_2$ thin film at low temperature. We confirmed the prepared $TiO_2$ thin films with different voltages and deposition times in the electrophoretic deposition process. Properties of the $TiO_2$ films were investigated by various analysis method such as X-ray diffraction, field emission scanning electron microscopy (FESEM) and UV-visible spectrophotometer.

• Applied Science and Convergence Technology
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• v.26 no.1
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• pp.16-19
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• 2017

A thin metal layer of molybdenum is placed between the conventional barrier layer and the stainless steel substrate for investigating the diffusion property of iron (Fe) atoms. In this study, the protection probability was confirmed by measuring the concentration of out-diffused Fe using a SIMS depth profile. The Fe concentration of chromium (Cr) barrier layer with 10 nm molybdenum (Mo) layer is 5 times lower than that of Cr barrier without the thin Mo layer. The insertion of a thin Mo metal layer between the barrier layer and the stainless steel substrate effectively protects the out-diffusion of Fe atoms.