• Journal of the Korean Society of Safety
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• v.28 no.3
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• pp.18-22
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• 2013

The Co-base super heat resisting alloy ECY768 is employed in gas turbine because of its high temperature strength and oxidation resistance. The prediction of fatigue life for superalloy is important for improving the efficiency. In this paper, low cycle fatigue tests are performed as variables of total strain range and temperature. The relations between strain energy density and number of cycle to failure are examined in order to predict the low cycle fatigue life of ECY768 super alloy. The lives predicted by strain energy methods are found to coincide with experimental data and results obtained from the Coffin-Manson method. The fatigue lives is evaluated using predicted by Coffin-Manson method and strain energy methods is compared with the measured fatigue lives at different temperatures. The microstructure observing was performed for how affect able to low-cycle fatigue life by increasing the temperature.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.47 no.1
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• pp.35-40
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• 2019

The objective of this paper is to identify the fatigue properties of carbon-fiber composite which is widely applied for the development of aircraft structures and obtain data for full-scale fatigue test. The durability and damage tolerance evaluation of composite structures is achieved by fatigue tests and parameters such as fatigue life factor and load enhancement factor. The specimens are made with carbon-fiber/epoxy UD tape and fabric prepreg. Fatigue tests are performed with several stress ratios and lay-up patterns. The Weibull shape parameters are analyzed by Sendeckyj model and individual fatigue lives with Weibull distribution. And the fatigue life factor and load enhancement factor considering reliability are evaluated.

• The Research Journal of the Costume Culture
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• v.29 no.4
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• pp.505-521
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• 2021

This study analyzed the effects of consumer confusion on shopping fatigue and negative purchasing behaviors in an internet shopping environment. Further, the effects of shopping fatigue on negative purchasing behaviors were analyzed. The survey was conducted among consumers in their 20s and 40s in the Seoul metropolitan area who had experience of purchasing fashion products through internet shopping. A total of 392 questionnaire were analysis, with frequency, reliability, factor, correlation, and regression analysis completed using the SPSS statistics program. The results of the study showed that consumer confusion and shopping fatigue in internet shopping environment affected negative purchasing behaviors. First, consumer confusion comprised overload confusion, similarity confusion, and ambiguity confusion. It was found that overload confusion and similarity confusion significantly affected shopping fatigue. Second, shopping fatigue significantly affected negative purchasing behaviors, and an increased level of shopping fatigue result in, increased purchase delay and non-purchase behavior. Third, consumer confusion (overload confusion, similarity confusion, ambiguity confusion) significantly affected purchase delay behavior, while similarity confusion and ambiguity confusion significantly affected non-purchasing behavior. These results will provide useful data for e-CRM and marketing directions of internet companies and will contribute to rational decision-making of internet consumers and improve the quality of consumer life.

• Journal of Ship and Ocean Technology
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• v.3 no.1
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• pp.27-41
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• 1999

The objective of the paper is to study the impact of changing the traditional hull design of bulk carriers by providing them with a double hull while keeping the same deadweight. It is demonstrated that by introducing the double hull the structural reliability is increased throughout the entire life and also the extend of the needed repair is reduced. The results are obtained with recently developed mathematical tools for the reliability assessment of ship hulls subjected to the existence of multiple cracks both in the stiffeners and in the plating and it models the crack growth process. The effect of corrosion is represented as time dependent. The long-term stress range acting on the elements is defined as a function of the local transverse pressure of the internal cargo and outside sea water combined with the stresses resulting from the longitudinal bending of the hull, which is a combined with the stresses resulting from the longitudinal bending of the hull, which is a combineation of horizontal and vertical bending moments. The effect of maintenance actions is modelled as a stochastic process. The results show that a different design of the midship section improves the structural safety and also the economy with respect to structural repair of bulk carriers.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.11
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• pp.1221-1229
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• 2014

This paper proposes an approach for predicting the fatigue life of a propeller shaft of a forklift truck by an accelerated life test method. The accelerated life test method adopted in this study is the calibrated accelerated life test, which is highly effective in the prediction of the lifetime and enables significant reduction of the test time as well as a quantification of reliability in the case of small sample sizes. First, the fatigue test was performed under two high stress levels, and then, it was performed by setting low stress levels in consideration of the available test time and extrapolation. Major reliability parameters such as the lifetime, accelerated power index, and shape parameter were obtained experimentally, and the experimentally predicted lifetime of the propeller shaft was verified through comparison with results of an analysis of load spectrum data under actual operating conditions.

• Korean Journal of Biological Psychiatry
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• v.20 no.1
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• pp.6-11
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• 2013

Objectives There are only a limited number of studies on instruments assessing fatigue in university students, although fatigue exerts negative influences on their health and academic performances and fatigue-related complaints are more frequently reported in young adults than middle-aged adults. The aim of this study was to validate the 9-item Fatigue Severity Scale (FSS) among university students including both undergraduate and graduate students in South Korea. Methods A total of 176 university students completed a battery of self-report questionnaires, including the FSS, the Brief Fatigue Inventory (BFI), the Beck Depression Inventory-II (BDI-II), the Beck Anxiety Inventory (BAI), the Medical Outcomes Study Short Form 36 version 2 (MOS-SF36v2), and the Inclusion of Community in the Self Scale (ICS). The data were collected from February of 2012 to June of 2012. The reliability, convergent validity, divergent validity, and exploratory factor analyses were conducted to assess psychometric properties of the FSS. Results The mean FSS score was 3.20 (standard deviation = 1.43). The FSS demonstrated an excellent internal consistency (Cronbach's ${\alpha}$ = 0.93) and item-total correlations ranged from 0.56 to 0.90. Correlations of the FSS with the BFI (r = 0.71, p < 0.01), BDI-II (r = 0.54, p < 0.01), BAI (r = 0.46, p < 0.01), MOS-SF36v2 physical component summary (r = -0.28, p < 0.01), MOS-SF36v2 mental component summary (r = -0.55, p < 0.01), and ICS (Spearman's rho = -0.07, p = 0.33) showed acceptable convergent and divergent validity. Exploratory factor analysis defined one underlying factor (eigenvalue = 5.67) that explained 93.50% of the total variance. Conclusions To the best of our knowledge, this is the first study to investigate reliability and validity of the FSS in university students. The FSS exhibits good psychometric properties for evaluation of fatigue among university students in South Korea. Since the FSS is easy to administer, score, and interpret, it could be a useful tool in research and practice for assessing fatigue among university students.

• Journal of Korean Society of Steel Construction
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• v.20 no.6
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• pp.723-730
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• 2008

Due to the higher ratio of live load to total loads of railway bridges, the accumulated damage by cyclic fatigue is significant. Moreover, it is highly possible that the initiated crack grows faster than that of highway bridges. Therefore, it is strongly needed to assess the safety for the accumulated damage analytically. The initiation and growth of fatigue-crack are related with the stress range, number of cycles, and the stiffness of the structural system. The stiffness of the structural system includes uncertainties of the planning, design, construction and maintenance, which varies as time goes. In this study, the authors developed the design and risk assessment techniques based on the reliability theories considering the uncertainties in load and resistance. For the probabilistic risk assessment of crack growth and the remaining life of the structures by the cyclic load of railway and subway bridges, response surface method (RSM) combined with first order second moment method were used. For composing limit state function, the stress range, stress intensity factor and the remaining life were selected as input important random variables to the RSM program. The probabilities of failure and the reliability indices of fatigue life for the considered specimen under cyclic loads were evaluated and discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.7
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• pp.2159-2166
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• 1996

The stochastic properties of variation in fatigue crack growth are important in reliability and stability of structures. In this study,the stochastic model for the variation of fatigue crack growth rate was proposed in consideration of nonhomogeneity of materials. For this model, experiments were ocnducted on 7075-T6 aluminum alloy under the constant stress intensity factor range. The variation of fatigue crack growth rate was expressed by random variables Z and r based on the variation of material coefficients C and m in the paris-Erodogan's equation. The distribution of fatigue life with respect to the stress intensity factor range was evaluated by the stochastic Markov chain model based on the Paris-Erdogan's equation. The merit of proposed model is that only a small number of test are required to determine this this function, and fatigue crack growth life is easily predicted at the given stress intensity factor range.