• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.89-93
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• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Journal of the Korea Fashion and Costume Design Association
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• v.3 no.2
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• pp.51-62
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• 2001

This study was intended to investigate the contemporary meaning of transparent design expressed in contemporary fashion by inquiring into its plasticity expressed in contemporary design and fashion and analyzing the association between them. It used the comparative anesthetic method widely used by H. W lfflin and other scholars in eliciting the differences and similarities in styles. It attempted to investigate the plasticity of transparent design expressed in contemporary design by dividing it into the epidermal, spatial and ideological effects. Contemporary design expressed the epidermal effects such as lightness(nimbleness), smoothness, contrast and stress It expressed the spatial effects such as spatial flexibility through the interpenetration of interior and exterior spaces, expansion of the space and the like. And it expressed ideological effects such as openness, pureness, playfulness and the like. In terms of lightness, contemporary design expressed actual or visual lightness by using transparent materials. In terms of the interpenetration of interior and exterior spaces, it expressed the interpenetration of the interior space into the exterior spaces and vice versa. In terms of spatial expansion, contemporary design expressed the infinite spatial connection by drawing the exterior space into the interior space. Contrast and stress were formed by imposing visual unity on contemporary fashion by using opaque and transparent materials. In terms of openness, contemporary design expressed contemporary people's candor and dependability by making the inside of the building or object look outward. To express pureness, contemporary design used the clear and transparent image by using the glass or translucent materials taking on the pure property. To express playfulness, contemporary made use of the vagueness of the spatial boundary, the locational switching of inner and outer spaces, and interesting external forms occurring when light pass through opaque and transparent materials.

• Journal of Surface Science and Engineering
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• v.45 no.1
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• pp.20-24
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• 2012

Multilayer passivation film on OLED with organic/inorganic hybrid structure as to diminish the thermal stress and expansion was researched to protect device from the direct damage of $O_2$ and $H_2O$ and improve life time characteristics. Red OLED doped with 1 vol.% Rubrene in $Alq_3$ was used as a basic device. The films consist of ITO(150 nm)/ELM200_HIL(50 nm)/ELM002_HTL(30 nm)/$Alq_3$: 1 vol.% Rubrene(30 nm)/$Alq_3$(30 nm) and LiF(0.7 nm)/Al(100 nm) which were formed in that order. Using LiF/$SiN_x$ as a buffer layer was determined because it significantly improved life time characteristics without suffering damage in the process of forming passivation film. Multilayer passivation film on buffer layer didn't produce much change in current efficiency, while the half life time at 1,000 $cd/m^2$ of OLED/LiF/$SiN_x$/E1/$SiN_x$ was 710 hours which showed about 1.5 times longer than OLED/LiF/$SiN_x$/E1 with 498 hours. futhermore, OLED/LiF/$SiN_x$/E1/$SiN_x$/E1/$SiN_x$ with 1301 hours showed about twice than OLED/LiF/$SiN_x$/E1/$SiN_x$ which demonstrated that superior characteristics of life time was obtained in multilayer passivation film. Through the above result, it was suggested using LiF/$SiN_x$ as a buffer layer could reduce the damage from the difference of thermal expansion coefficient in OLED with protective films, and epoxy layer in multilayer passivation film could function like a buffer between $SiN_x$ inorganic layers with relatively large thermal stress.

• Composites Research
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• v.25 no.4
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• pp.117-125
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• 2012

Warpage of the film insert molded (FIM) part is caused by an asymmetric residual stress distribution. Asymmetric residual stress and temperature distribution is generated by the retarded heat transfer in the perpendicular direction to the attached film surface. Since warpage was not prevented by controlling injection molding conditions, glass fiber (GF) filled composites were employed as substrates for film insert molding to minimize the warpage. Distribution of short GFs was evaluated by using micro-CT equipment. Proper models for micro mechanics, anisotropic thermal expansion coefficients, and closure approximation should be selected in order to calculate fiber orientation tensor and warpage of the FIM part with the composite substrate. After six kinds of micro mechanics models, three models of the thermal expansion coefficient and five models of the closure approximation had been considered, the Mori-Tanaka model, the Rosen and Hashin model, and the third orthotropic closure approximation were selected in this study. The numerically predicted results on fiber orientation tensor and warpage were in good agreement with experimental results and effects of GF reinforcement on warpage of the FIM composite specimen were identified by the numerical results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.11
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• pp.1125-1130
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• 2017

The tooth shapes of serration-type and spline-type reactors are optimized using finite element methods to improve the working life of the part and to lower the stress concentration during rotation resulting from contact with the outer race for a reactor operating with $170^{\circ}C$ transmission oil. The results of thermal expansion analyses between an Al reactor and the steel outer race indicate that, before optimization, the gap between the two parts increases further as the serration-type reactor expands by 0.1 mm and the spline-type one strains by 0.08 mm. Because of shape optimization, a trapezoidal shape is obtained from the initial triangular serration and the rectangular spline of the two reactors. The maximum von Mises stress of the serration-type convertor decreased by 24.5 ％, and by 9.3 ％ for the spline-type convertor. In addition, there is a 13 ％ reduction in the axial thickness, as compared to the initially designed model.

• Journal of the Korean Magnetics Society
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• v.11 no.5
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• pp.226-231
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• 2001

The effect of interface reaction between Mn-Zn ferrite single crystal and 61 SiO$_2$-23Pbo-6ZnO-8Na$_2$O-2K$_2$O (mol%) glass on the magnetic properties of the ferrite was investigated. After the reaction, the hump of Zn concentration appeared at the ferrite adjacent to the interface. The initial permeability of the ferrite bonded with the glass at 700 $^{\circ}C$ was 1766 at 100 KHz and reduced to 907 after reaction at 1000$^{\circ}C$. The permeability degradation with increasing reaction temperature was considered to be attributed not only to the sixe diminution of the ferrite due to the its dissolution into the glass but also to the residual stress due to the difference in expansion coefficient between the ferrite and the diffusion layer-the region of the hump of Zn concentration-adjacent to the interface.

• Journal of the Korea Concrete Institute
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• v.13 no.3
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• pp.228-236
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• 2001

Even though numerous researches have been performed for the prediction of thermal stresses in mass concrete structures by both analytical and experimental means, the limitations exist for both approaches. In analytical approach, the fundamental limitation is derived from the difficulty of predicting concrete properties such as modulus of elasticity, coefficient of thermal expansion, etc.. In experimental approach, there are many uncertainties related to in-situ conditions, because a majority of researches have focused on measuring thermal stresses in actual and simulated structures. In this research, an experimental device measuring thermal stresses directly in a laboratory setting is developed. The equipment is located in a temperature chamber that follows the temperature history previously obtained from temperature distribution analysis. Thermal strains are measured continuously by a strain gauge in the device and the corresponding thermal stresses are calculated simply by force equilibrium condition. For the verification of the developed device, a traditional experiment measuring thermal strains from embedded strain gauges is performed simultaneously. The results show that the thermal strain values measured by the newly developed device agree well with the results from the benchmark experiment.

• Journal of the Korean Society for Nondestructive Testing
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• v.17 no.2
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• pp.89-99
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• 1997

Although discontinuously reinforced metal matrix composite(MMC) is one of the most promising materials for applications of aerospace, automotive industries, the thermal residual stresses developed in the MMC due to the mismatch in coefficients of thermal expansion between the matrix and the fiber under a temperature change has been pointed out as one of the serious problem in practical applications. There are very limited nondestructive techniques to measure the residual stress of composite materials. However, many difficulties have been reported in their applications. Therefore it is important to establish analytical model to evaluate the thermal residual stress of MMC for practical engineering application. In this study, an elastic model is developed to predict the average thermal residual stresses in the matrix and fiber of a misoriented short fiber composite. The thermal residual stresses are induced by the mismatch in the coefficient of the thermal expansion of the matrix and fiber when the composite is subjected to a uniform temperature change. The model considers two-dimensional in-plane fiber misorientation. The analytical formulation of the model is based on Eshelby's equivalent inclusion method and is unique in that it is able to account for interactions among fibers. This model is more general than past models to investigate the effect of parameters which might influence thermal residual stress in composites. The present model is to investigate the effects of fiber volume fraction, distribution type, distribution cut-off angle, and aspect ratio on thermal residual stress for in-plane fiber misorientation. Fiber volume fraction, aspect ratio, and distribution cut-off angle are shown to have more significant effects on the magnitude of the thermal residual stresses than fiber distribution type for in-plane misorientation.

• International Journal of Highway Engineering
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• v.11 no.4
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• pp.59-68
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• 2009

Torsional behavior of concrete pavement slabs due to temperature and moisture effects is constrained by self weight and friction etc, and causes stress as the result. The stress due to humidity variation in the slab is difficult to calculate while that due to temperature variation can easily be calculated by a commercial structural analysis program. Thus, the slab behavior can be predicted more accurately if the humidity effect is converted to equivalent temperature and is used as an input of structural analysis. In this study, a concrete pavement slab was constructed and strains of the slab due to environmental loadings were measured for long-term period. Thermal strains were subtracted from the measured strains by using thermal expansion coefficient of the concrete measured in a laboratory. Shrinkage strains, the remained strains, was supposed as additional thermal strains to calculate imaginary temperature with equivalent effect of the shrinkage by dividing the shrinkage with the thermal expansion coefficient. An existing shrinkage model was modified by considering the self weight and friction to be used in another model which can convert differential shrinkage between top and bottom of the slab to equivalent temperature difference. Addition research efforts on tensile stress reduction according to steady increase in the compressive strains are warranted for more accurate stress calculation.

• The Korean Journal of Physiology and Pharmacology
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• v.18 no.5
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• pp.403-409
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• 2014

The Bis protein is known to be involved in a variety of cellular processes including apoptosis, migration, autophagy as well as protein quality control. Bis expression is induced in response to a number of types of stress, such as heat shock or a proteasome inhibitor via the activation of heat shock factor (HSF)1. We report herein that Bis expression is increased at the transcriptional level in HK-2 kidney tubular cells and A172 glioma cells by exposure to oxidative stress such as $H_2O_2$ treatment and oxygen-glucose deprivation, respectively. The pretreatment of HK-2 cells with N-acetyl cysteine, suppressed Bis induction. Furthermore, HSF1 silencing attenuated Bis expression that was induced by $H_2O_2$, accompanied by increase in reactive oxygen species (ROS) accumulation. Using a series of deletion constructs of the bis gene promoter, two putative heat shock elements located in the proximal region of the bis gene promoter were found to be essential for the constitutive expression is as well as the inducible expression of Bis. Taken together, our results indicate that oxidative stress induces Bis expression at the transcriptional levels via activation of HSF1, which might confer an expansion of antioxidant capacity against pro-oxidant milieu. However, the possible role of the other cis-element in the induction of Bis remains to be determined.