• 한국염색가공학회지
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• 제29권1호
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• pp.37-44
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• 2017

An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

• 한국재료학회지
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• 제11권12호
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• pp.1009-1013
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• 2001

The effects of coupling agent on the interface characteristics between epoxy resin and natural zeolite were studied by SEM, optical microscope and universal testing machine (UTM). Epoxy resin as a matrix was diglycidyl ether of bisphenol A (DGEBA)/4,4'-methylene dianiline (MDA)/malononitrile (MN) system and natural zeolite as an inorganic fillet was produced in Korea. With the increment of zeolite content, tensile strength decreased and it was due to the different elastic moduli of two materials. When external stress was loaded on the composites, the stress concentrated on the weakly bonded interface and crack grew easily. To improve the interface characteristics, the surface of the natural zeolite was treated with the silane coupling agent and it was found that the tensile strength was increased. The morphology of the interface showed that the bonding characteristics were modified by coupling agent.

• 한국분말재료학회지
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• 제15권2호
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• pp.119-124
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• 2008

To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.

• Carbon letters
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• 제21권
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• pp.1-7
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• 2017

The effects of ammonia-treated graphene oxide (GO) on composites based on epoxy resin were investigated. Ammonia solutions of different concentrations (14-28%) were used to modify GO. Nitrogen functional groups were introduced on the GO surfaces without significant structural changes. The ammonia-treated GO-based epoxy composites exhibited interesting changes in their mechanical properties related to the presence of nitrogen functional groups, particularly amine ($C-NH_2$) groups on the GO surfaces. The highest tensile and impact strength values were 42.1 MPa and 12.3 J/m, respectively, which were observed in an epoxy composite prepared with GO treated with a 28% ammonia solution. This improved tensile strength was 2.2 and 1.3 times higher than those of the neat epoxy and the non-treated GO-based epoxy composite, respectively. The amine groups on the GO ensure its participation in the cross-linking reaction of the epoxy resin under amine curing agent condition and enhance its interfacial bonding with the epoxy resin.

• 한국염색가공학회지
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• 제29권2호
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• pp.77-85
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• 2017

The interfacial adhesion between fiber and matrix affects the physical properties of fiber reinforced composites. In this study, 3-(Methacryloyloxy)propyltrimethoxy silane(MPS) coupling agent was used to increase the interfacial adhesion between polyketone fiber and epoxy resin. The change of surface chemical composition of polyketone fiber treated with MPS was analyzed using a FTIR-ATR. The interfacial bonding between fiber and resin increased with silane coupling agent largely. Consequently, interfacial shear strength(IFSS) was enhanced with increasing concentration of MPS coupling agent and thus, the physical properties of the composites such as flexural properties and dynamic mechanical properties were changed. Flexural strength and modulus increased when the MPS concentration was higher than 0.5wt%. The dynamic storage modulus of Polyketone/Epoxy composites treated with MPS was higher than that of the untreated one. When the MPS concentration of 3wt%, the highest storage modulus was obtained.

• Journal of the Korean Wood Science and Technology
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• 제35권3호
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• pp.36-44
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• 2007

본 연구의 목적은 천연자원이며 저렴한 콩기름의 이용을 위하여 기존 에폭시수지와 에폭시 콩기름(Epoxidized soybean oil: ESBO)을 혼용한 접착제의 물성과 반응성, 경화거동 및 열안정성을 구명하는 것이다. 이에 epoxy/ESBO의 혼합비율을 달리하여 접착력, 필름의 내수성, 열적성질, 반응성 및 포름알데히드와 TVOC 방산량에 대해 시험해 보았다. Epoxy resin/ESBO의 각 혼합비율에 대한 상태접착력 시험을 실시한 결과 혼합비율 9 : 1일 때 가장 우수한 접착력을 보였으며 혼합비율 2 : 8일 경우 가장 낮은 값을 보여 2 : 8과 1 : 9를 두 경우를 제외한 9가지 경우 모두 KS 합판 접착성(비내수) 규격인 $7.0kgf/cm^2$를 모두 상회하고 있었고, 준내수접착력을 실시한 결과 혼합비율이 9 : 1일 때 가장 우수하게 나타났으며 5 : 5일 때 가장 낮은 강도를 보였다. 혼합된 접착제의 내수성을 재검토하기 위해 필름을 제조하고 가열하여 필름의 상태와 두께 및 신장률을 조사한 결과 수분흡수율이나 두께 및 신장율의 변화는 없었다. Epoxy resin/ESBO의 각 혼합비율에 대한 Tg점은 $120{\sim}110^{\circ}C$ 사이에 나타났으며 가장 높은 Tg점은 혼합비율 10 : 0의 $122^{\circ}C$이며 7 : 3, 8 : 2, 9 : 1 순으로 나타났다. Epoxy resin/ESBO의 각 홉합비율에 대한 IR스펙트럼을 조사한 결과, 에폭시수지의 에폭시밴드는 모두 경화반응하나 ESBO는 완전히 경화된다고 판단하기 어렵다. Epoxy resin/ESBO의 각 혼합비율에 대한 열안정성 검토결과 ESBO 혼합 비율이 증가할수록 열안정성은 떨어지는 것을 확인할 수 있었다. 위와 같은 실험결과를 종합하여 봤을 때 epoxy resin/ESBO의 혼합접착제에서의 ESBO는 에폭시접착제의 증량제수준의 역할임을 실험을 통하여 확인할 수 있었으며, ESBO를 접착제로 활용하기 위해서는 경화반응을 유도할 수 있는 경화조건이 확립되어야 한다고 판단된다.

• Structural Engineering and Mechanics
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• 제82권2호
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• pp.163-172
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• 2022

Zinc-rich epoxy (ZRE) is used to overcome corrosion problems in reinforced concrete (RC) beams and coat steel rebars to protect them from humidity and chlorides. An extra coating layer of Sikadur-31 epoxy (SDE) is utilised to increase bond strength because the use of ZRE reduces the bond strength between concrete and steel rebars. However, the low melting point of SDE indicates that concrete specimens are vulnerable to fire. An experimental investigation on flexural performance of RC beams incorporating ZRE-SDE coating of steel rebars that were destroyed by fire is performed in this study. Twenty beams of five concrete mixes with different cementitious contents were tested to compare fire exposure for coated and uncoated rebars of the same beams at room temperature and determine the optimal cementitious content. Scanning electron microscopy (SEM) was also applied to investigate characteristics of fired mixture samples. Results showed that the use of SDE-ZRE at room temperature improves flexural strengths of the five mixes compared with uncoated rebars with percentages ranging from 8.5% to 12.3%. All beams with SDE-ZRE lost approximately 50% of their flexural strength due to firing. Moreover, the mix incorporating SF (silica fume) of 15% and cement content of 400 kg/m³ introduces optimum behaviour compared with other mixes. All results were supported and verified by the SEM analysis and compressive strength of cubic specimens of the same mixes.

• Elastomers and Composites
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• 제50권3호
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• pp.167-174
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• 2015

Anionic epoxy compound was synthesized and added to asphalt aiming to prepare self-healing asphalt. Epoxy-modified asphalt showed excellent modification effect and healing effect as well. The results revealed that with 5% addition of polymer the tensile strength, impact strength and complex shear modulus of the polymer-modified asphalt increased by 65%. 64% and 35%, respectively. It seems that high interaction occurs between polymer and asphalt matrix. Self-healing efficiency of the polymer-modified asphalt based on tensile strength showed 100%, comparing to 79% of straight asphalt. In impact experiment the polymer-modified asphalt showed 99% of healing efficiency, comparing to 77% of straight asphalt. In rheological experiment the polymer-modified asphalt showed 103% of healing efficiency, comparing to 72% of straight asphalt. It appears that the ionic bonding existing in epoxy polymers contributed to high values of self-healing efficiency. The polymer which has high intermolecular force fills the crack of the asphalt, pulling the opponent side each other, and so the original properties were restored.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.509-510
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• 2007

The Breakdown properties of epoxy composites are used for transformers and sensor, which has been studied. As a result, From the measurements of breakdown voltage, the more hardener is increased the stronger breakdown strength at low temperature because the ester of hardener is increased. Breakdown strength at the high temperature is decreased because the temperature at $110^{\circ}C$ is near at $T_g$. When the filler is added, between epoxy and silica is formed interface. Therefore the charge is accumulated in it, and the electric field is concentrated, and breakdown strength is decreased than non-filled specimens. In the case of specimens, the treated with silane, the breakdown strength becomes much higher since this is suggested that silane coupling agent has been improved chemical bonding in the interfaces and has been relaxed the electric filed concentration.

• Journal of Welding and Joining
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• 제33권5호
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.