• Nuclear Engineering and Technology
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• 제51권2호
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• pp.546-555
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• 2019

Since the first nuclear reactor first critical, nuclear systems has gone through four generations of history, and the fourth generation nuclear system will be truly realized in the near future. The notions of SVBR and lead-bismuth eutectic alloy coolant put forward by Russia were well received by the international nuclear science community. Lead-bismuth eutectic alloy with the ability of the better neutron economy, the low melting point, the high boiling point, the chemical inertness to water and air and other features, which was considered the most promising coolant for the 4th generation nuclear reactors. This study mainly focuses on the structural design optimization of the 4th-generation reactor coolant pump, including analysis of external characteristics, inner flow, and transient characteristic. It was found that: the reactor coolant pump with a central symmetrical dual-outlet volute structure has better radial-direction balance, the pump without guide vane has better hydraulic performance, and the pump with guide vanes has worse torsional vibration and pressure pulsation. This study serves as experience accumulation and technical support for the development of the 4th generation nuclear energy system.

• 방사성폐기물학회지
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• 제21권1호
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• pp.55-64
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• 2023

There is a gap in our understanding of the behavior of fused and molten fuel salts containing unavoidable contamination, such as those due to fabrication, handling, or storage. Therefore, this work used calorimetry to investigate the change in liquidus temperature of PuCl₃, having an unknown purity and that had been in storage for several decades. Further research was performed by additions of NaCl, making several compositions within the binary system, and summarizing the resulting changes, if any, to the phase diagram. The melting temperature of the PuCl₃ was determined to be 746.5℃, approximately 20℃ lower than literature reported values, most likely due to an excess of Pu metal in the PuCl₃ either due to the presence of metallic plutonium remaining from incomplete chlorination or due to the solubility of Pu in PuCl₃. From the melting temperature, it was determined that the PuCl₃ contained between 5.9 to 6.2mol% Pu metal. Analysis of the NaCl-PuCl₃ samples showed that using the Pu rich PuCl₃ resulted in significant changes to the NaCl-PuCl₃ phase diagram. Most notably an unreported phase transition occurring at approximately 406℃ and a new eutectic composition of 52.7mol% NaCl-38.7mol% PuCl₃-2.5mol% Pu which melted at 449.3℃. Additionally, an increase in the liquidus temperatures was seen for NaCl rich compositions while lower liquidus temperatures were seen for PuCl₃ rich compositions. It can therefore be concluded that changes will occur in the NaCl-PuCl₃ binary system when using PuCl₃ with excess Pu metal. However, melting temperature analysis can provide valuable insight into the composition of the PuCl₃ and therefore the NaCl-PuCl₃ system.

• 한국결정성장학회지
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• 제4권2호
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• pp.148-156
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• 1994

$YBa_2Cu_3O_X$상 부근의 3가지 조성을 skull melting 방법으로 4MHz에서 녹인 후 방향적 결정성장을 시켰다. 일반적인 무기재료 공정방법으로 처리된 분말을 skull에 넣은 후 $1200^{\circ}C$부근에서 용융시켰다. 사용한 성장속도는 4~0.25 cm/hr이었으며, 금속현미경, X-선 회절기, EDX 등을 이용해서 제조된 시편을 조사하여 사용한 분말의 조성에 따른 시편의 미세조직의 변화를 관찰하였다. $YBa_2Cu_7O_X$와 $YBa_5Cu_{11}O_X$ 시편의 대표적인 미세조직은 성장방향으로 자라난 침상형태의 $YBa_2Cu_3O_X$와 $Y_2BaCuO_5$ 상이 $CuO-BaCuO_2$의 공융 조직상 사이에 생성된 것으로 나타났다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

• Applied Microscopy
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• 제45권2호
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• pp.95-100
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• 2015

The in-situ heating transmission electron microscopy experiment allows us to observe the time- and temperature-dependent dynamic processes in nanoscale materials by examining the same specimen. The temperature, which is a major experimental parameter, must be measured accurately during in-situ heating experiments. Therefore, calibrating the thermocouple readout of the heating holder prior to the experiment is essential. The calibration can be performed using reference materials whose phase-transformation (melting, oxidation, reduction, etc.) temperatures are well-established. In this study, the calibration experiment was performed with four reference materials, i.e., pure Sn, Al-95 wt%Zn eutectic alloy, NiO/carbon nanotube composite, and pure Al, and the calibration curve and formula were obtained. The thermocouple readout of the holder used in this study provided a reliable temperature value with a relative error of <4%.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.348-348
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• 2011

Carbon nanotube (CNT) field effect transistors and sensors use CNT as a current channel, of which the resistance varies with the gate voltage or upon molecule adsorption. Since the performance of CNT devices depends very much on the CNT/metal contact resistance, the CNT/electrode contact must be stable and the contact resistance must be small. Depending on the geometry of CNT/electrode contact, it can be categorized into the end-contact, embedded-contact (top-contact), and side-contact (bottom-contact). Because of difficulties in the sample preparation, the end-contact CNT device is seldom practiced. The embedded-contact in which CNT is embedded inside the electrode is desirable due to its rigidness and the low contact resistance. Fabrication of this structure is complicated, however, because each CNT has to be located under a high-resolution microscope and then the electrode is patterned by electron beam lithography. The side-contact is done by depositing CNT electrophoretically or by precipitating on the patterned electrode. Although this contact is fragile and the contact resistance is relatively high, the side-contact by far has been widely practiced because of its simple fabrication process. Here we introduce a simple method to embed CNT inside the electrode while taking advantage of the bottom-contact process. The idea is to utilize a eutectic material as an electrode, which melts at low temperature so that CNT is not damaged while annealing to melt the electrode to embed CNT. The lowering of CNT/Au contact resistance upon annealing at mild temperature has been reported, but the electrode in these studies did not melt and CNT laid on the surface of electrode even after annealing. In our experiment, we used a eutectic Au/Al film that melts at 250$^{\circ}C$. After depositing CNT on the electrode made of an Au/Al thin film, we annealed the sample at 250$^{\circ}C$ in air to induce eutectic melting. As a result, Au-Al alloy grains formed, under which the CNT was embedded to produce a rigid and low resistance contact. The embedded CNT contact was as strong as to tolerate the ultrasonic agitation for 90 s and the current-voltage measurement indicated that the contact resistance was lowered by a factor of 4. By performing standard fabrication process on this CNT-deposited substrate to add another pair of electrodes bridged by CNT in perpendicular direction, we could fabricate a CNT cross junction. Finally, we could conclude that the eutectic alloy electrode is valid for CNT sensors by examine the detection of Au ion which is spontaneously reduced to CNT surface. The device sustatined strong washing process and maintained its detection ability.

• 한국재료학회지
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• 제7권2호
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• pp.162-170
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• 1997

This study has evaluated the dissimialr weldability of Incoloy 825 Ni base alloy with a mild steel(SS41). Further a compatibility study of wrveral Ni base filler metals with the dissimilar joint between the two alloys was also included. The dissimilar weldability of Incoloy 825 with mild steel is strongly dependent upon the type of the filler metal used. Among the filler metals, ENiCrFe which has a chemical comosition similar to that of Incoloy 825 was found to be most compatible to the joint. In addition, a filler metal which showed a good cracing resistance in one dissimiar alloy combination was not necessarily graranteed to other combination. Microstructural examination with SEM, TEM and Auger revealed that the solidification cracking resestance of the dissimilar joint. between Incoloy 835 and SS41 was closely with the Ti+Nb content and with the content of a low melting eutectic phase of Laves relatibve to that of MC type phase.

• 한국세라믹학회지
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• 제31권9호
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• pp.957-968
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• 1994

Manufacturing process of porous glass by the filler method was studied. Commercial soda-lime-silicate glass powder was mixed with inorganic salt as the filler such as KCl, K2SO4, Na2SO4. Sintering shrinkages of mixed powders with the variation of sintering temperature were compared, and the effects of the fillers to shrinkages of mixed powder were increased in the order of Na2SO4${\mu}{\textrm}{m}$ of pore diameter were manufactured when the filler sizes 100~200 ${\mu}{\textrm}{m}$. The open pore volume of porous glass is determined by the quantity of filler and porous glasses having open pore volume between 30 and 70 vol% are available. Available sintering temperature range for preparation of porous glass is from the softening temperature of the glass powder to eutectic melting temperature of DTA curve of mixed powder.

• 한국분말재료학회지
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• 제11권1호
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• pp.69-73
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• 2004

The sintering characteristics of commercial 7xxx series Al-Zn-Mg-Cu alloy have been investigated. Sintering system of this blended elemental powder has aspects of both transient and supersolidus liquid phase sintering. Transient liquids occur when the constitution point during sintering lies in a solid phase region but where the sintering temperature is greater than either the melting point of one of the constituent or a eutectic temperature. Supersolidus liquid phase sintering occurs when a preblended powder is heated to a temperature between the solidus and liquids. However, these reaction were restrained their inter diffusion due to the appearance of the oxide film. Thus, 7xxx series Al alloy is extremely sensitive to process variables, including particle size, holding time and sintering temperature. Therefore, above phenomenons were observed formation and behaviour of the liquid by using SEM and DSC.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2005년도 추계 학술발표회 제17권2호
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• pp.371-374
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• 2005

In this study, calcium chloride($CaCl_2$), sodium chloride (NaCl), organic acids-containing deicer(NS 40, NS 100), mixed deicier($NaCl\;70\%\;+\;CaCl_{2}\;30\%,\;NS\;40\;70\%\;+\;CaCl_{2}\;30\%,\;NaCl\;70\%\;+\;NS\;40\;30\%,\;NS\;40\;70\%\;+\;NaCl\;30\%$) is investigated based on the laboratory test for deicing performance. Test items for deicing performance were ice melting and ice penetration, freezing point depressions and eutectic points, pH, thermal properties for selected deicing chemicals. As a test results, in case of the use chloride-containing deicier in area that concrete structures has subjected to freez-thaw reaction in winter season, it showed desirable method that use deicing chemicals mixed with optimum ratio rather than use one deicing chemicals when is consider to deicing performance and effects, corrosion of steel materials, freez-thaw resistance of concrete. When use various deicing chemicals mixed, NS40($70\%$)+Calcium chloride($30\%$) showed the best effective method.