• Advances in aircraft and spacecraft science
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• 제4권6호
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• pp.729-744
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• 2017

This investigation highlights rationale of electrically conductive nano adhesives for its essential application for Electromagnetic Interference (EMI) Shielding in satellites and Lightning Strike Protection in aircrafts. Carbon Nano Fibres (CNF) were functionalized by electroless process using Tollen's reagent and by Plasma Enhanced Chemical Vapour Deposition (PECVD) process by depositing silver on CNF. Different weight percentage of CNF and silver coated CNF were reinforced into the epoxy resin hardener system. Scanning Electron Microscopy (SEM) micrographs clearly show the presence of CNF in the epoxy matrix, thus giving enough evidence to show that dispersion is uniform. Transmission Electron Microscopy (TEM) studies reveal that there is uniform deposition of silver on CNF resulting in significant improvement in interfacial adhesion with epoxy matrix. There is a considerable increase in thermal stability of the conductive nano adhesive demonstrated by Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA). Four probe conductivity meters clearly shows a substantial increase in the electrical conductivity of silver coated CNF-epoxy composite compared to non-coated CNF-epoxy composite. Tensile test results clearly show that there is a significant increase in the tensile strength of silver coated CNF-composites compared to non-coated CNF-epoxy composites. Consequently, this technology is highly desirable for satellites and EMI Shielding and will open a new dimension in space research.

• 보존과학회지
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• 제31권1호
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• pp.37-46
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• 2015

현재 토기 및 도자기를 보존처리 할 때 사용되고 있는 접착 복원제의 경우 크게 Epoxy계, Cellulose계, Cyanoacrylate계 등이 사용되고 있으나 재료에 따라 심한 수축으로 인한 재탈락, 황변 현상으로 인한 색상 변화, 사용시 도구와 손에 묻어나오는 불편한 작업성, 비가역성 등 다양한 문제점을 나타내고 있다. 본 연구에서는 도자기 복원용으로 사용되고 있는 Epoxy resin의 황변 현상과 비가역성의 문제점 해결을 목적으로 저황변, 가역성이 우수한 Urethane계 합성수지를 개발하였다. 개발된 Urethane resin의 접착력은 원액 2.07MPa로 기존 재료인 $EPO-TEK301^{(R)}$ 1.21MPa로 1.5배 이상의 우수한 물성을 지니고 있다. 가공성 측정 결과 Urethane resin(in Talc 50wt%)의 마모율이 1.09%로 기존 재료인 Quick $Wood^{(R)}$(1.02%)의 마모율 보다는 다소 높게 측정되었으며, EPO-$TEK301^{(R)}$(0.41%)와 $L30^{(R)}$ (0.39%)보다 는 2배 이상의 마모율을 보이고 있어 기존의 재료보다 쉽게 성형 과정이 이루어질 수 있는 장점을 지니고 있다. Urethane resin의 장점인 가역성 실험은 Acetone, Ethyl Alcohol 침적 후 12시간 경과 후 Urethane resin과 충전제인 Talc가 분말화 현상을 나타내며 100% 용해되었으며, 기존 Epoxy resin의 가역성이 0%인 것에 비해 매우 우수한 가역성을 지니고 있다. 내구성 평가를 위한 자외선 실험 결과 Urethane resin의 원액 기준 ${\Delta}E^*ab$ 색상 변화 값이 자외선 노출 전 후 2.76로 기존의 Epoxy resin보다 약 7~20배 정도 줄어 황변 현상으로 인한 이질감의 문제점을 최소화하였다.

• Journal of Information Display
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• 제4권1호
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• 마이크로전자및패키징학회지
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• 제17권1호
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• pp.41-46
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• 2010

스크린 프린팅된 Ag 박막과 에폭시 수지로 코팅된 폴리이미드 사이의 계면접착력을 $180^{\circ}$ 필 테스트를 통해 정량적으로 구하였다. 스크린 프린팅된 Ag 박막과 에폭시 수지 코팅된 폴리이미드 사이 필 강도는 $164.0{\pm}24.4J/m^2$이었다. 오븐에서 $120^{\circ}C$ 조건에서 24시간 동안 열처리 한 Ag/폴리이미드의 필 강도는 $220.8{\pm}19.2J/m^2$로 증가하였고, $85^{\circ}C/85%$ 상대습도 조건에서 120시간 동안 유지한 Ag/폴리이미드의 필 강도는 $84.1{\pm}50.8J/m^2$로 감소하였다. 전계방출형 주사전자현미경과 XPS를 통해 박리된 시편 표면을 분석한 결과, 열처리 및 고온/다습조건처리 시 스크린 프린팅 Ag 박막과 에폭시 수지 코팅층 사이의 계면접착력은 에폭시 수지와 수분 사이의 가수분해 결합 반응으로 인해 계면접착력 증가 및 감소하는 경향과 밀접한 연관성이 있는 것으로 판단된다.

• 한국재료학회지
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• 제21권5호
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

• 보존과학회지
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• 제30권1호
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• pp.103-109
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• 2014

본 연구는 토 도기 보존 처리과정에 있어서 결손부위를 복원하는 재료의 문제점과 단점 등을 보완한 재료를 개발하고자 하였다. 우선 기존 재료의 문제점으로는 높은 수축률과 낮은 접착력으로 인한 2 차 파손의 문제, 심한 황변현상으로 인한 이질감의 문제, 재료의 비가역성으로 인한 재용해의 문제 및 높은 강도로 인한 가공성의 문제, 작업 과정 중 긴 경화 시간으로 인한 처짐 현상 및 도구나 장갑에 묻어 유물의 표면을 오염시키는 문제 등이 있다. 이러한 문제점을 해결하기 위해 현재 사용되고 있는 토 도기 복원 재료들 중 Epoxy 수지를 중심으로 종류 및 물성을 파악한 후 개발 목표를 설정하였다. 개발 된 Epoxy는 5 분 내외에 경화가 이루어지는 토기 복원용 Epoxy Putty이다. 토기 복원 방법에 있어서 Epoxy Putty의 경우 페이스트(Paste) 형태로 빠르게 경화되어 작업의 편리성을 높였으며, 표면 오염 등의 단점을 보완하였다. 또한 Epoxy 원액에 백색의 Micro-balloon을 사용함으로 인해 Coloring에 용이하고 경량화하도록 하였으며, 저수축 및 가공성이 우수한 복원 재료를 개발하였다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 춘계 학술발표회 논문집(II)
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• pp.349-352
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• 2006

Pull-off test is generally used as a method of evaluating bond strength of FRP with concrete at the job site. However, pull-off test damages FRP composites and the maximum pull-off strength is limited up to tensile strength of concrete. Accordingly, it is required to set-up a test method that can simply evaluate bond performance of structural adhesive. This study suggested compression and bending test of epoxy resin as test methods that can indirectly evaluate performance of adhesive, as well as standardized test specification for different types of specifications from various countries. In this study, the section dimension of compression and bending test specimens is unified, and standard test specimen size is achieved by test results.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 춘계 학술발표회 논문집(II)
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• pp.353-356
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• 2006

Hardening of 2 component adhesive such as epoxy resin used in saturating FRP composite is triggered by mixing each component part within a batch. Chemical reactions occur explosively after a certain time after mixing the batch, viscosity and temperature rapidly increase. As a results, bond performance remarkably decreases and workability declines due to increase in viscosity. Therefore, adhesion should be completed before chemical hardening reaction is rapidly going on. This study examined pot life of structural adhesive for FRP composites by means of change in apparent viscosity and means of exothermic reaction temperature proposing in existing test standards. Result of each test method was compared and analyzed, and reasonable test method and evaluation method are suggested.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집A
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• pp.38-43
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• 2001

The interfacial adhesive joining characteristics of the foams are very important for the structural integrity of sandwich structures. Peel strength is one of the best criteria for the interfacial characteristics of the sandwich structures and peel energy is most commonly used for the interfacial characteristics. The peel strength is the first peak force per unit width of bond line required to produce progressive separation by the wedge or other crack opening type action of two adherends where one or both undergo significant bending and the peel energy is the surface active energy per unit width of bond line. In this work, to investigate the strengthening effect of resin treatment on the interfacial surface of foam material, peel strength and peel energy of epoxy resin treated polyurethane foam core sandwich structures were obtained by the cleavage peel tests and compared with those of non surface treated polyurethane foam core sandwich structures.

• 방사선산업학회지
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• 제4권1호
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• pp.19-23
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• 2010

Vinyl ester (VE) resins, introduced in the late 1960s, have made large strides in reinforced plastics applications as adhesive and matrix materials on their appropriate mechanical performance characteristics in the glassy state. Generally, VE resins are a group of dimethacrylate resins based on bisphenol A type epoxy resin. They exhibit easy handling properties as well as good resistance to most chemical agents due to their mechanical and thermal properties. In this study, the effects of curing methods of vinyl ester resins on gel contents, flexural strength and dynamic mechanical properties were investigated. Thermal curing (room temperature, $80^{\circ}C$) and electron beam curing were used to crosslink a VE resin/styrene complex (65/35 wt%) with methyl ethyl ketone peroxide (MEKPO) as a catalyst and an 8 wt% cobalt naphthenate in styrene solution as a accelerator. For the samples, gel contents as well as flexural strength and dynamic mechanical properties were characterized and compared by soxhlet apparatus, universal testing machine (UTM) and dynamic mechanical analysis (DMA). As a result, the electron-cured VE resin was confirmed as a better condition than those for gel contents, flexural strength and dynamic mechanical properties, respectively.