• Title/Summary/Keyword: embossing

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Preperation and properties of embossing treated fruit bagging paper (Embossing 처리 과대지의 제조 및 물성)

  • Kim, Kang-Jae;Byeon, Jong-Sang;Kim, Dae-Keun;Eom, Tae-Jin
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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    • 2006.11a
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    • pp.201-206
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    • 2006
  • Embossing treated fruit bagging paper was prepared with newly designed embossing roll and mechanical properties of fruit bagging paper were evaluated. The embossing technology was developed. First of all, embossing roll was designed in Ginyong Embo(Co) for the embossing process of fruiting bag. The embossing treated fruit bagging paper was manufactured in Agro(Co) at plant scale. The mechanical properties of embossing paper was investigated and operation efficiency of bagging was tested at field. The properties of embossed paper was quit satisfied for fruiting bag for cultivation of apple and pears.

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The effect of melt flow index on polymer deformation in hot embossing process (고분자 분자량 변화에 따른 핫 엠보싱 공정 연구)

  • Yoon, Keun-Byoung;Jeong, Myung-Young
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1025-1029
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    • 2003
  • We studied the cross-sectional profiles of deformed thermoplastics in hot embossing process and compared with melt flow index for various embossing conditions such as embossing temperature, embossing pressure and initial thickness of the thermoplastics. The fastest embossing times for complete penetration of the cavities were obtained at temperature greater than $60^{\circ}C$ above glass transition temperature (Tg). When the melt flow index of polymer is low, the penetration ratio does not become large even if the embossing pressure increases. The complete occupation of the cavities was easier obtained with high melt flow index polymer than low melt flow index polymer at the same process condition. We believe these results can be very useful for optimizing nanostructured hot embossing also known nanoimprinting process conditions.

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A Study on the Thermal Performance of Embossing Surface Sandwich Panel

  • Son, Cheol-Soo
    • International Journal of Air-Conditioning and Refrigeration
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    • v.9 no.2
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    • pp.69-76
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    • 2001
  • The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel in higher than that of embossing surface sandwich panel. More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel.

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A Study on the Thermal Performance of Embossing Surface Sandwich Panel During the Summer (여름철 엠보싱 샌드위치 패널의 열적 성능에 관한 연구 -평판 샌드위치 패널과 비교를 중심으로-)

  • 손철수
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.12 no.10
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    • pp.917-924
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    • 2000
  • The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel during the summer. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel is higher than that of embossing surface sandwich panel. More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel.

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Micro/Nano Rheological Characteristics of PMMA in Hot Embossing Process (핫엠보싱 공정에서 PMMA의 마이크로/나노 레올로지 특성)

  • Kim B. H.;Kim K. S.;Ban J. H.;Shin J. K.;Kim H. Y.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.05a
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    • pp.259-264
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    • 2004
  • The hot embossing process as a method for the fabrication of polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of polymer film during hot embossing process. As the initial step of quantitating the hot embossing process, simple parametric studies for the embossing conditions have been carried out using high resolution masters which patterned by DRIE process. Under different embossing times and pressures, the viscous flow of PMMA films into micro/nano cavities has been investigated. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM analysis considering micro/nano effect, such as surface tension and contact angle.

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Effect of polymer substrates on nano scale hot embossing (나노 사이즈 hot embossing 공정시 폴리머의 영향)

  • Lee, Jin-Hyung;Kim, Yang-sun;Park, Jin-goo
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.71-71
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    • 2003
  • Hot embossing has been widely accepted as an alternative to photolithography in generating patterns on polymeric substrates. The optimization of embossing process should be accomplished based on polymer substrate materials. In this paper, the effect of polymer substrates on nano scale hot embossing process was studied. Silicon molds with nano size patterns were fabricated by e-beam direct writing. Molds were coated with self-assembled monolayer (SAM) of (1, 1, 2.2H -perfluorooctyl)-trichlorosilane to reduce the stiction between mold and substrates. For an embossing, pressure of 55, 75 bur, embossing time of 5 min and temperature of above transition temperature were peformed. Polymethylmethacrylates (PMMA) with different molecular weights of 450,000 and 950,000, MR-I 8010 polymer (Micro Resist Technology) and polyaliphatic imide copolymer were applied for hot embossing process development in nano size. These polymers were spun coated on the Si wafer with the thickness between 150 and 200 nm. The nano size patterns obtained after hot embossing were observed and compared based on the polymer properties by scanning electron microscopy (SEM). The imprinting uniformity dependent on the Pattern density and size was investigated. Four polymers have been evaluated for the nanoimprint By optimizing the process parameters, the four polymers lead to uniform imprint and good pattern profiles. A reduction in the friction for smooth surfaces during demoulding is possible by polymer selection.

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Microlens and Arrays Fabrication by the Modified LIGA and Hot Embossing Process (변형 DEEP X-ray 공정과 Hot Embossing 공정을 이용한 마이크로 렌즈 및 어레이의 제작)

  • 이정아;이현섭;이성근;이승섭;권태헌
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.228-232
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    • 2003
  • Mircolens and microlens arrays are realized using a novel fabrication technology based on the exposure of a resist, usually PMMA, to deep X-rays and subsequent thermal treatment. Hot embossing process is also studied for mass production. The fabrication technology is very simple and produces microlenses and microlens arrays with good surface roughness of several nm. The molecular weight and glass transition temperature of PMMA is reduced when it is irradiated with deep X-rays. The microlenses were produced through the effects of volume change, surface tension. and reflow during thermal treatment of irradiated PMMA. A hot embossing machine is designed and manufactured with a servo motor transfer system. The hot embossing process follows the steps of heating mold to the desired temperature, embossing a mold insert on substrate. cooling mold to the de-embossing temperature. and de-embossing. Microlenses were produced with diameters ranging from 30 to 1500 ${\mu}{\textrm}{m}$. The surface X-ray mask is also fabricated to realize microlens arrays on PMMA sheet with a large area.

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Preparation and Properties of Embossing Treated Fruiting Bag (Embossing 처리 과대지의 제조 및 물성)

  • Kim, Kang-Jae;Park, Seong-Bae;Eom, Tae-Jin
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.40 no.1
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    • pp.35-40
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    • 2008
  • The environment of agriculture in Korea is changed very rapidly. Since the labours in fruit cultivation field are getting older, the resources and the aid materials for farming need to be multi functional and easy to use. Therefore, They have to use various kind of aid materials in field of fruit cultivation like as fruiting bag. The development of practical utilization way of embossing process for manufacturing of fruiting bag and wrapping paper of agricultural products was main purpose of this study. Embossing roll was designed in Ginyong Embo(Co.) for the embossing process of fruiting bag. The embossing treated fruiting bag was manufactured in Agro(Co.) at mill scale. The mechanical properties of embossing paper was investigated and operation efficiency of bagging was tested at field. The properties of embossed paper was satisfied for fruiting bags for cultivation of apple and pear.

Study of nano patterning rheology in hot embossing process (핫엠보싱 공정에서의 미세 패턴 성형에 관한 연구)

  • Kim, H.;Kim, K.S.;Kim, H.Y.;Kim, B.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.10a
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    • pp.371-376
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    • 2003
  • The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process, simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during Compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.

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Flow Behaviors of Polymers in Micro Hot Embossing Process (미세 핫엠보싱 공정에서 폴리머의 유동특성)

  • Ban Jun Ho;Shin Jai Ku;Kim Byeong Hee;Kim Heon Young
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.8 s.173
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    • pp.159-164
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    • 2005
  • The Hot Embossing Lithography(HEL) as a method fur the fabrication of the nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of the polymer (PMMA) film during the hot embossing process. To grasp the characteristics of the micro patterning rheology by process parameters (embossing temperature, pressure and time), we have carried out various experiments by using the nickel-coated master fabricated by the deep RIE process and the plasma sputtering. During the hot embossing process, we have observed the characteristics of the viscoelastic behavior of polymer. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM(Finite Difference Method) analysis considering the micro effect, such as a surface tension and a contact angle.