• Design & Manufacturing
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• 제9권2호
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• pp.1-5
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• 2015

Recently, as small-sized display products such as mobile phones and digital cameras have become lighter and smaller, the size of electric signal delivery part, connector for the mobile display products, also, needs to become smaller, so high-density integration like shortening the distance between signal delivery media, conductors is necessary. With the micro and high-density integration of the connector, it is necessary to maintain contact to a certain degree for keeping intensity and delivering electric signal smoothly to prevent a defect with a specific impact. Accordingly, this study carried out a structural analysis according to the operating mechanisms of 0.16CHP Class Bottom Contact FPC Connector and 0.24CHP Class BTB Connector mostly used in small-sized mobile display products such as mobile phones and digital cameras. As a result of the analysis, both connectors had lower than 997MPa, yield strength of connector material C5240-XSH, so it is judged that permanent plastic deformation would not occur, and that a contact force between the connector and FPC film occurs to a certain degree, so that there would not be any defect in electric signal delivery.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.86-89
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• 2000

The detection technique both the polarization and the mobile charge density at the same time in ferroelectric films on Si using TVS method have been proposed. This method yields a polarizable and an ionic displacement current peaks whose areas are proportional to the total polarization reversal charge and the total moble ionic space charge, respectively. The calculated polarization and the mobile charge density were 0.42 [$\mu$C/$\textrm{cm}^2$] and 5.5$\times$10$^{11}$ (ions/$\textrm{cm}^2$) in the SBT film of MFIS structure measured at 25$0^{\circ}C$, and 1.4 [$\mu$C/$\textrm{cm}^2$] in the LiNbO$_3$ film of MFS structure measured at 30$0^{\circ}C$, respectively.

• 한국재료학회지
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• 제34권9호
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• pp.432-438
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• 2024

Cu-Ti thin films were fabricated using a combinatorial sputtering system to realize highly sensitive surface acoustic wave (SAW) devices. The Cu-Ti sample library was grown with various chemical compositions and electrical resistivity, providing important information for selecting the most suitable materials for SAW devices. Considering that acoustic waves generated from piezoelectric materials are significantly affected by the resistivity and density of interdigital transducer (IDT) electrodes, three types of Cu-Ti thin films with different Cu contents were fabricated. The thickness of the Cu-Ti thin films used in the SAW-IDT electrode was fixed at 150 nm. As the Cu content of the Cu-Ti films was increased from 31.2 to 71.3 at%, the resistivity decreased from 10.5 to 5.8 × 10^-5 ohm-cm, and the density increased from 5.5 to 7.3 g/cm³, respectively. A SAW device composed of Cu-Ti IDT electrodes resonated at exactly 143 MHz without frequency shifts, but the full width at half maximum (FWHM) values of the resonant frequency gradually increased as the Cu content increased. This means that although the increase in Cu content in the Cu-Ti thin film helps to improve the electrical properties of the IDT electrode, the increased density of the IDT electrode deteriorates the acoustic performance of SAW devices.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1986년도 하계학술대회논문집
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• pp.422-424
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• 1986

• 한국재료학회:학술대회논문집
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• 한국재료학회 2007년도 춘계학술발표대회 및 제12회 신소재 심포지엄
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• pp.37.1-37.1
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• 2007

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1994년도 추계연구발표회 논문개요집
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• pp.80-81
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• 1994

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2000년도 추계총회,초청강연,특별강연,연구발표회
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• pp.191.1-191
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• 2000

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 춘계학술발표강연 및 눈문개요집
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• pp.99-99
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• 1999

• 한국광학회지
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• 제11권4호
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• pp.261-264
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• 2000

은염 감광성 물질을 이용하여 연속적으로 광밀도가 변화하는 ND filter를 제작하였다. 이러한 filter는 레이저빔의 세기 분포를 변화시켜 원하는 세기 분포를 갖는 레이저빔을 얻을 수 있도록 한다. 광밀도가 filter의 반지름 방향으로 내부에서 외부로 증가하는 형태와 외부에서 내부로 증가하는 두 가지 형태를 만들었다. 원하는 형태의 광밀도를 갖는 filter를 제작하기 위하여 이와 반대의 광밀도를 갖는 마스크를 제작하여야 한다.

• 한국재료학회지
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• 제20권10호
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• pp.555-558
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• 2010

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.