• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.10
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• pp.841-850
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• 2015

With the rapid progress of electronics and radio communication technology, human enjoys greater freedom in information communication. However, EMW(Electro-Magnetic Wave) environments have become more complicate and difficult to control. Thus, international organizations, such as the American National Standard Institution(ANSI), Federal Communications Commission(FCC), the Comite Internationale Special des Perturbations Radio Electrique(CISPR), etc, have provided standard for controlling the EM wave environments and for the countermeasure of the electromagnetic compatibility(EMC). In this paper, fabrication of the smart EMW absorber which has heat radiating function and high performance absorption abilities were suggested. Furthermore, we prospected future smart EMW absorbers. The designed smart EMW absorber is fabricated following process. Firstly, we applied high temperature heat treated to a mixture of Iron-oxide($Fe_2O_3$) and ceramics. Secondly, we applied low temperature heat treated to the mixture of heat treated material and a carbon material. Lastly, we made apertures on the absorber. The designed smart EM wave absorber has the absorption ability of more than 20 dB from 2 GHz to 2.45 GHz band, respectively. Thus, it is respected that these results can be applied as various EMC devices in electronic, communication, and controlling systems.

• Journal of the Korean Magnetics Society
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• v.13 no.5
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• pp.187-192
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• 2003

The magnetic and thermal properties of NiFe/[IrMn-Mn]/CoFe with Mn additions have been studied. As-deposited CoFe pinned layers with [IrMn-Mn]layer had dominantly larger exchange biasing field ( $H_{ex}$) and blocking temperature ( $T_{b}$) than those with pure I $r_{22}$M $n_{78}$ used. The $H_{ex}$ and $T_{b}$ improved with 76.8-78.1 vol% Mn, but those of the NiFe/IrMn/CoFe dropped considerably with more addition of 0.6 vol % Mn. The average x-ray diffraction peak ratios of fcc [(111)CoFe, NiFe]/(111)IrM $n_3$ textures for the Mn inserted total vol of 75.5, 77.5, and 79.3% were about 1.4, 0.8, and 0.6, respectively. For the sample without Mn inserted layer, the $H_{ex}$ between IrMn and CoFe layers was almost zero, but it increased to 100 Oe after annealing of 250 $^{\circ}C$. For as-grown two multilayers samples with ultra-thin Mn layers of 77.5 and 78.7 vol %, the $H_{ex}$s were 259 and 150 Oe, respectively. In case of IrMn with 77.5 vol% Mn, the $H_{ex}$ was increased up to 475 Oe at 350 $^{\circ}C$ but decreased to 200 Oe at 450 $^{\circ}C$, respectively. The magnetic properties and thermal stabilities of NiFe/[IrMn-Mn]/CoFe multilayer were enhanced with Mn additions. In applications where higher $H_{ex}$ and $T_{b}$ are required, proper contents of Mn can be used. be used. used.

• Journal of Powder Materials
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• v.30 no.1
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• pp.1-6
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• 2023

High-entropy alloys (HEAs) are attracting attention because of their excellent properties and functions; however, they are relatively expensive compared with commercial alloys. Therefore, various efforts have been made to reduce the cost of raw materials. In this study, MIM is attempted using coarse equiatomic CoCrFeMnNi HEA powders. The mixing ratio (powder:binder) for HEA feedstock preparation is explored using torque rheometer. The block-shaped green parts are fabricated through a metal injection molding process using feedstock. The thermal debinding conditions are explored by thermogravimetric analysis, and solvent and thermal debinding are performed. It is densified under various sintering conditions considering the melting point of the HEA. The final product, which contains a small amount of non-FCC phase, is manufactured at a sintering temperature of 1250℃.

• Journal of Powder Materials
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• v.30 no.1
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• pp.13-21
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• 2023

In additive manufacturing, the flowability of feedstock particles determines the quality of the parts that are affected by different parameters, including the chemistry and morphology of the powders and particle size distribution. In this study, the microstructures and flowabilities of gas-atomized heat-resistant alloys for additive manufacturing applications are investigated. A KHR45A alloy powder with a composition of Fe-30Cr-40Mn-1.8Nb (wt.%) is fabricated using gas atomization process. The microstructure and effect of powder chemistry and morphology on the flow behavior are investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and revolution powder analysis. The results reveal the formation of spherical particles composed of single-phase FCC dendritic structures after gas atomization. SEM observations show variations in the microstructures of the powder particles with different size distributions. Elemental distribution maps, line scans, and high-resolution XPS results indicate the presence of a Si-rich oxide accompanied by Fe, Cr, and Nb metal oxides in the outer layer of the powders. The flowability behavior is found to be induced by the particle size distribution, which can be attributed to the interparticle interactions and friction of particles with different sizes.

• Journal of Powder Materials
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• v.10 no.1
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• pp.46-50
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• 2003

Lee et al. reported that a mixture of Cu and Ta, the combination of which is characterized by a positive heat of mixing, $\{Delta}H_{mix}$ of +2 kJ/㏖, can be amorphized by mechanical alloying(MA). It is our aim to investigate to what extent the MA is capable of producing a non-equilibrium phase with increasing the heat of mixing. The system chosen is the binary $Cu_{30}Mo_{70}$ with $\{Delta}H_{mix}$=+19 kJ/㏖. The mechanical alloying was carried out using a Fritsch P-5 planetary mill under Ar gas atmosphere. The vial and balls are made of Cu containing 1.8-2.0 wt.%Be to avoid contaminations arising mainly from Fe when steel balls and vial are used. The MA powders were characterized by the X-ray diffraction, EXAFS and thermal analysis. We conclude that two phase mixture of nanocrystalline fcc-Cu and bcc-Mo with grain size of 10 nm is formed by the ball-milling for a 3:7 mixture of pure Cu and Mo, the evidence for which has been deduced from the thermodynamic and structural analysis based on the DSC, X-ray diffraction and EXAFS spectra.

• Journal of the Korean institute of surface engineering
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• v.49 no.4
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• pp.376-381
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• 2016

The effects of ICP (Inductively Coupled Plasma) power, ranging from 0 to 200 W, on the crystal structure, microstructure, surface roughness and mechanical properties of magnetron sputtered VN coatings were systematically investigated with FE-SEM, AFM, XRD and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of VN coatings. With the increasing of ICP power, coating microstructure evolves from a porous columnar structure to a highly dense one. Average crystal grain size of single phase cubic fcc VN coatings was decreased from 10.1 nm to 4.0 nm with increase of ICP power. The maximum hardness of 28.2 GPa was obtained for the coatings deposited at ICP power of 200 W. The smoothest surface morphology with Ra roughness of 1.7 nm was obtained from the VN coating sputtered at ICP power of 200 W.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.89-96
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• 2001

N- or O-doped STS304 stainless films were synthesized by an unbalanced magnetron sputtering process with various argon and reactive gas ($N_2$, $O_2$) mixtures. These films were examined by scanning electron microscopy (SEM), X-ray diffraction (XRD), Auger electron spectroscopy (AES) and Knoop microhardness tester. The Results from X-ray diffraction (XRD) analysis showed that a STS304 stainless steel film synthesized without reactive gas using a bulk STS304 stainless steel target had a ferrite bcc structure ($\alpha$ phase), while the N-doped STS304 stainless film was consisted of a nitrogen supersaturated fcc structure, which hsa a strong ${\gamma}$(200) phase. In the O-doped films, oxide Phases ($Fe_2$$O_3$ and $Cr_2$$O_3$) were observed from the films synthesized under an excess $O_2$ flow rate of 9sccm. AES analysis showed that nitrogen content in N-doped films increased as the nitrogen flow rate increased. Approximately 43 at.%N in the N-doped film was measured using a nitrogen flow rate of 8sccm. In O-doped film, approximately 15 at.%O was detected using a $O_2$ flow rate of 12sccm. the Knoop microhardness value of N-doped film using a nitrogen flow rate of 8 sccm was measured to be approximately $H_{ k}$ 1200 and this high value could be attributed to the fine grain size and increased residual stress in the N-doped film.

• Proceedings of the Korea Society for Simulation Conference
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• 1999.10a
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• pp.70-74
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• 1999

발전소 시뮬레이션 시스템 기술은 종합적인 지식을 바탕으로 자료수집 및 분석, 소프트웨어 개발 환경, 수학적 모델, 전산기 구성, 각종 계기류 설계 및 구매 장착 등의 노하우를 알아야만 제작할 수 있는 종합적인 기술이다. 또 지시기반의 기술이며 부가가치가 높은 기술이기 때문에 선진 각국에서는 계측제어 시스템의 기술개발 및 시장 확대를 위하여 힘을 쓰는 동시에 타국으로의 기술정보 유출을 경계하는데 신경을 곤두세우고 있다. 현재 복잡화되어 가고 있는 산업 사회의 전력 수요에 대한 대폭적인 증가 추세에 따라 발전소에서는 보다 효율적이며 합리적이고 경제적인 전력 공급을 위해서 전력 생산에 대한 신뢰성 향상 및 안정성 확보는 물론, 효율성 높은 운전이 절실히 요구되고 있다. 한편, 국내의 시뮬레이션 시스템 분야 기술은 아직도 완벽한 수준에는 미치지 못하며, 이 분야의 기술력 확보 및 신기술 개발은 향후 미래의 모든 시스템산업의 성쇄를 판가름하는 아주 중요한 척도가 될 것이다. 이 중에서 접지 분야는 고전압 혼촉에 의한 저압측 선로의 전압상승 방지, 모선(Bus)이나 전력 기기의 절연보호 및 회로전압의 안정등으로 시스템 성능을 한층 증가 시켜줄 뿐아니라 기기의 오동작이나 낙뇌등으로 인명피해 발생을 없애주는 아주 중요한 분야임에도 불구하고 이 분야의 국내 관련법규등이 미비한 사항이다. 그래서 발전소 분산제어 시스템분야의 장기간 신뢰성 및 안정성을 가지고 있고, 국내에서 많이 사용하는 미국 Bailey의 infi-90 및 독일 ABB의 Procontrol-P를 비교 분석하여 발전소 시뮬레이션 시스템의 접지에 응용 하고져 한다.상호 발생기를 이용한 다양한 시스템 검증 및 분석에 이용할 수 있을 것이다. 본 논문은 가상호 발생기의 구조와 최대 용량 시험 방법을 소개하고, 더 나아가 호 Traffic에 대한 최대 용량 시험뿐 아니라 QoS를 향상시키기 위한 교환 시스템의 제반 성능 시험 및 분석에 이를 이용하기 위해 개선이 필요함을 서술하고자 한다.textrm{m}$~3.4$\mu\textrm{m}$ 범위에서의 투과 및 흡수 스펙트럼을 측정하였다. 결정 성장 결과 B3+, Er3+, Cr3+ 이온은 Ti4+ 이온과 이온의 크기 차이가 심하여 결정의 정상적인 성장을 방해하는 물성을 나타냈고, V5+, Cr3+ 이온은 흑색의 결정, Fe3+ 이온은 적갈색의 결정으로 성장되었다. Al3+, Zr4+, Al3+의 순서로 투과도가 높아지는 것이 관찰되었다. 불순이온의 농도에 따른 영향으로서 Al3+ 이온의 경우 주입농도가 높아질수록 low angle boundary와 oxygen deficiency가 감소하였고, 투과율은 조금 감소하거나 큰 차이가 없는 것으로 나타났다. 반면에 Cr3+ 이온을 주입한 경우 0.003 atomic%에서 최적의 물성을 보였으며, 주입농도가 높아질수록 결정성장이 어려워지고 광의 투과도가 급격히 저하되었다.은 1.3을 나타내었다.로 보인다.하면 수평축과 수직축의 분산 장벽의 비에 따라 cluster의 두께비가 달라지는 성장을 볼 수 있었고, 한 축 방향으로의 팔 넓이는 fcc(100) 표면의 경우 동일한 Ed+Ep값에 대응하는 팔 넓이와 거의 동일한 결과가 나타나는 것을 볼 수 있다. 따라서 이러한 비대칭적인