• 한국지반신소재학회논문집
• /
• 제17권1호
• /
• pp.119-126
• /
• 2018

도심지에서 발생하고 있는 지반공동은 점차 증가하고 있는 추세이다. 그러나 지하에는 지하철 및 상하수도 관거, 통신시설 등 많은 구조물과 지하매설물이 복잡하게 상존하기 때문에 지반함몰이 발생할 경우 그 피해규모가 크고, 복구를 하는데 있어 시간적 경제적으로 큰 어려움이 따른다. 이에 지반공동을 보다 신속하게 복구하기 위한 새로운 방법으로 수용성 폴리머 기반의 무기질계 혼화재를 개발한 바 있고, 개발 보강재를 효율적으로 공동 내부에 주입할 수 있도록 하는 주입시스템 구축이 필요하다. 구축하고자 하는 주입시스템은 비개착식이고 별도의 플랜트 설치를 필요로 하지 않아 시간적 경제적으로 유리하며 공압을 이용하여 보강재를 공동내부에 빠르게 충전시킬 수 있어 지반함몰 발생 시 긴급복구를 가능하게 해주는 기술이라고 할 수 있다. 주입시스템 구축을 위해 충전속도 및 충전율 등을 실험을 통해 평가하였고 개별요소해석 프로그램(EDEM)을 이용한 시뮬레이션을 통해 지반 및 주변의 다양한 조건에서도 가능한 충전양상을 확인할 수 있었다.

• Journal of Electrochemical Science and Technology
• /
• 제11권1호
• /
• pp.60-67
• /
• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

• Geomechanics and Engineering
• /
• 제20권6호
• /
• pp.485-495
• /
• 2020

Based on the movement characteristics of overlying strata with gangue backfilling, the compression test of gangue is designed. The deformation characterristics of gangue is obtained based on the different Talbot index. The deformation has a logarithmic growth trend, including sharp deformation stage, linear deformation stage, rheological stage, and the resistance to deformation changes in different stages. The more advantageous Talbot gradation index is obtained to control the surface subsidence. On the basis of similarity simulation test with gangue backfilling, the characteristics of roof failure and the evolution of the supporting force are analyzed. In the early stage of gangue backfilling, beam structure damage directly occurs at the roof, and the layer is separated from the overlying rock. As the working face advances, the crack arch of the basic roof is generated, and the separation layer is closed. Due to the supporting effect of filling gangue, the stress concentration in gangue backfilling stope is relatively mild. Based on the equivalent mining height model of gangue backfilling stope, the relationship between full ratio and mining height is obtained. It is necessary to ensure that the gradation of filling gangue meets the Talbot distribution of n=0.5, and the full ratio meets the protection grade requirements of surface buildings.

• 한국재료학회지
• /
• 제22권7호
• /
• pp.374-378
• /
• 2012

In an effort to overcome the problems which arise when fabricating high-aspect-ratio TSV(through silicon via), we performed experiments involving the void-free Cu filling of a TSV(10~20 ${\mu}m$ in diameter with an aspect ratio of 5~7) by controlling the plating DC current density and the additive SPS concentration. Initially, the copper deposit growth mode in and around the trench and the TSV was estimated by the change in the plating DC current density. According to the variation of the plating current density, the deposition rate during Cu electroplating differed at the top and the bottom of the trench. Specifically, at a current density 2.5 mA/$cm^2$, the deposition rate in the corner of the trench was lower than that at the top and on the bottom sides. From this result, we confirmed that a plating current density 2.5 mA/$cm^2$ is very useful for void-free Cu filling of a TSV. In order to reduce the plating time, we attempted TSV Cu filling by controlling the accelerator SPS concentration at a plating current density of 2.5 mA/$cm^2$. A TSV with a diameter 10 ${\mu}m$ and an aspect ratio of 7 was filled completely with Cu plating material in 90 min at a current density 2.5 mA/$cm^2$ with an addition of SPS at 50 mg/L. Finally, we found that TSV can be filled rapidly with plated Cu without voids by controlling the SPS concentration at the optimized plating current density.

• 수산해양교육연구
• /
• 제26권4호
• /
• pp.894-901
• /
• 2014

This study concerns the performance of condensation heat transfer in two-phase loop thermosyphons. In the present work, R134a has been used as the working fluid. Liquid fill charge ratio defined by the ratio of working fluid volume to total internal volume of thermosyphon, heat flux and wind speed of condensation have been used as the experimental parameters. The results show that the filling rate of working fluid and heat flux are very important factors for the operation of two-phase loop thermosyphons. The optimum liquid fill charge ratio for the best condensation heat transfer rate was 80%.

• 한국정밀공학회지
• /
• 제8권1호
• /
• pp.96-104
• /
• 1991

This study is concerned with the fluid sloshing dampers to suppress the high vibration in the resonance and operating regions. An experimental investigation was conducted to determine the logarithmic decrement, natural frequency, tuning frequency ratio of oscillation of liquids contained in an spherical rigid container. The decay of the vibration amplitude was studied for the range of liquid filling ratio in container. The results of the investigation indicate that the sloshing motion of liquids results in an increase in the available effective damping when the filling ratio is in the region near H/R=1.3-1.6.

• 대한금속재료학회지
• /
• 제49권5호
• /
• pp.388-394
• /
• 2011

High speed copper filling into TSV (through-silicon-via) for three dimensional stacking of Si chips was investigated. For this study, a tapered via was prepared on a Si wafer by the DRIE (deep reactive ion etching) process. The via had a diameter of 37${\mu}m$ at the via opening, and 32${\mu}m$ at the via bottom, respectively and a depth of 70${\mu}m$. $SiO_2$, Ti, and Au layers were coated as functional layers on the via wall. In order to increase the filling ratio of Cu into the via, a PPR (periodic pulse reverse) wave current was applied to the Si chip during electroplating, and a PR (pulse reverse) wave current was applied for comparison. After Cu filling, the cross sections of the vias was observed by FE-SEM (field emission scanning electron microscopy). The experimental results show that the tapered via was filled to 100% at -5.85 mA/$cm^2$ for 60 min of plating by PPR wave current. The filling ratio into the tapered via by the PPR current was 2.5 times higher than that of a straight via by PR current. The tapered via by the PPR electroplating process was confirmed to be effective to fill the TSV in a short time.

• 대한환경공학회지
• /
• 제39권9호
• /
• pp.513-518
• /
• 2017

본 연구는 입상활성탄을 일시에 100% 충진하는 방법과 일회 충진양을 50%, 33%, 20% 및 10%로 나눠서 주기적으로 누적 충진하였을 경우에 대해 THMs과 DOC 처리효율 변화를 비교 평가하기 위해 수행하였다. 일시에 100% 충진하는 방법은 운전 초기에는 THMs와 DOC의 유출농도가 낮았으나 운전기간이 증가할수록 높은 유출수 농도를 나타내었다. 반면 주기적 누적충진 방법을 적용한 경우에는 유출수의 THMs와 DOC 농도가 운전기간 동안 상대적으로 균등하게 유지하였다. THMs 흡착제거에는 주기적 누적 충진법이 전체 충진용량을 일시에 충진하는 방법에 비해 효과적이었으나, 활성탄 공정 유입수 THMs 구성종들 중에서 클로로디브로모메탄이나 브로모포름의 함량이 클로로포름이나 브로모디클로로메탄에 비해 월등히 높은 경우에는 주기적 누적충진법에 비해 전체 충진용량을 일시에 충진하는 방법이 더욱 효과적인 것으로 나타났다. DOC의 제거에서는 충진용량을 일시에 충진하여 운전하는 방법이 주기적 누적충진법에 비해 DOC의 총 흡착량과 유출수의 평균농도 측면에서는 유리하였다. 활성탄 공정 운전기간 동안 THMs와 DOC 제거율의 균등화에는 주기적 누적충진 방법을 적용한 경우가 효과적이었고, 적은 양의 활성탄을 주기적으로 자주 충진하는 방식이 더욱 유리하였다.

• 한국해양공학회:학술대회논문집
• /
• 한국해양공학회 2006년 창립20주년기념 정기학술대회 및 국제워크샵
• /
• pp.386-391
• /
• 2006

This study presents experimental results of sloshing phenomenon done on rectangular box. A simple harmonic excitation was done on the box. Two kinds of filling ratio, 20% and 30% of height, were tested. A total of 15 pressure sensors were installed to monitor the impact pressure. Each test was repeated for 20 times to ensure the repeatability. The high speed camera captured the flaw filed and the corresponding pressure were synchronize with video signal so that the video image can help the interpretation of the impact pressure. The two filling ratio made difference in the flaw characteristic and impact pressure. The use of high speed camera made it possible to understand the bubble generation mechanism. The pressure time histories were presented.

• 한국주조공학회지
• /
• 제20권2호
• /
• pp.97-103
• /
• 2000

In this study, a design of experiment, Taguchi method, was applied to optimize gating system design of escalator step die casting parts. Six shape factors which affect filling sequence of melt are adopted and divided into two levels respectively. Initial feeding differences of melt which were calculated by using S/N(signal-to-noise) ratio in each condition were demonstrated with the simulation of Flow-3D software program. Variations of S/N ratio according to shape factors were obtained and the optimal condition of gating system could also be obtained. It could be found that width of gate, contact angle of gate, thickness of runner are more effective factors on the filling sequence of melt than the others in this case of escalator step die casting parts. It showed that the economical gating system and sound filling sequence of melt were obtained by using Taguchi method.