• Journal of Ocean Engineering and Technology
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• v.23 no.6
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• pp.117-123
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• 2009

This paper presents a numerical simulation of guided ultrasonic waves propagating in aluminum-epoxy-aluminum adhesive plates. In particular, this study investigated the effect of the epoxy thickness on the dispersive patterns, such as the phase velocity and group velocity of guided ultrasonic waves. In addition to investigating the dispersive curves, a numerical simulation using the pulse-echo method was carried out. This simulation showed that the degree of sensitivity of the epoxy thickness is dependent on the curvature of the phase and group dispersion curves, the maximum amplitude of the received time signals, and the peak frequency of the real components of the Fourier transform. Then, the linear relations between the epoxy thickness and the received and transformed signals were constructed to estimate the epoxy thickness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.468-469
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• 2007

$SF_6$ gas used widely as insulating component in electric power industry has excellent in insulation and arc extinguishing performance in gas-insulated switchgear. However, the concern about eco-friendly alternative gas is currently rising, because $SF_6$ gas is one of the main greenhouse gases. As one of the study for $SF_6$ free technology, composite-insulation technology is focused in this paper. To analyze the influence by epoxy thickness change, the composite-insulation composed of dry-air and epoxy was used in this paper. To analyze AC breakdown by the epoxy thickness, needle-plane electrode was used and needle was molded by epoxy. Under the gas pressure ranged from 0.1 to 0.6MPa, the breakdown voltage of dry-air were measured in AC electric field. The data of composite-insulation were acquired by changing the thickness of epoxy used in each composite-insulation under the same condition.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.2
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• pp.219-227
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• 2013

This paper reported a study on the thermal, mechanical and electrical insulation properties of epoxy/mica composites. To investigate the effect of mica content, glass transition temperature, mechanical properties such as tensile and flexural strength, and insulation breakdown properties for epoxy composites with various contents of mica. The effect of insulation thickness on insulation breakdown property was also studied. It was observed that tensile and flexural strength decreased with increasing mica content, while elastic modulus increased as the mica content increased. AC insulation breakdown strength for all epoxy/mica composites was higher than that of neat epoxy and that of the system with 20 wt% mica was 14.4% improved. As was expected, insulation breakdown strength at $30^{\circ}C$ was far higher than that at $130^{\circ}C$, and it was also found that insulation breakdown strength was inversely proportion to insulation thickness.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1389-1390
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• 2007

SF6 gas used widely as insulating component is rising as the environment problem. Electrical breakdown characteristics of epoxy and dry-air composite insulation was investigated on thickness of epoxy and pressure of dry-air under non-uniform field. The gap of needle to plane was from 2mm to 5mm. The pressure of dry-air was varied within the range of $0.1{\sim}0.6$ MPa. The thickness of a needle was 1mm and the curvature radius of a needle end was 100um. The diameter of a plane made of the stainless steel was 50mm. As a result of the experiment, breakdown voltage was increased about 3 times when epoxy was used. The impact that the thickness of epoxy influences on breakdown voltage was poor. It needs suitable thickness computation because the insulating gap of the gas is short as epoxy thickness increases.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.623-629
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• 2014

For the semiconductor device safety from over current in the digital electronic circuit system must be surely designed that it's surface mount type micro fuse device. In this paper, We has analysed to the fusing character of micro fuse as a function changed thickness of thermosetting ink epoxy. To the change of thermosetting ink epoxy thickness with in production lot, in the electrically character (fusing test in the 2 multiple over current and 10 multiple over current, surface temperature test in the 1.25 multiple over current) of micro fuse has been tested. According to the electrically character result, changed thickness of thermosetting ink epoxy in designed micro fuse withheld direct effect in both end resistance changes. Also, because high thermal energy in the micro fuse test of over current was occurred to effect such as thermal runaway and explosion. Therefore, screen printing process in the design of micro fuse using thermosetting ink epoxy is very important for production quality improvement.

• Journal of the Korean Society of Food Science and Nutrition
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• v.33 no.2
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• pp.447-450
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• 2004

Overall migration through epoxy layer coated wood was investigated to estimate the coating thickness satisfying the regulatory limit. As an index of overall migration, KMnO$_4$ oxidizable extractives by the food simulant water solution was used. Migration pattern in interest range could described by a simple diffusion model and the temperature dependence of the permeability index could be explained by Arrhenius equation. The thickness of epoxy coating greater than 0.004 mm was analyzed to be required for satisfying the regulatory guideline.

• Journal of the Korean Ceramic Society
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• v.25 no.1
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• pp.7-14
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• 1988

In this paper, piezoelectric composite materials of 1-3 connectivity were prepared by using "dicing-filling" technique with PZT ceramics and epoxy polymers, and the dependence of piezoelectric properties on the thickness of specimens was investigated. In case that the PZT volume percent is 18.1%, according to an increment of thickness, the dielectric constant of composites( 33) is unchangeable, which is about 200, the piezoelectric coefficient (d33) is somewhat increased, which is about 240-280 (PC/N) and the electromechanical coupling factor of thickness mode(kt) is proportioned, but radial mode(kp) is constant.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.297-304
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• 2012

Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.17 no.2
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• pp.95-101
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• 2003

In this paper, partial discharges(PDs), lift off and breakdown voltage were measured when metal particles existed in a model GIS coated with epoxy resin on its bottom electrode, and the measured results were analyzed after comparing with the model DIS not coated. In order to presume the various fault case in GIS, we measured the experimental values with changing some experimental factors, such as the mixture ratio of SF$\_$6//N$_2$, the pressure of the gases, the kinds and diameter of the metal particles, and the coating thickness of the epoxy resin. As a result, the PDIV increased with the thickness of the epoxy resin, while the magnitude of PDs decreased at the same condition. The lift off voltages of steel alloy particles were higher than that of copper particles, and increased wit diameter of particles. Futhermore, the lift off voltages in the case of the electrode coated with epoxy resin were higher than that in the case of the uncoated one. In addition, the thicker the thickness of the epoxy resin was, the higher the breakdown voltage were. Thus, it was confirmed that the GIS coated with epoxy resin on its inner surface could be improved in insulation performance.

• Proceedings of the KSR Conference
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• 2005.05a
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• pp.251-256
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• 2005

This study was performed the heat transportation ratio of three types of the following sandwich panel by KS F 2278(2003) ; Type ${\sharp}1$ : Carbon/epoxy Aluminum Honeycomb and Balsa Core Sandwich Panel(Thickness : 37mm), Type ${\sharp}2$ : Carbon/epoxy Aluminum Honeycomb Core Sandwich Panel(Thickness : 57mm), and Type ${\sharp}3$ : Carbon/epoxy Aluminum Honeycomb Core Sandwich Panel(Thickness : 37mm). Also was performed the heat transportation of next three types of the following sandwich panel by KS F2277(2002) ; Type ${\sharp}4$ and ${\sharp}5$ : 27mm, and 35mm thick-Aluminum Honeycomb Sandwich Panels, and Type ${\sharp}6$ : 27mm thick-Foaming Aluminum Sandwich Panel. It is the larger area between the skin and core, the heat transportation ratio is the higher, and when it is composed of the hybrid composite structure, good insulation property was shown.