• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.228-228
• /
• 2008

본 논문에서는 epoxy bonding film의 phenoxy resin의 함량변화에 따른 특성 변화에 대하여 연구하였다. epoxy bonding film은 미세패턴 구현을 위해서 사용되는 기판재료로써 epoxy, hardener, silica, phenoxy resin 등이 첨가되어진다. phenoxy resin 함량을 변화를 주면서 tape casting 방법을 통해서 flim 형성을 한 후, 제작된 film의 phenoxy resin 함량변화에 따른 조도 특성의 연구를 위해서 sweller, desmear 공정을 후 RA(Roughness Average)를 측정하고, SEM으로 표면을 관찰하였다. 또한 제작된 bonding film을 가열 가압 후 구리 도금공정을 거쳐 peel strength를 측정하였다. phenoxy resin 함량이 증가 할수록 RA가 증가되어지는 것이 관찰되어졌고, 또 한 peel strength 증가하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.1
• /
• pp.35-40
• /
• 2007

The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.653-654
• /
• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.663-667
• /
• 2005

Surface modified carbon nanotubes were applied into the epoxy composites to investigate its tribological property. Carbon nanotubes reinforced epoxy composites were fabricated by casting. Effects to the tribological property of loading concentrations and types of surface modification of carbon nanotubes were investigated under sliding condition using linear reciprocal sliding wear tester. The results show that the small amount of carbon nanotubes into the epoxy exhibited lower weight loss than the pure epoxy. It is concluded that the effect of an enormous aspect ratio of carbon nanotubes surface area which wider than conventional fillers that react as interface for stress transfer. As increased the contents of carbon nanotubes, the weight loss from the wear test was reduced. And the surface modified carbon nanotubes show better tribological property than as produced carbon nanotubes. It is due that a surface modification of carbon nanotubes increases the interfacial bonding between carbon nanotubes and epoxy matrix through chemical bonding. Changes in worn surface morphology are also observed by optical microscope and SEM for investigating wear behaviors. Carbon nanotubes in the epoxy matrix near the surface are exposed, because it becomes the lubricating working film on the worn surface. It reduces the friction and results in the lower surface roughness morphology in the epoxy matrix as increasing the contents of the carbon nanotubes.

• Tribology and Lubricants
• /
• v.21 no.6
• /
• pp.302-305
• /
• 2005

Various carbon nanotubes (CNTs) are added into the epoxy matrix as reinforcements to investigate the effect on the wear behavior. Effects to the tribological properties of different loading concentrations and types of surface modification are investigated by using a linear reciprocal wear tester. As increasing the concentration of CNTs shows the reduction of the wear loss. Moreover, surface modified CNTs give better tribological property than as produced CNTs. It is due that the functional groups on the surface of CNTs increase the interfacial bonding between CNTs and epoxy matrix through chemical bonding. Changes in worn surface morphology are observed by optical microscope and SEM to investigate the wear behavior. CNTs in the epoxy matrix near the surface are exposed and it becomes the lubricating working film on the worn surface. It reduces the friction and results in the lower surface roughness morphology in the epoxy matrix as increasing the contents of the CNTs.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.2
• /
• pp.65-70
• /
• 2014

Warpage of top packages to form thin package-on-packages was measured with progress of their process steps such as PCB substrate itself, chip bonding, and epoxy molding. The $100{\mu}m$-thick PCB substrate exhibited a warpage of $136{\sim}214{\mu}m$. The specimen formed by mounting a $40{\mu}m$-thick Si chip to such a PCB using a die attach film exhibited the warpage of $89{\sim}194{\mu}m$, which was similar to that of the PCB itself. On the other hand, the specimen fabricated by flip chip bonding of a $40{\mu}m$-thick chip to such a PCB possessed the warpage of $-199{\sim}691{\mu}m$, which was significantly different from the warpage of the PCB. After epoxy molding, the specimens processed by die attach bonding and flip chip bonding exhibited warpages of $-79{\sim}202{\mu}m$ and $-117{\sim}159{\mu}m$, respectively.

• Korean Journal of Materials Research
• /
• v.34 no.3
• /
• pp.125-137
• /
• 2024

Composite laminates are used in a wide range of applications including defense, automotive, aviation and aerospace, marine, wind energy, and recreational sporting goods. These composite beams still exhibit problems such as buckling, local deformations, and interlaminar delamination. To overcome these drawbacks, a novel viscoelastic autoclave bonding with tapered epoxy reinforcement polyurethane films is proposed. In existing laminates, compression face wrinkling and interlaminar delamination is caused in the sandwich beam. The unique viscoelastic autoclave spunbond interlayer bonding is designed to prevent face wrinkling and absorb and distribute stresses induced by external loads, thereby eliminating interlaminar delamination in the sandwich beam. Also, the existing special reinforcement causes stress concentrations, and the core is not effectively connected, which directly affects the stiffness of the beam. To address this, a novel tapered epoxy polyurethane reinforcement adhesive film is proposed, whose reinforcement thickness gradually tapers as it enters the core material. This minimizes stress concentrations at the interface, preventing excessive adhesive squeeze-out during the bonding process, and improves the stiffness of the beam. Results indicate the proposed model avoids the formation of micro cracks, interlaminar delamination, buckling, and local deformations, and effectively improves the stiffness of the beam.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.165-165
• /
• 2009

현재 반도체나 이동통신 분야는 사용자의 요구에 따라 PCB의 회로선폭이 갈수록 좁아지고 있다. 이러한 정밀 부품을 제조하기 위한 제조공정에서 각광받기 시작한 기술 중 하나가 대기압 플라즈마 기술이다. 본 연구에서는 미세패턴 형성이 가능한 에폭시 본딩 필름위에 무전해 도금공정을 통한 패턴 도금법을 이용하여 패턴을 형성하였고, 형성된 패턴에 대기압 플라즈마 처리 횟수에 따른 접촉각(Contact Angle)과 Peel Strength의 변화를 분석하였다. 또한 에폭시 본딩 필름을 이용한 Build-up공정을 거쳐 Micro Via를 형성하여 대기압 플라즈마 처리 횟수에 따른 Via 표면을 분석하였다. 대기압 플라즈마 기술은 진공식에 비해 소규모 장비를 이용한 전처리가 가능하고, 초기 설비비용을 절감하는데 탁월한 효과가 있어 널리 사용하는 기술 중 하나이다. 이 연구를 통하여 대기압 플라즈마 처리 횟수에 따른 표면에너지의 변화로 인한 접촉각이 좋아지는 것을 알 수 있으며, 대기압 플라즈마 처리를 한 패턴표면이 친수성으로 변하면서 현상된 드라이 필름 사이로 도금액이 원활히 공급되어서 미세패턴 모양이 우수하게 구현되었음을 알 수 있었다. 또한 Via Filling에도 뛰어난 효과가 있었음을 확인할 수 있었다.

• Journal of Adhesion and Interface
• /
• v.5 no.2
• /
• pp.1-7
• /
• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.4
• /
• pp.388-394
• /
• 2008

For purpose of anti-static film remaining unchanged in the condition of $160^{\circ}C$, organic solvent, acid and base solution $0.01\sim0.03{\mu}m$ particles of Sb doped tin oxide(ATO) were grafted by 3-Glycidyloxypropyltrimethoxysilane(GPTS) for improving interfere bonding force between ATO and epoxy resin. The particles were dispersed in 2-methoxyethanol with YD-I28(Bisphenol A type epoxy resin, Kukdo chemical) and 1-imidazole as hardener. The anti-static solutions were coated on PI film as thickness of $0.1{\mu}m$. Surface resistivity of anti-static film containing conductive polymer became $10^{12}\Omega/\Box$ after 32 hours in $160^{\circ}C$. The surface resistivity of ATO grafted by GPTS / Epoxy coating layer remained as $10^{7.6}\Omega/\Box$ in $160^{\circ}C$ for 7 days. ATO grafted by GPTS / Epoxy coating layer coated on PI film was dipped in acetone for 7 days. The surface resistivity remained unchanged as $10^{7.6}\Omega/\Box$. The anti-static layer dipped in water solutions containing each KOH 10 wt % and $H_2SO_4$ 2 wt% was ultra-sonicated for 10 minutes per once until 30th. The surface resistance of anti-static layer containing ATO grafted by GPTS remained unchanged.