• Title/Summary/Keyword: embedded circuit

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A 5-20 GHz 5-Bit True Time Delay Circuit in 0.18 ㎛ CMOS Technology

  • Choi, Jae Young;Cho, Moon-Kyu;Baek, Donghyun;Kim, Jeong-Geun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.3
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    • pp.193-197
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    • 2013
  • This paper presents a 5-bit true time delay circuit using a standard 0.18 ${\mu}m$ CMOS process for the broadband phased array antenna without the beam squint. The maximum time delay of ~106 ps with the delay step of ~3.3 ps is achieved at 5-20 GHz. The RMS group delay and amplitude errors are < 1 ps and <2 dB, respectively. The measured insertion loss is <27 dB and the input and output return losses are <12 dB at 5-15 GHz. The current consumption is nearly zero with 1.8 V supply. The chip size is $1.04{\times}0.85\;mm^2$ including pads.

Product and Properties of Embedded Capacitor by Aerosol Deposition (Aerosol Deposition에 의한 Embedded Capacitor의 제조 및 특성 평가)

  • Yoo, Hyo-Sun;Cho, Hyun-Min;Park, Se-Hoon;Lee, Kyu-Bok;Kim, Hyeong-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.313-313
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    • 2008
  • Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

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Design and Fabrication of Low Temperature Processed $BaTiO_3$ Embedded Capacitor for Low Cost Organic System-on-Package (SOP) Applications (저가형 유기 SOP 적용을 위한 저온 공정의 $BaTiO_3$ 임베디드 커페시터 설계 및 제작)

  • Lee, Seung-J.;Park, Jae-Y.;Ko, Yeong-J.
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1587-1588
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    • 2006
  • Tn this paper, PCB (Printed Circuit Board) embedded $BaTiO_3$ MIM capacitors were designed, fabricated, and characterized for low cost organic SOP applications by using 3-D EM simulator and low temperature processes. Size of electrodes and thickness of high dielectric films are optimized for improving the performance characteristics of the proposed embedded MIM capacitors at high frequency regime. The selected thicknesses of the $BaTiO_3$ film are $12{\mu}m$, $16{\mu}m$, and $20{\mu}m$. The fabricated MIM capacitor with dielectric constant of 30 and thickness of $12{\mu}m$ has capacitance density of $21.5p\;F/mm^2$ at 100MHz, maximum quality factor of 37.4 at 300 MHz, a quality factor of 30.9 at 1GHz, self resonant frequency of 5.4 GHz, respectively. The measured capacitances and quality factors are well matched with 3-D EM simulated ones. These embedded capacitors are promising for SOP based advanced electronic systems with various functionality, low cost, small size and volume.

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Squib Ignition and Status Check Circuits Design for Compact Embedded Systems in Guided Missiles (유도무기의 소형 임베디드 시스템을 위한 스퀴브 착화 및 상태 점검회로 설계)

  • Wonsop Kim;Keehyun Ahn;Minseok Lee
    • Journal of the Korea Institute of Military Science and Technology
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    • v.26 no.1
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    • pp.64-71
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    • 2023
  • In the recent defence industries, it is required to develop the small and low cost embedded systems for guided missiles. According to the characteristics of guided missiles, the mission is conducted with multiple phases, which include a squib activation phase. By considering the unexpected squib activation, the squib system should be disabled after the launch of a guided missile. Therefore, the squib system needs to include the functions of the safe ignition and status check. This paper presents the squib ignition and status check circuits design for the compact embedded systems in guided missiles. Validation results show that for the functions of the squib ignition and status check, the presented circuits design performs well. The designed circuits also were implemented with various electronic devices and validated by the ground and flight tests.

Characterizing the ac-dc-ac Degradation of Aircraft and Vehicle Organic Coatings using Embedded Electrodes

  • Bierwagen, Gordon P.;Allahar, Kerry N.;Su, Quan;Victoria, Johnston-Gelling
    • Corrosion Science and Technology
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    • v.6 no.5
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    • pp.261-268
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    • 2007
  • Embedded sensors were used as an in-situcorrosion-sensing device for aircraft and vehicular structures protected by organic coatings. Results are presented changes associated with a standard Airforce aircraft coating and a standard Army vehicle coating were monitored by embedded sensors. These coatings consisted of a polyurethane topcoat and an epoxy primer, however are formulated to provide different characteristics. The ac-dc-ac testing method was used to accelerate the degradation of these coatings while being immersed in a NaCl medium. Electrochemical impedance spectroscopy and electrochemical noise measurement experiments were used to monitor the induced changes. A comparison of the results between coatings subjected to the ac-dc-ac exposure and coatings subjected to only constant immersion in the NaCl medium is presented. The results were used to demonstrate the effectiveness of the ac-dc-ac method at accelerating the degradation of an organic coating without observably changing the normal mechanism of degradation. The data highlights the different features of the coating systems and tracks them while the coating is being degraded. The aircraft coating was characterized by a high-resistant topcoat that can mask corrosion/primer degradation at the primer/substrate interface whereas the vehicle coating was characterized by a low-resistant topcoat with an effective corrosion inhibiting primer. Details of the ac-dc-ac degradation were evaluated by using an equivalent circuit to help interpret the electrochemical impedance data.

Flexible Energy Harvesting Device Based on Porous Piezoelectric Sponge (다공성 압전 스펀지를 이용한 플렉서블 에너지 하베스팅 소자 개발)

  • Dong Hun, Heo;Dong Yeol, Hyeon;Sung Cheol, Park;Kwi-Il, Park
    • Korean Journal of Materials Research
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    • v.32 no.11
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    • pp.508-514
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    • 2022
  • Piezoelectric composite films which are enabled by inorganic piezoelectric nanomaterials-embedded polymer, have attracted enormous attention as a sustainable power source for low powered electronics, because of their ease of fabrication and flexible nature. However, the absorption of applied stress by the soft polymeric matrices is a major issue that must be solved to expand the fields of piezoelectric composite applications. Herein, a flexible and porous piezoelectric composite (piezoelectric sponge) comprised of BaTiO3 nanoparticles and polydimethylsiloxane was developed using template method to enhance the energy conversion efficiency by minimizing the stress that vanishes into the polymer matrix. In the porous structure, effective stress transfer can occur between the piezoelectric active materials in compression mode due to direct contact between the ceramic particles embedded in the pore-polymer interface. The piezoelectric sponge with 30 wt% of BaTiO3 particles generated an open-circuit voltage of ~12 V and a short-circuit current of ~150 nA. A finite element method-based simulation was conducted to theoretically back up that the piezoelectric output performance was effectively improved by introducing the sponge structure. Furthermore, to demonstrate the feasibility of pressure detecting applications using the BaTiO3 particles-embedded piezoelectric sponge, the composite was arranged in a 3 × 3 array and integrated into a single pressure sensor. The fabricated sensor array successfully detected the shape of the applied pressure. This work can provide a cost-effective, biocompatible, and structural strategy for realizing piezoelectric composite-based energy harvesters and self-powered sensors with improved energy conversion efficiency.

A Study on 16 bit EISC Microprocessor (16 비트 EISC 마이크로 프로세서에 관한 연구)

  • 조경연
    • Journal of Korea Multimedia Society
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    • v.3 no.2
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    • pp.192-200
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    • 2000
  • 8 bit and 16 bit microprocessors are widely used in the small sited control machine. The embedded microprocessors which is integrated on a single chip with the memory and I/O circuit must have simple hardware circuit and high code density. This paper proposes a 16 bit high code density EISC(Extendable Instruction Set Computer) microprocessor. SE1608 has 8 general purpose registers and 16 bit fixed length instruction set which has the short length offset and small immediate operand. By using an extend register and extend flag, the offset and immediate operand in instruction could be extended. SE1608 is implemented with 12,000 gate FPGA and all of its functions have been tested and verified at 8MHz. And the cross assembler, the cross C/C++compiler and the instruction simulator of the SE1608 have been designed and verified. This paper also proves that the code density$.$ of SE1608 shows 140% and 115% higher code density than 16 bit microprocessor H-8300 and MN10200 respectively, which is much higher than traditional microprocessors. As a consequence, the SE1608 is suitable for the embedded microprocessor since it requires less program memory to any other ones, and simple hardware circuit.

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Power output and efficiency of a negative capacitance and inductance shunt for structural vibration control under broadband excitation

  • Qureshi, Ehtesham Mustafa;Shen, Xing;Chang, Lulu
    • International Journal of Aeronautical and Space Sciences
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    • v.16 no.2
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    • pp.223-246
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    • 2015
  • Structural vibration control using a piezoelectric shunt is an established control technique. This technique involves connecting a piezoelectric patch, which is bonded onto or embedded into the vibrating structure, to an electric shunt circuit. Thus, vibration energy is converted into electrical energy and is dissipated through a network of electrical components. Different configurations of shunt have been researched, among which the negative capacitance-inductance shunt has gained prominence recently. It is basically an analog, active circuit consisting of operational amplifiers and passive elements to introduce real and imaginary impedance on the vibrating structure. The present study attempts to model the behavior of a negative capacitance-inductance shunt in terms of power output and efficiency using circuit modeling software. The shunt model is validated experimentally and is used to control the structural vibration of an aluminum beam, connected to a pair of piezoelectric patches, under broadband excitation. The model is also used to determine the optimal parameters of a negative capacitance-inductance shunt to increase the efficiency and predict the voltage output limit of op-amp against the supply voltage.

A design of Low Pass Filter using the equivalent circuit of T-junction microstrip line (T-접합선로의 등가회로를 고려한 저역통과 여파기 설계)

  • Dorjsuren, Baatarkhuu;Choi, Heung-Taek;Ahn, Dal
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.10 no.6
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    • pp.1180-1185
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    • 2009
  • In this paper, the Low Pass Filter (LPF) using the equivalent circuit of T-junction microstrip line is proposed. And we derived the formulas for lumped-elements of the equivalent circuit of T-junction microstrip line to solve the frequency shift characteristic. T-junction microstrip line is de-embedded by Electromagnetic simulation tool and exact lumped element value of T-junction microstrip line is calculated by the equation of Z-parameter. We can get excellent agreement between lumped-element LPF frequency response and transmission line LPF frequency response.

Design and Implementation of a 128-bit Block Cypher Algorithm SEED Using Low-Cost FPGA for Embedded Systems (내장형 시스템을 위한 128-비트 블록 암호화 알고리즘 SEED의 저비용 FPGA를 이용한 설계 및 구현)

  • Yi, Kang;Park, Ye-Chul
    • Journal of KIISE:Computer Systems and Theory
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    • v.31 no.7
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    • pp.402-413
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    • 2004
  • This paper presents an Implementation of Korean standard 128-bit block cipher SEED for the small (8 or 16-bits) embedded system using a low-cost FPGA(Field Programmable Gate Array) chip. Due to their limited computing and storage capacities most of the 8-bits/16-bits small embedded systems require a separate and dedicated cryptography processor for data encryption and decryption process which require relatively heavy computation job. So, in order to integrate the SEED with other logic circuit block in a single chip we need to invent a design which minimizes the area demand while maintaining the proper performance. But, the straight-forward mapping of the SEED specification into hardware design results in exceedingly large circuit area for a low-cost FPGA capacity. Therefore, in this paper we present a design which maximize the resource sharing and utilizing the modern FPGA features to reduce the area demand resulting in the successful implementation of the SEED plus interface logic with single low-cost FPGA. We achieved 66% area accupation by our SEED design for the XC2S100 (a Spartan-II series FPGA from Xilinx) and data throughput more than 66Mbps. This Performance is sufficient for the small scale embedded system while achieving tight area requirement.