• Journal of Convergence Korean Medicine
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• v.2 no.1
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• pp.5-12
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• 2021

Objectives: The purpose of this study is to fabricate an ultra-fine ginsenoside particle atomizer that can provide a new treatment method by delivering ginsenoside components that have a therapeutic effect on respiratory diseases directly to the lungs. Methods: We fabricated the AAO vibrating mesh by using the micromachining process. The starting substrate of an AAO wafer has a 350nm pore diameter with 50㎛ thickness. A photomask having several 5㎛ opening holes with a 100㎛ pitch was used to separate each nanopore nozzle. The photoresist structure was optimized to pattern the nozzle area during the lift-off process precisely. The commercial vibrating mesh was removed from OMRON's NE-U100 product, and the fabricated AAO vibrating mesh was installed. A diluted sample of 20mL with 30% red ginseng concentrate was prepared to atomize from the device. Results: As a result of liquid chromatography analysis before spraying the ginsenoside solution, ginsenoside components such as 20S-Rg3, 20R-Rg3, and Rg5 were detected. After spraying through the AAO vibrating mesh, ginsenosides of the same component could be detected. Conclusion: A nutrient solution containing ginsenosides was successfully sprayed through the AAO vibrating mesh with 350 nm selective pores. In particular, during the atomizing experiment of ginsenoside drug solution having excellent efficacy in respiratory diseases, it was confirmed that atomizing through the AAO vibrating mesh while maintaining most of the active ingredients was carried out.

• Journal of Digital Contents Society
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• v.16 no.2
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• pp.291-298
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• 2015

In a fast-paced information technology environment, consumption of video content is changing from one-way television viewing to VOD (Video on Demand) playing anywhere, anytime, on any device. This video-watching trend gives additional importance to videos with fine-speed-control, in addition to the strength of the digital video signal. Currently, many video players provide a fine-speed-control function which can speed up the video to skip a boring part, or slow it down to focus on an exciting scene. The audio information is just as important as the visual information for understanding the content of the speed-controlled video. Thus, a number of algorithms for fine-speed-control video-playing technologies have been proposed to solve the pitch distortion in the audio-processing area. In this study, well-known techniques for prosodic modification of speech signals, WSOLA (Waveform-Similarity-Based Overlap-Add), have been applied to analyze users' needs for fine-speed-control video playing. By surveying the users' preferred speeds on categorized video content and analyzing the results, this paper proposes that various fine-speed adjustments are needed to accommodate users' preferred video consumption.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.608-613
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• 2007

Fine pitch microprobe arrays are microneedle-like probes for inspecting the pixel of LCD panel. They are usually made of multilayers of metallic, nonmetallic, or combination of the two. In this study, the microprobe arrays were fabricated using the process applied for MEMS fabrication technology and they consist of BeCu, BeNi, or Si. Their contacting probing force and deflection were measured using the laser equipment. The design requirement are 5gf of a minimum contact force and $150{\mu}m$ of a maximum deflection. A lot of microprobe shape are possible satisfying the requirement. A double cantilever-type microprobe having needles on both ends were applied for this study. Several candidate were chosen using the topology and shape optimization technique subjected to the design requirements. Finite element results and experimental results were compared and both gave good correlation.

• International Journal of Aeronautical and Space Sciences
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• v.1 no.1
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• pp.70-80
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• 2000

The attitude knowledge error model is formulated for specifically KOMPSAT attitude determination system using the Lefferts/Markley/Shuster method, and the attitude determination(AD) error analysis is performed so as to investgate the on-board attitude determination capability of KOrea Multi-Purpose SATellite(KOMPSAT) using the covariance analysis method. Analysis results show there is almost no initial value effect on Attitude Determination (AD) error and the sensor noise effects on AD error are drastically decreased as is predicted because of the inherent characteristic of Kalman filter structure. However, it shows that the earth radiance effect of IR-sensor(earth sensor) and the bias effects of both IR-sensor and fine sun sensor are the dominant factors degrading AD error and gyro rate bias estimate error in AD system. Analysis results show that the attitude determination errors of roll, pitch and yaw axes are 0.056, 0.092 and 0.093 degrees, respectively. These numbers are smaller than the required values for the normal mission of KOMPSAT. Also, the selected on-orbit data of KOMPSAT is presented to demonstrate the designed AD system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.9
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• pp.798-802
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• 2005

The plating shape in the opening of photoresist becomes gradated shape in the fountain plating system, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. In this paper, the bubble flow from the wafer surface during plating process was studied and we designed the tilted electrode ring to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha-step$. In a-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were $\pm16.6\%,\;\pm4\%$ respectively.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.714-717
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• 2008

In this paper, we propose a three-dimensional (3D) integral imaging system using an elastic lens array instead of conventional rigid lens array. The lens array is made of polydimethylsiloxane (PDMS) that is optically transparent and flexible material. We can stretch the PDMS lens array to be expanded into a certain extent, and control the lens pitch of the system easily. That flexible design enables a fine 3D integral imaging display.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.347-350
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• 2003

Optimization of the luminance, luminous efficiency, and address voltage margin characteristics has been made on the delta color array PDP with various hexagonal shape subpixels. The optimal subpixel and electrode designs are obtained for the 42-inch high-definition PDP ($1,366{\times}768$) with the fine pixel pitch less than 0.7 mm. The hexagonal delta array structure shows more improved characteristics than that of the normal delta array structure with rectangular shape subpixels.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.120-125
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• 2008

A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.