• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.1
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• pp.72-79
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• 2022

Piezoelectric energy harvesting technologies, which can be used to convert the electricity from the mechanical energy, have been developed in order to assist or power the wearable electronics. To realize non-toxic and biocompatible electronics, the lead-free (Ba_0.85Ca_0.15)(Ti_0.90Zr_0.10)O₃ (BCTZ) nanoparticles (NPs) are being studied with a great attention as flexible energy harvesting device. Herein, piezoelectric hybrid nanocomposites were fabricated using BCTZ NPs-embedded poly(vinylidene fluoride-trifluoroethylene) [P(VDF-TrFE)] matrix to improve the performance of flexible energy harvester. Output performance of the fabricated energy device was investigated by the well-optimized measurement system during the periodically bending and releasing motions. The generated open-circuit voltage and the short-circuit current of the piezoelectric hybrid nanocomposite-based energy harvester reached up to ~15 V and ~1.1 ㎂, respectively; moreover, the instantaneous power of 3.5 ㎼ is determined from load voltage and current at the external load of 20 MΩ. This research is expected to cultivate a new approach to high-performance wearable self-powering electronics.

• Journal of the Korean Recycled Construction Resources Institute
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• v.10 no.1
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• pp.124-132
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• 2022

The corrosion potential in concrete varies greatly with exposure and concrete mix conditions. In this study, RC (Reinforcement Concrete) samples were prepared considering cover depth, chloride concentration, and W/C(water to cement) ratio as variables, and HCP(Half Cell Potential) was measured, which evaluated comparative potential between embedded steel and concrete surface. In addition, OCP(Open Circuit Potential) was measured using buried steel and CE(Counter Electrode). Agar and NaOH solution were used as ion exchange materials and Hg/HgO was used for RE(Reference Electrode), which was more sensitive to temperature than HCP. Among the influencing factors, the exposure period and chloride concentration had a relatively greater effect than cover depth and w/c ratio. Additionally, the entire measured HCP and OCP showed a clearly linear relationship with increasing cover depth and w/c ratio. Through multiple regression analysis, the relationship between HCP and OCP was quantified, and an improved correlation was obtained with temperature effect.

• Journal of Sensor Science and Technology
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• v.33 no.1
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• pp.56-61
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• 2024

The quality of the display can be managed by effectively managing the temperature generated by the panel during use. Conventional display panels rely on an external reference resistor for temperature monitoring. However, this approach is easily affected by external factors such as temperature variations from the driving circuit and chips. These variations reduce reliability, causing complicated mounting owing to the external chip, and cannot monitor the individual pixel temperatures. However, this issue can be simply and efficiently addressed by integrating temperature sensors during the display panel manufacturing process. In this study, we fabricated and analyzed a temperature sensor integrated into an a-IGZO (amorphous indium-gallium-zinc-oxide) TFT array that was to precisely monitor temperature and prevent the deterioration of OLED display pixels. The temperature sensor was positioned on top of the oxide TFT. Simultaneously, it worked as a light shield layer, contributing to the reliability of the oxide. The characteristics of the array with integrated temperature sensors were measured and analyzed while adjusting the temperature in real-time. By integrating a temperature sensor into the TFT array, monitoring the temperature of the display became easier and more accurate. This study could contribute to managing the lifetime of the display.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Journal of IKEEE
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• v.25 no.3
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• pp.485-492
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• 2021

In this paper, we propose the development of a defect inspection system for polygonal containers. Embedded board consists of main part, communication part, input/output part, etc. The main unit is a main arithmetic unit, and the operating system that drives the embedded board is ported to control input/output for external communication, sensors and control. The input/output unit converts the electrical signals of the sensors installed in the field into digital and transmits them to the main module and plays the role of controlling the external stepper motor. The communication unit performs a role of setting an image capturing camera trigger and driving setting of the control device. The input/output unit converts the electrical signals of the control switches and sensors into digital and transmits them to the main module. In the input circuit for receiving the pulse input related to the operation mode, etc., a photocoupler is designed for each input port in order to minimize the interference of external noise. In order to objectively evaluate the accuracy of the development of the proposed polygonal container defect inspection system, comparison with other machine vision inspection systems is required, but it is impossible because there is currently no machine vision inspection system for polygonal containers. Therefore, by measuring the operation timing with an oscilloscope, it was confirmed that waveforms such as Test Time, One Angle Pulse Value, One Pulse Time, Camera Trigger Pulse, and BLU brightness control were accurately output.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.1
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• pp.100-105
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• 2003

In this paper, we propose the novel test method effectively to detect short and open faults in CMOS op-amp. The proposed method uses a sinusoidal signal with higher frequency than unit gain bandwidth. Since the proposed test method doesn't need complex algorithm to generate test pattern, the time of test pattern generation is short, and test cost is reduced because a single test pattern is able to detect all target faults. To verify the proposed method, CMOS two-stage operational amplifier with short and open faults is designed and the simulation results of HSPICE for the circuit have shown that the proposed test method can detect short and open faults in CMOS op-amp.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4489-4493
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• 2014

LED light driving device has problems in efficiency and heating at higher than 150W. In addition, there is inconvenience in replacing the lighting device to another when W is not the same as the previous one. In this paper, a multi-channel LED light driver, driver embedded driver circuit in a multi-channel structure with a power system in the driver-interlocking structure was designed. With the auto control converter structure with a power efficiency above 93% and power factor above 0.98, the weight of the high efficiency LED lighting-actuating device in driver-interlocking structure, a driver in self-calibrating self-optimization structure. In this paper, at below 10% THD, the existing converter contrast weight was reduced by 40% or more.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.279-282
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• 2002

In this paper, we present a new method for monitoring of ECU's self diagnostic signals of vehicle without wire. In order to measure the ECU's self diagnostic signals, the interfaced circuit is designed to communicate ECU and a designed display terminal according to the ISO, SAE regulation of communication protocol standard. A 80C196KC processor is used for communicating ECU's self diagnostic signals and the results are sent to PDA monitoring system. Software on PDA is developed to monitor the ECU's self diagnostic signals using the Embedded Visual C++ compiler in which RS232 port is programmed by half duplex method. The algorithms for measuring the ECU's self diagnostic signals are verified to monitor ECU's state. At the same time, the information to fix the vehicle's problem can be shown on the developed PDA software. The possibility for remote measurement of ECU self diagnostic signal using PDA is also verified through the developed systems and algorithms.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.1
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• pp.214-221
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• 2007

This paper presents a myoelectric hand prosthesis(MHP) with two degree of freedom(2-DOF), which consists of a mechanical hand, a surface myoelectric sensor(SMES) for measuring myoelectric signal, a control system and a charging battery. The actuation for the 2-DOF hand functions such as grasping and wrist rotation was performed by two DC-motors, and controlled by myoelectric signal measured from the residual forearm muscle. The grip force of the MHP was automatically changed by a mechanical automatic speed reducer mounted on the hand. The skin interface of SMES was composed of the electrodes using the SUS440 metal in order to endure a wet condition due to the sweat. The sensor was embedded with a amplifier and a filter circuit for rejecting the offset voltage caused by power line noises. The control system was composed of the grip force sensor, the slip sensor, and the two controllers. The two controllers were made of a RISC-type microprocessor, and its software was executed on a real-time kernel. The control system used Force Sensing Resistors, FSR, as slip pick-ups at the fingertip of a thumb and the grip force information was obtained from a strain-gauge on the lever of the MHP. The experimental results were showed that the proposed control system is feasible for the MHP.