• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.383-383
• /
• 2011

We fabricated thermal annealing-free polymer solar cells (PSC) by processing with additive and applied to flexible substrates. The 1, 8-Diiodooctane of 3 vol% blended with active solution resulted in enhancement of $J_{SC}$ due to increase of light absorption and hole mobility as improving the crystallinity of P3HT. In addition, the $V_{OC}$ of PSCs with additive was improved by inserting $TiO_2$ layer without any treatment. The $TiO_2$ layer prevented the direct contact between active layer and Al electrode and reduced the charge recombination near Active/Al interface. It was confirmed by calculation of J0 and photo-voltage transient measurement. The power conversion efficiencies of annealing-free PSCs using additive for ITO glass and flexible (ITO PEN) substrate were obtained 3.03% and 2.45%, respectively.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2005.07a
• /
• pp.614-615
• /
• 2005

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, roll-to-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate ($LEXAN^{(R)}$) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen,chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate ($LEXAN^{(R)}$) films and its compatibility with OLED device fabrication processes.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.445-446
• /
• 2007

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

• Applied Science and Convergence Technology
• /
• v.23 no.2
• /
• pp.90-96
• /
• 2014

Flexible $ZrO_2$ films as dielectric materials for high-energy-density capacitors were deposited on polyethylene terephthalate (PET) substrates by RF magnetron sputtering. The growth behavior, microstructure and electrical properties of the flexible $ZrO_2$ films were dependent on the sputtering pressure and gas ratio. Although $ZrO_2$ films were deposited at room temperature, all films showed a tetragonal crystalline structure regardless of the sputtering variables. The surface of the film became a surface with large white particles upon an increase in the $O_2/Ar$ gas ratio. The RMS roughness and crystallite size of the $ZrO_2$ films increased with an increase in the sputtering pressure. The electrical properties of the $ZrO_2$ films were affected by the microstructure and roughness. The $ZrO_2$ films exhibited a dielectric constant of 21~38 at 1 kHz and a leakage current density of $10^{-6}{\sim}10^{-5}A/cm^2$ at 300 kV/cm.

• Journal of Electrical Engineering and Technology
• /
• v.7 no.6
• /
• pp.954-958
• /
• 2012

This paper reports a flexible patch rectenna for wireless actuation of cellulose electro-active paper actuator (EAPap). The patch rectenna consists of rectifying circuit layer and ground layer, which converts microwave to dc power so as to wirelessly supply the power to the actuator. Patch rectennas are designed with different slot length at the ground layer. The fabricated devices are characterized depending on different substrates and polarization angles. The EAPap integrated with the patch rectenna is actuated by the microwave power. Detailed fabrication, characterization and demonstration of the integrated rectenna-EAPap actuator are explained.

• Bulletin of the Korean Chemical Society
• /
• v.32 no.spc8
• /
• pp.3074-3080
• /
• 2011

We synthesized three novel poly(norbornene bisimide)s by ring opening metathesis polymerization (ROMP) and subsequent hydrogenation. Their thermal, mechanical and optical properties were investigated with TGA, DMA, UV-Vis spectrometer, and optical reflectometer. The new polymers showed high glass transition temperatures over $260^{\circ}C$ and good thermal stability with 5% wt-loss temperature higher than $390^{\circ}C$. When solvent casted, they yielded optically transparent and dimensionally stable films with a relatively low coefficient of thermal expansion of about 50 ppm $K^{-1}$. Therefore, the bisimide moieties substantially enhanced thermal and dimensional stabilities, as compared with normal ROMP-prepared polynorbornene films. Though the water uptake was increased to 0.6 wt-%, this water uptake is still considerably lower than that for polyethersulfones (1.4 wt-%) or polyimides (2.0 wt-%). Hence, the new poly(norbornene bisimide)s may become attractive candidates for flexible substrates of optoelectronic devices such as displays and photovoltaic solar cells.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2004.08a
• /
• pp.41-43
• /
• 2004

Plasma polymerized para-xylene ($PP_PX$) deposited by plasma-enhanced chemical vapor deposition (PECVD) was used as the barrier layer on the polyethylene terephthalate (PET) substrate to improve lifetime of the flexible organic light-emitting diodes (FOLEDs). The $PP_PX$ barrier layer deposited on top of the PET substrate with plasma power of 30 W at deposition pressure of 0.2 torr showed transmittance spectra good enough to be applied in FOLED on PET substrates. FOLEDs with the $PP_PX$ barrier layer (barrier-FOLEDs) showed similar I-V and B-V characteristics to FOLEDs without the $PP_PX$ layer (control-FOLEDs). The lifetime of barrier-FOLED was two times longer than that of the control-FOLED. With $PP_PX$ passivation layers, lifetimes of both control and barrier-FOLEDs were improved by more than 4 times. These results show that PECVD deposited $PP_PX$ layers can be used as barrier layers for FOLEDs on plastic substrates as well as passivation layers for general OLEDs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.11a
• /
• pp.506-509
• /
• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with in-situ photoalignment method on polyimide (PI) surfaces using thin plastic substrates. The LC aligning capabilities and pretilt angle of the thin plastic substrates by in-situ photoalignment method were better than that of the glass substrate by general photoalignment. Also, the LC pretilt angle increased with increasing heating temperature and exposure time. And EO characteristics of photoaligned TN-LCDs using in-situ photodissociation method on glass substrate and on plastic substrate are also excellent.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07a
• /
• pp.199-202
• /
• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on two kinds of polyimide (PI) surfaces using thin plastic substrates. The generated NLC pretilt angles on the pre-imidized type PI are about $3.8^{\circ}$ by the rubbing alignment method with thin plastic substrates, However, the pretilt angle measured at about $2.8^{\circ}$ lower on the polyamic acid type PI than by pre-imidized type PI surface with thin polymer film. The tilt angle increases as increasing curring temperature for making polyimide layer using polyamic acid type PI. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.287-287
• /
• 2010

We report a new direct patterning method, called liquid bridge-mediated nanotransfer molding (LB-nTM), for the formation of two- or three-dimensional structures with feature sizes between tens of nanometers and tens of micron over large areas. LB-nTM is based on the direct transfer of various materials from a mold to a substrate via a liquid bridge between them. This procedure can be adopted for automated direct printing machines that generate patterns of functional materials with a wide range of feature sizes on diverse substrates. Arrays of TIPS-PEN TFTs were fabricated on 4" polyethersulfone (PES) substrates by LB-nTM using PDMS molds. An inverted staggered structure was employed in the TFT device fabrication. A 150 nm-thick indium-tin oxide (ITO) gate electrode and a 200 nm-thick SiO2dielectric layer were formed on a PES substrate by sputter deposition. An array of TIPS-PEN patterns (thickness: 60 nm) as active channel layers was fabricated on the substrate by LB-nTM. The nominal channel length of the TIPS-PEN TFT was 10 mm, while the channel width was 135 mm. Finally, the source and drain electrodes of 200 nm-thick Ag were defined on the substrate by LB-nTM. The TIPS-PEN TFTs can endure strenuous bending and are also transparent in the visible range, and therefore potentially useful for flexible and invisible electronics.