• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.42 no.4
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• pp.47-52
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• 2005

In this paper, the genetic algorithm is used to design a fixed order square decoupling $H_{\infty}$ controllers based on the Two-Degree-of-freedom standard model. The proposed decoupling $H_{\infty}$ controller which is minimizes the maximum energy in the output signal is designed to reduce the coupling properties between the input/output variables which make it difficult to control a system efficiently. A minimal set of assumptions for existence of the decoupling controller formula is described in the state-space formulas. It is verified by an example.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.2317-2318
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• 2008

This report is about wireless energy transform system. It means something to charge without a line of contact. Existing charging has been many defect, including badness of the line, limitation of the space and the time and so on But this is one of the way that can complement it. So our goal is making the wireless charger that is effective and easy to use.

• Journal of The Korean Association For Science Education
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• v.13 no.1
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• pp.80-91
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• 1993

The purpose of this study is to develop an reliable instrument for evaluating science inquiry skills through an R&D procedure. A total of ten seience inquiry skills were selected for the development of the instrument, ie, observation, classifying, recognizing problems, measuring, inferring, formulating hypothesis, controlling variables, experimenting, interpreting and drowing a conclusion. And three items were developed for each sceince inquiry skill, totaling up to thirty items. The content areas of developed items are divided into three categories, material and energy, life and environment, and the earth and the space. There are 10 items for each category. The content validity and the objectivity of developed items were checked, verified in the two field trials and revised according to the analysis of items by seven experienced specialists with the degree of doctors in science education and five teachers who were studying for their master's degree in science education. According to the results of the second field trial. the content validity of the instrument was 91.1%, reliablity(K-R 20) 0.78, defficulty index 49.13%, discrimination index 0.42, mean achivement 61.85%, standard deviation 5.11, and standard error 2.40. Considering the above results, the developed instrument in this study is regarded as a appropriate instrument for evaluating science inquiry skills of elementary school students.

• Structural Engineering and Mechanics
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• v.67 no.3
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• pp.233-244
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• 2018

This study aims at evaluating the performance of repairing technique with CFRPs in recovering cyclic performance of damaged columns in flexure in terms of structural response parameters such as strength, dissipated energy, stiffness degradation. A 2/3 scaled substandard reinforced concrete frame was constructed to represent the substandard RC buildings especially in developing countries. These substandard buildings have several structural deficiencies such as strong beam-weak column phenomenon, improper reinforcement detailing and poor material properties. Flexural plastic hinges occurred at the columns ends after testing the substandard specimen under both constant axial load and reversed cyclic lateral loading. Afterwards, the damaged columns were externally wrapped with CFRP sheets both in transverse and longitudinal directions and then retested under the same loading protocol. In addition, ambient vibration measurements were taken from the undamaged, damaged and the repaired specimens at each structural repair steps to identify the effectiveness of each repairing step by monitoring the change in the natural frequencies of the tested specimen. The ambient vibration test results showed that the applied repairing technique with external CFRP wrapping was proved to recover stiffness of the pre-damaged specimen. Moreover, the lateral load capacity of the pre-damaged substandard RC frame was restored with externally bonded CFRP sheets.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.10
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• pp.823-831
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• 2007

This paper presents the experimental and simulation study of a loop heat pipe (LHP) that can be applied to present electronics, space missions and thermal control systems. The present experimental study was carried out employing sintered alumina ceramic wick ($d=2.96\;{\mu}m$, ${\phi}=0.61$). High purity R-134a, R-22 and water were also used as alternative working fluids in addition to ammonia. The experimental study showed that the maximum heat transfer performance for the test LHP in the vertical top heating mode was over 100 Watts when ammonia was used as the working fluid. The simulation results have been compared with the experimental results to validate a simulation model based on the thermal resistance network that was developed to evaluate the performance of LHPs, focusing on their prospective applications in electronics. The simulation model is based on the loop overall energy, mass, and momentum balance. The simulation program can predict the effects of various parameters which affect the performance of LHP within 5% compared with the experimental results.

• Advances in materials Research
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• v.5 no.3
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• pp.181-192
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• 2016

In this work effect of high energy milling on the structural and electrical properties of $Ba(Fe_{1/2}Ta_{1/2})O_3$ (BFT) ceramic synthesized using standard solid-state reaction method were investigated. X-ray diffraction studies indicated that the unit cell structure for all the samples to be hexagonal (space group: P3m1). FTIR spectra also confirmed the formation of BFT without any new phase. The milled (10 h) BFT ceramic showed the formation of small grain sizes (<$2{\mu}m$) which is beneficial for dielectric applications in high density integrated devices. Besides, the milled (10 h) BFT ceramic sample exhibited superior dielectric properties (enhancement in ${\varepsilon}^{\prime}-value$ and reduction in $tg{\delta}-value$) compared to un-milled one. Impedance analysis indicated the negative temperature coefficient of resistance (NTCR) character. The correlated barrier hopping model (jump relaxation type) is found to successfully explain the mechanism of charge transport in present ceramic samples.

• Journal of the Korean Applied Science and Technology
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• v.37 no.5
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• pp.1402-1408
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• 2020

In order to save energy, a lot of research has been conducted to develop a high-efficiency heat pump. Research to reduce or eliminate the occurrence of frost in the outdoor unit coil is also being conducted at the same time. A constant temperature chamber was constructed that allows experimentation under the same conditions as in the natural state so that frost does not occur in the outdoor unit of the heat pump regardless of the season. In order to verify the validity of the experimental apparatus, a simulation was conducted by dividing the straight length of the duct in front of the outdoor unit in the constant temperature chamber, which is the experimental apparatus, into three conditions. As a result, it was found that a straight space must be secured 10 times the diameter of the duct.

• Korean Journal of Computational Design and Engineering
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• v.18 no.5
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• pp.367-373
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• 2013

In this study, the penetration characteristic from the cubic and cylindrical penetrator consisting of tungsten material with the velocity of 2,300 m/s is evaluated and the penetration possibility into the target is confirmed. The design of shape and size of penetrator is directly related to space and weight of the warhead. AUTODYN-3D simulation is used to study the penetration effect of penetrator. The purpose of numerical analysis is to verify the penetration characteristic with various L/D penetrator. The penetration performance of penetrator with identical weight due to the shape is also confirmed. The cylindrical and cubic penetrator has enough penetration energy on constant target body. Because the possibility of 2'nd penetration is important factor after 1'st penetration into target body, residual velocity of residual mass must be existed as much as possible. As geometrical shape ratio increases, penetration performance is confirmed to improve.