• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.6
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• pp.170-176
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• 2005

The hydraulic cylinder is used for actuating the sluice gate which controls the volume of water in the reservoir. The locating points of hydraulic cylinder are restricted to limited space and determined to minimize the cylinder force necessary for actuating the sluice gate. Generally, the head end point of cylinder is fixed at underground and the rod end point of cylinder is connected to the gate plate when it is fully opened. Therefore there exist three parameters to be determined to minimize the cylinder force in the operation range of sluice gate. The optimal locating points of hydraulic cylinder are obtained using the complex method that is one kind of constrained direct search m method.

• IE interfaces
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• v.20 no.2
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• pp.154-161
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• 2007

When the electrical appliances such as TVs and refrigerators become obsolete, they must be collected to the recycling centers to avoid environmental damages. The obsolete home appliances are first moved to the regional collection point; and then transported to one of the recycling centers. Each recycling center has a limited capacity; and some recycling centers can process only certain types of products. For given locations of the existing collection points and recycling centers, optimally assigning the obsolete home appliances of each type from each collection point to the recycling centers can significantly reduce the total transportation cost. We formulate this problem as an LP problem. We also present an approach to determine the locations of additional recycling centers in order to alleviate the over-utilization of the current recycling centers.

• Korean Journal of Veterinary Service
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• v.39 no.4
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• pp.247-251
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• 2016

Salmonella is one of the most common bacteria that causes heavy losses in swine industry and major causative pathogen of food poisoning in public health. Various methods for the identification of Salmonella such as Gram staining, agglutination test, enzyme-linked immunosorbent assay (ELISA), polymerase chain reaction (PCR) have been used. Several studies have demonstrated that Matrix Assisted Laser Desorption Ionization Time of Flight (MALDI TOF) Mass Spectrometry (MS) identification is an efficient and inexpensive method for the rapid and routine identification of isolated bacteria. In this study, MALDI TOF MS could provide rapid, accurate identification of Salmonella spp. from swine compared with end point PCR and real time PCR.

• Communications of the Korean Mathematical Society
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• v.33 no.1
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• pp.237-245
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• 2018

For every interval [a, b], we denote by $({\bar{x}}_A,{\bar{y}}_A)$ and $({\bar{x}}_L,{\bar{y}}_L)$ the geometric centroid of the area under a catenary curve y = k cosh((x-c)/k) defined on this interval and the centroid of the curve itself, respectively. Then, it is well-known that ${\bar{x}}_L={\bar{x}}_A$ and ${\bar{y}}_L=2{\bar{y}}_A$. In this paper, we fix an end point, say 0, and we show that one of ${\bar{x}}_L={\bar{x}}_A$ and ${\bar{y}}_L=2{\bar{y}}_A$ for every interval with an end point 0 characterizes the family of catenaries among nonconstant $C^2$ functions.

• ETRI Journal
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• v.43 no.4
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• pp.580-593
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• 2021

When operating in confined spaces or near obstacles, collision-free path planning is an essential requirement for autonomous exploration in unknown environments. This study presents an autonomous exploration technique using a carefully designed collision-free local planner. Using LiDAR range measurements, a local end-point selection method is designed, and the path is generated from the current position to the selected end-point. The generated path showed the consistent collision-free path in real-time by adopting the Euclidean signed distance field-based grid-search method. The results consistently demonstrated the safety and reliability of the proposed path-planning method. Real-world experiments are conducted in three different mines, demonstrating successful autonomous exploration flights in environment with various structural conditions. The results showed the high capability of the proposed flight autonomy framework for lightweight aerial robot systems. In addition, our drone performed an autonomous mission in the tunnel circuit competition (Phase 1) of the DARPA Subterranean Challenge.

• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.31-36
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• 2003

On this study, an E.E(End-Effector) for the 300 mm wafer transfer robot system is newly suggested. It is a mechanical type with $180^{\circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor controlled by microchip. To design, relationship between the gripping force and the wafer deformation is analyzed by FEM. By analytic results, the gripping force for 300 mm wafer is confirmed as 255~274 gf. From experimental results on gripping force, repeatable position accuracy and gripping cycle times in a wafer cleaning system, we confirmed that the suggested E.E was well designed to satisfiy on the required performance for 300 mm wafer transfer robot system.

• Journal of electromagnetic engineering and science
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• v.7 no.3
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• pp.103-108
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• 2007

In this paper, a low-power 2.4 GHz front-end for sensor network application (IEEE 802.15.4 LR-WPAN) is designed in a 0.18 um CMOS process. A power supply circuit with a novel temperature-compensation scheme is presented. The simulation and measurement results show that the front-end (LNA, Mixer) can achieve a voltage gain of 35.3 dB and a noise figure(NF) of 3.1 dB while consuming 5.04 mW (LNA: 2.16 mW, Mixer: 2.88 mW) of power at $27^{\circ}C$. The NF includes the loss of BALUN and BPF. The low-IF architecture is used. The voltage gain, noise figure and third-order intercept point (IIP3) variations over -45$^{\circ}C$ to 85$^{\circ}C$ are less than 0.2 dB, 0.25 dB and 1.5 dB, respectively.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.3
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• pp.83-91
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• 1999

In this paper, we suggest a virtual machining system that can simulate cutting forces of ball end milling at the stage of part design. Cutting forces, here, are estimated from the machanistic model that uses the concept of specific cutting farce coefficient. To this end, we need undeformed chip thickness which is used for calculating chip load. It is derived from the Z-map data of a CAD model. That is, chip load is the height difference between the cutting tool and the workpiece at an arbitrary position. The tool contact point is referred from the cutter location data. On the other hand, the workpiece height is acquired from the Z-map model of a CAD data. From the experimental verification, we can simulate machining process effectively to the slot and the side cutting of ball end mill.

• Journal of the Korean Society of Industry Convergence
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• v.4 no.4
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• pp.365-369
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• 2001

This paper presented a new model of virtualized CNC milling machine. The model verifies the over cut, the under cut and the surface roughness using NC file generated from CAM and cutting condition. The model uses Z-map model to verify workpiece. In this paper, the model used the velocities of x, y and z direction and obtained a center point of a hall end mill for modeling Z-map of workpiece. To investigate the performance of the model, simulation study was carried out. As the results, the model gave geometry accuracy of workpiece, the surface roughness and the chip loads in finish cutting that can predict tool chipping. The virtualized CNC machine can he used a flat end mill, a ball end mill and a rounded end mill.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.80-87
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• 2003

On this study, an End-Effector for the 300mm wafer transfer robot System is newly suggested. It is a mechanical type with $180^{\circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor. It is controlled by microchip for the DC motor control. To design, relationships on the gripping force and the wafer deformation is analyzed by FEM analysis. Criterion on gripping force of a suggested End-Effector is confirmed as $255 ~ 274g_f$ from experimental results. From experimented results on repeatable position accuracy, gripping force and gripping cycle times in a wafer cleaning system, we confirmed that the suggested End-Effector is well satisfied on the required performance for 300mm wafer transfer robot system.