• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.959-962
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• 2000

In this study, the micro shaft was fabricated by high speed etching process. The integration of the kinetic energy of circumference and the effect of etching takes less time to fabricate the micro shaft than any other conventional methods. First, the end part of the rod(SKD11) was dipped in chemical solution(FeCl$_3$) and the rod rotated at high speed(3500-10000rpm). Experimental setup was simply composed of high speed motor. chemical solution and $\Phi$ 1 mm rod. The main factors of diameter control are chemical concentration, reaction time and rpm. has a result. the diameter of the dipped rod was decreased by 200${\mu}{\textrm}{m}$ by high speed rotation and its shape and surface was good. From this experiment, we found the possibility to manufacture micro shaft without very expensive equipment.

• 산업기술연구
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• 제20권B호
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• pp.77-86
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• 2000

In order to observe the pattern forming of copper plate and chemical corrosion reaction, a study on the effect of the process parameters on the formation of micro-pattern by a photochemical etching of copper plate was carried out. The results are as follows : 1) Etching rate increases as the concentration of etchant increases under the regular condition of the temperature by the increasing of diffusion rate to surface. 2) Etching rate increases as the temperature of etchant increases by the fast acting of the material delivery of diffusion to surface under the regular condition of concentration. 3) It was found that etching speed increases as the material delivery of convection rising increased when the aeration speed of etchant increases. This result was from the fact acted by the material delivery of convection rising rather than material delivery of diffusion to the surface.

• 한국정밀공학회지
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• 제21권4호
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• pp.32-38
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• 2004

Laser-induced thermochemical wet etching of titanium in phosphoric acid has been investigated to examine the feasibility of this method fur fabrication of microstructures. Cutting, drilling, and milling of titanium foil were carried out while examining the influence of process parameters on etch width, etch depth, and edge straightness. Laser power, scanning speed of workpiece, and etchant concentration were chosen as major process parameters influencing on temperature distribution and reaction rate. Etch width increased almost linearly with laser power showing little dependence on scanning speed while etch depth showed wide variation with both laser power and scanning speed. A well-defined etch profile with good surface quality was obtained at high concentration condition. Fabrication of a hole, micro cantilever beam, and rectangular slot with dimension of tess than 100${\mu}{\textrm}{m}$ has been demonstrated.

• 한국전기전자재료학회논문지
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• 제16권8호
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• pp.731-735
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• 2003

Ti-indiffused LiNbO$_3$waveguide have been used to various high speed optical device based on electro-optic effect such as modulators, switches, and sensor, etc. In order to high speed modulation of optical modulator have, one of the further devices, needed to increasing of electrode surrounding air by LiNbO$_3$dry etching because of impedance matching for optical and RF phase velocity between waveguide and electrode. We studied property of LiNbO$_3$dry etching after waveguide patterning lot optical modulation by using neutral loop discharge (NLD) plasma.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.77-77
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• 2011

These days, a growing demand for memory device is filled up with the flash memory and the dynamic random access memory (DRAM). Although DRAM is a reasonable solution for current demand, the universal novel memory with high density, high speed and nonvolatility, needs to be developed. Among various new memories, the magnetic random access memory (MRAM) device is considered as one of good candidate memories because of excellent features including high density, high speed, low operating power and nonvolatility. The etching of MTJ stack which is composed of magnetic materials and insulator such as MgO is one of the vital process for MRAM. Recently, MgO has attracted great interest in the MTJ stack as tunneling barrier layer for its high tunneling magnetoresistance values. For the successful realization of high density MRAM, the etching process of MgO thin films should be investigated. Until now, there were some works devoted to the investigations on etch characteristics of MgO thin films. Initially, ion milling was applied to the etching of MgO thin films. However, ion milling has many disadvantages such as sidewall redeposition and etching damage. High density plasma etching containing the magnetically enhanced reactive ion etching and high density reactive ion etching have been employed for the improvement of etching process. In this work, inductively coupled plasma reactive ion etching (ICPRIE) system was adopted for the improvement of etching process using MgO thin films and etching gas mixes of $CH_4$/Ar and $CH_4$/$O_2$/Ar have been employed. The etch rates are measured by a surface profilometer and etch profiles are observed using field emission scanning emission microscopy (FESEM). The effects of gas concentration and etch parameters such as coil rf power, dc-bias voltage to substrate, and gas pressure on etch characteristics will be systematically explored.

• International Journal of Precision Engineering and Manufacturing
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• 제8권1호
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• pp.73-78
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• 2007

The objective of this work was to simulate lead frame etching characteristics to optimize the etching process, Characteristics such as the etching factor and uniformity were investigated for different actual operating conditions, including pressure, distance from the nozzle tip, pipe pitch, and feed speed. The correlation between the etching and spray characteristics was analyzed to develop the etching model. Spray characteristics obtained from an experiment using a phase Doppler anemometer system were then simulated using a Monte-Carlo technique, The etching process model was coded in the Java language, The spray and etching characteristics were correlated with each other and simulated results agreed well with the measured data for a lead frame etching process, The optimal operating parameters under various conditions were successfully determined.

• 한국정밀공학회지
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• 제23권1호
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• pp.72-79
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• 2006

The objective of this work is to simulate the etching characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, etching uniformity were investigated under different the actual operating conditions. The correlation between the etching characteristics and the spray ones were analyzed to simulate the etching characteristics in the etching process. To improve the etching characteristics in the etching process, effects of the various operating conditions such as pressure, distance from nozzle tip, pipe pitch, and feed speed should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo simulation. The etching process model was coded by Java language. It was found that the spray characteristics were correlated with the etching ones and simulation results generally agreed well with the measured results of etching characteristics in the etching process of Lead-Frame. The optimal operating parameters were successfully found under variable conditions.

• Fibers and Polymers
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• 제5권2호
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• pp.151-155
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• 2004

Cold plasma of $O_2$ or Ar was irradiated on hydrophobic Kapton surface to attenuate or remove the electrostatic potential. A measurement on charge dissipation speed clarifies the obscure effect of plasma. These consequences reveal that $O_2$ plasma etching is more effective than Ar plasma. After 30 days, the dissipation speed of accumulated charge on initially etched sample has not changed under summer season.

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2003년도 제120회 추계학술대회 제 5차 한ㆍ일 치과보존학회 공동학술대회
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• pp.618-618
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• 2003

The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed deamond saw. Scotchbond Multi-Purpose(group CM), Clearfil SE Bond(group SE), or Adper Prompt L-pop(group LP) were applied to the prepared teeth, and resin compasite(Z-250) was built up incrementally. Resin tag formation were evaluated by scanning electron microscopy, after removal of enamel surface by acid dissolution and dehydration.(중략)

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.160-160
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• 2008

In practical etching process, etch ant is sprayed on the metal-deposited panel through nozzles collectively connected to the manifold and that panel is usually composed of many PCB(printed circuit board)'s. The etching uniformity, the difference between individual PCB's on the same panel, has become one of most important features of etching process. In this paper, the prediction of nozzle trajectory has been performed by the combination of algebraic formula and numerical simulation. With the pre-determined geometrical factors of nozzle distribution, the trajectories of individual nozzles were predicted with the change of process operational factors such as panel speed, nozzle swing frequency and so on. As results, two dimensional distribution of impulsive force of etchant spray which could be considered as a key factor determining the etching performance have been successfully obtained. Though only qualitative prediction of etching uniformity have been predicted by the process developed in this study, the expansion to the quantitative prediction of etching uniformity is expected to be apparent by this study.