• Geotechnical Engineering
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• v.8 no.2
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• pp.81-96
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• 1992

This paper dealt with the influence of experimental error generated inevitably during performing experiments on the granular soil behaviour analysis selecting Lade's Single Work-Hardening constitutive model. Several isotropic compression-expansion tests and a series of drained conventional triaxial tests with various confining pressures for Baekma river sands were performed and the values of parameters for the above model were determined using computer program developed for this study based on regression analysis. By finding the range of the upper and lower bound for deviator stress and volumetric strain versus axial strain dependant on the increase and decrease of the standard deviation from mean value of parameters, sensitivities of all the parameters were examined. Practical use of program to determine the parameters and capability to predict the behaviour of granular soil by Lade's Single Work -Hardening model verified.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.1
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• pp.64-67
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• 2013

$Fe_3O_4$(magnetite) having half metallic property attracts great attention material with high curie temperature in spintronics. $Fe_3O_4$ thin films and nanowires were grown onto c-$Al_2O_3$(0001) at various substrate temperatures. $Fe_3O_4$ films deposited from 300 to $600^{\circ}C$ are influenced by thermal stress induced from mismatch of thermal expansion coefficient between $Fe_3O_4$ and $Al_2O_3$ (0001) substrate. The $Fe_3O_4$ nanowires grown at $640^{\circ}C$ showed a diameter of 130 nm and a length of $2-10{\mu}m$. The nanowire arrays fabricated by pulsed laser deposition technique have high coercivity($H_c$) of 608 Oe and Squareness($M_r/M_s$) of 0.68 in perpendicular direction.

• Structural Engineering and Mechanics
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• v.62 no.4
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• pp.401-415
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• 2017

A new higher shear deformation theory (HSDT) is presented for the thermal buckling behavior of functionally graded (FG) sandwich plates. It uses only four unknowns, which is even less than the first shear deformation theory (FSDT) and the conventional HSDTs. The theory considers a hyperbolic variation of transverse shear stress, respects the traction free boundary conditions and contrary to the conventional HSDTs, the present one presents a new displacement field which includes undetermined integral terms. Material characteristics and thermal expansion coefficient of the sandwich plate faces are considered to be graded in the thickness direction according to a simple power-law distribution in terms of the volume fractions of the constituents. The core layer is still homogeneous and made of an isotropic material. The thermal loads are supposed as uniform, linear and non-linear temperature rises within the thickness direction. An energy based variational principle is used to derive the governing equations as an eigenvalue problem. The validation of the present work is carried out with the available results in the literature. Numerical results are presented to demonstrate the influences of variations of volume fraction index, length-thickness ratio, loading type and functionally graded layers thickness on nondimensional thermal buckling loads.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.7
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• pp.73-81
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• 1992

We have investigated the thermal reaction property and the oxygen behavior of TiN/Ti/Si structure after different hear treatments using x-ray photoelectron spectroscopy and cross-sectional transmission electron microscopy measurements. During the heat treatment in N$_2$ amibient, the considerable amount of oxygen atoms incorporates into TiN/Ti/Si Structures. It is found that oxygen atoms pile up at the top surface of TiN and TiN/Ti interface, forming a compound of TiO$_2$ above $600^{\circ}C$. Inside the TiN film, the oxygen content increases as the annealing temperature increases, mostly TiO and Ti$_2$O$_3$ rather than thermodynamically stable TiO$_2$. Above the annealing temperature of 55$0^{\circ}C$, the TiSi$_2$ formation has initiated. One thing to note is that a severe blistering is observed in the sample annealed at $600^{\circ}C$, due to (1) the difference of thermal expansion coefficient between TiN and Si` (2) the compressive stress induced by the volume reduction caused by the Ti-Silicide grain while elevating temperatures.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• Journal of Magnetics
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• v.14 no.1
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• pp.7-10
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• 2009

In this work, we studied the effects of Sn addition on the ordering temperature of FePt thin film. The coercivity of FePtSn film was about 1000 Oe greater than the coercivity of FePt film for an annealing temperature of $600^{\circ}C$. Therefore, Sn addition was effective in promoting the $L1_0$ ordering and in reducing the ordering temperature of the FePt film. From our X-ray diffraction results, we found that in the as-deposited film, the addition of Sn induced a lattice expansion in disordered FePt thin films. After the annealing process, the excess Sn diffuses out from the ordered FePt thin film because of the difference in the solid solubility of Sn between the disordered and ordered phases. The existence of precipitates of Sn from the FePt lattice was deduced by Curie temperature measurements of the FePt and FePtSn films. Therefore, the key role played by the addition of Sn to the FePt film can be explained by a reduction in the activation energy for the $L1_0$ order-disorder transformation of FePt which originates from the high internal stress in the disordered phase induced by the supersaturated Sn atoms.

• Nuclear Engineering and Technology
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• v.40 no.3
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• pp.233-238
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• 2008

This study investigates the surface modification of a Hastelloy X plate and diffusion bonding in the assembly of surface modified plates. These types of plates are involved in the key processes in the fabrication of a process heat exchanger (PHE) for a $SO_3$ decomposer. Strong adhesion of a SiC film deposited onto Hastelloy X can be achieved by a thin SiC film deposition and a subsequent N ion beam bombardment followed by an additional deposition of a thicker film that prevents the Hastelloy X surface from becoming exposed to a corrosive environment through the pores. This process not only produces higher corrosion resistance as proved by electrolytic etching but also exhibits higher endurance against thermal stress above 9$900^{\circ}C$. A process for a good bonding between Hastelloy X sheets, which is essential for a good heat exchanger, was developed by diffusion bonding. The diffusion bonding was done by mechanically clamping the sheets under a heat treatment at $900^{\circ}C$. When the clamping jig consisted of materials with a thermal expansion coefficient that was equal to or less than that of the Hastelloy X, sound bonding was achieved.

• Journal of the Korea Institute of Military Science and Technology
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• v.15 no.4
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• pp.359-365
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• 2012

In the soft recoil system, the recoiling parts are initially accelerated to the forward direction. These parts are returned to original position by the firing with intial acceleration speed. The latch of the soft recoil system keeps the high impact load when the recoil parts were recuperated to the forward direction. In this study, the latch of soft recoil system using the ADAMS program was analyzed. The optimal operation parameters were found that max. angle and expansion length of latch was $50^{\circ}$, 180 mm respectively. Dynamic structural analyses of model cases were performed using finite element model. The max. stress and deflection of latch was 230 MPa and 0.45 mm respectively.

• Applied Microscopy
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• v.44 no.4
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• pp.111-116
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• 2014

This study investigates the developmental pattern of adhesive discs (ADs) to highlight the ontogeny and structural changes that occur during the growth of Boston ivy. Initiation to postmortem features of ADs were examined through light and scanning electron microscopy. The study also reveals a new finding of the dislocation of peripheral tissues of adaxial origin. Four phases of attachment are suggested with regards to its climbing behavior: 1) pre-attachment, 2) upon attachment, 3) after attachment, and 4) final attachment. During initiation, several ADs originate from tendril primordia without epidermal differentiation. However, different growth rates in the epidermis results in completely different ADs. ADs were discerned by size, shape, and color during expansion, but cells in the adaxial surface remained alive longer than the other side. Upon contact, the ADs demonstrate simultaneous growth and deterioration, but once attachment is established the latter process subdues to final stages. Epidermal transformation, adhesive secretion, cellular disruption, and mechanical stress were essential for the self-clinging nature of Boston ivy. The post-attachment sequence is also believed to be critical in achieving maximum mechanical strength to provide extensive support. The developmental process of ADs is prompted by tactile stimulation but in a highly organized and systematic manner.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.