• 마이크로전자및패키징학회지
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• 제30권1호
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• pp.17-29
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• 2023

본 논문에서는 전자제품의 소형화와 고성능화에 따라 패키징 기술에서 핵심적인 역할을 하는 솔더 조인트의 신뢰성 평가 방법을 소개한다. 우선, 다양한 합금 조성과 제품 형태에 따른 솔더의 특성을 설명하고, 여러 패키지에서의 솔더 조인트 구조에 대한 개요를 제시한다. 그 다음 솔더 합금의 조성과 미시구조가 솔더의 열적 및 기계적 특성에 미치는 영향을 분석하며, 솔더 크리프 거동에 대해 간략히 소개한다. 이어서, 신뢰성 평가를 위한 크리프 모델과 피로 모델 등을 고려한 분석 기법들을 소개하고, 솔더 조인트의 신뢰성을 향상시킬 수 있는 방안에 대해 논의한다. 본 연구는 반도체 패키징 기술 분야에서 솔더 조인트의 신뢰성 평가와 개선에 유익한 정보를 제공할 것으로 기대된다.

• 한국지반공학회논문집
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• 제23권4호
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• pp.59-68
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• 2007

본 논문에서는 토조에 실시된 모형말뚝 재하실험과 콘관입실험을 통하여, 말뚝형태별 지지력 특성분석과 CPT지지력 상관계수를 평가하였다. 고려된 말뚝의 형태는 일반적인 현장타설말뚝에 적용되는 원통형 말뚝과 테이퍼형 말뚝이 고려되었다. 본 연구는 궁극적으로 강관주 송전탑의 기초구조물 형식개발과 설계기준 수립을 목표로 하고 있으며, 이를 위해 기초형식별 거동과 지반상태의 영향 등을 중점적으로 살펴보았다. 말뚝 토조실험을 통해 나타난 결과에 의하면, 원통형 및 테이퍼형 말뚝의 전체지지력의 차이는 크지 않았으나, 개별 지지력요소의 거동은 말뚝형태별로 상이한 것으로 나타났다. 토조실험결과와 동일한 지반조건에 대해 수행된 CPT결과를 통해 말뚝지지력과 콘지지력의 관계를 나타내는 CPT지지력 상관계수의 변화추이를 도출하였다. CPT상관계수는 원통형 및 테이퍼형 말뚝형태를 비교함으로써 나타내었으며, 선단지지력과 주면마찰력의 요소별 변화추이를 제안하였다.

• Composites Research
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• 제19권3호
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• pp.1-6
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• 2006

최근들어 고성능의 전자 장비들의 구조는 점점 복잡해지고, 이로 인해 발생되는 전자파 간섭(EMI) 및 적합성(EMC) 문제는 상업적으로나 군사적으로 매우 중요한 문제이다. 자동차, 비행기, 디스플레이 산업 등에서 민감한 전자 장비들과 밀집된 시스템들은 전자기파로부터 보호될 필요성이 있다. 다중벽 탄소나노튜브(MWNT)가 첨가된 유리직물 복합재료와 전도성이 우수한 탄소복합재료를 차폐 물질로 제작하고 전기적 특성을 측정하였다. 관심 주파수 영역은 $300MHz{\sim}1GHz$의 영역이다. 전도성 필러가 첨가된 유리직물 복합재료와 이것으로 이루어진 차폐 기구물의 차폐 특성은 3-D 전자기장 해석 툴을 사용하여 예측해 보았다. 탄소복합재료 기구물의 차폐 특성은 전자파 무반향실에서 측정되었다. 설계에 따라 -20 dB 이상의 전자파 차폐 효율을 보이는 기구물을 제작할 수 있음을 확인하였다.

• Journal of Microbiology and Biotechnology
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• 제33권6호
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• pp.797-805
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• 2023

Species belonging to the Vernonia (Asteraceae), the largest genus in the tribe Vernonieae (consisting of about 1,000 species), are widely used in food and medicine. These plants are rich sources of bioactive sesquiterpene lactones and steroid saponins, likely including many as yet undiscovered chemical components. A phytochemical investigation resulted in the separation of three new stigmastane-type steroidal saponins (1 - 3), designated as vernogratiosides A-C, from whole plants of V. gratiosa. Their structures were elucidated based on infrared spectroscopy (IR), one-dimensional (1D) and two-dimensional nuclear magnetic resonance (2D NMR), high-resolution electrospray ionization mass spectrometry (HR-ESI-MS), and electronic circular dichroism analyses (ECD), as well as chemical reactivity. Molecular docking analysis of representative saponins with α-glucosidase inhibitory activity was performed. Additionally, the intended substances were tested for their ability to inhibit α-glucosidase activity in a laboratory setting. The results suggested that stigmastane-type steroidal saponins from V. gratiosa are promising candidate antidiabetic agents.

• 한국환경과학회:학술대회논문집
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• 한국환경과학회 2019년도 정기학술대회 발표논문집
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• pp.83-83
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• 2019

Increasing the CO₂ concentration in the atmosphere induce high temperature and rising sea levels. So the technology that capture and reuse of the CO₂ have been recently become popular. Among other methods, CRR(CO2₂ reduction reaction) is typical method of CO₂ reusing. Electrocatalyst can show more higher efficiencies in CRR than photocatalyst because it doesn't use nature source. Nowadays, finding high efficient electrocatalyst by controlling electronic (affected by stoichiometry) and geometric (affected by atomic arrangement) factors are very important issues. Mono-atomic electro-catalyst has limitations on controlling binding energy because each intermediate has own binding energy range. So the Multi-metallic electro-catalyst is important to stabilize intermediate at the same time. Carbon monoxide(CO) which is our target product and important feedstock of useful products. Au is known for the most high CO production metal. With copper, Not only gold/copper has advantages which is they have FCC packing for easily forming solid solution regardless of stoichiometry but also presence of adsorbed CO on Cu promotes the desorption of CO on Au because of strong repulsion. And gold/copper bi-metal catalyst can show high catalytic activity(mass activity) although it has low selectivity relatively Gold. Actually, multi-metallic catalyst structure control method is limited in the solution method which is takes a lot of time. In here, we introduce CTS(carbo thermal shock) method which is using heat to make MMNP in a few seconds for making gold-copper system. This method is very simple and efficient in terms of time(very short reaction time and using carbon substrate as a direct working electrode) and increasing reaction sites(highly dispersed and mixing alloy structures). Last one is easy to control degree of mixing and it can induce 5 or more metals in one alloy system. Gold/copper by CTS can show higher catalytic activity depending on metal ratio which is altered easily by changing simple variables. The ultimate goals are making CO₂ test system by CTS which can check the selectivity depending on metal types in a very short time.

• Smart Structures and Systems
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• 제30권5호
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• pp.545-556
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• 2022

Through the examination of literatures, electronic commerce is a subject which is accepted in enterprises to define e-commerce adoption, trends, and issues that are assisting and obstructing its efficacy. E-commerce offers numerous advantages to consumer satisfaction in any place and helps the company to get a competitive benefit over its competitors. The Internet has expanded the scope of business. Many business information is available by the global network that supports information gathering between organizations, businesses and their clients, while various divisions of a business is increasing at an exponential rate. Meanwhile, there are a few barriers to proper e-commerce usage and adoption, such as reliable internet connections, poor e-commerce supporting infrastructures, logistics systems presenting socio-regulatory and poor transportation barriers and demonstrating the significant improvement of e-commerce reliable and affordable Internet provisions, i.e., Internet cost, intensity, and reasonable level of e-readiness. The operational and strategic significance of information-based virtual value chains for all organizations cannot be emphasized. As a consequence, this study confirms worldwide market elements of e-commerce, such as its issues, benefits, relevance, scope, facilitators and projects prospective obstacles in a developing economy.

• 한국정보전자통신기술학회논문지
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• 제16권5호
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• pp.247-255
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• 2023

메타버스 내의 가상현실 공간 형성을 위해서는 정확한 트래킹 센서와 구현이 필요하다. 대부분 국가 기관 및 기업들은 바이브와 같은 자체 트래킹 센서와 베이스 스테이션을 사용하여 트래킹을 수행한다. 바이브 방식은 공간적 제약, 주변에 장애물이나 구조물이 있을 경우 트래킹에 문제가 발생할 수 있고, 공간 내에서 수용 가능한 인원도 제한된다. 본 논문에서는 공간 가상현실 메타버스를 자유롭게 트래킹 할 수 있도록 IR센서 트래킹 시스템을 이용하여 메타버스를 구성하고, 필요에 따라 바닥과 천장에 IR센서를 추가 배치하여 메타버스 공간을 유연하게 구성하여 컨텐츠를 실험하였다. 실험한 결과 바이브 방식에 비해 IR-트래킹 시스템 방식이 바이브 방식보다 약 12% 정도 추적 안정성이 높았다. 또한 바닥추적 센서를 더 추가면 추적 안정성이 더 높아 안정적으로 가상공간을 표현할 수 있다.

• Advances in aircraft and spacecraft science
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• 제10권3호
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• pp.223-243
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• 2023

There is a burgeoning demand for minimizing the mass of satellites because of its direct impact on reducing launch-to-orbit cost. This must be done without compromising the structure's efficiency. The present paper introduces a relatively low-cost and easily implementable approach for optimizing structural mass to a maximum natural frequency. The natural frequencies of the satellite are of utmost pertinence to the application requirements, as the sensitive electronic instrumentation and onboard computers should not be affected by the vibrations of the satellite structure. This methodology is applied to a realistic model of Al-Azhar University micro-satellite in partnership with the Egyptian Space Agency. The procedure used in structural design can be summarized in two steps. The first step is to select the most favorable primary structural configuration among several different candidate variants. The nominated variant is selected as the one scoring maximum relative dynamic stiffness. The second step is to use perforation patterns reduce the overall mass of structural elements in the selected variant without changing the weight. The results of the presented procedure demonstrate that the mass reduction percentage was found to be 39% when compared to the unperforated configuration that had the same plate thickness. The findings of this study challenge the commonly accepted notion that isogrid perforations are the most effective means of achieving the goal of reducing mass while maintaining stiffness. Rather, the study highlights the potential benefits of exploring a wider range of perforation unit cells during the design process. The study revealed that rectangular perforation patterns had the lowest efficiency in terms of modal stiffness, while triangular patterns resulted in the highest efficiency. These results suggest that there may be significant gains to be made by considering a broader range of perforation shapes and configurations in the design of lightweight structures.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.239-240
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• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.

• 경영과정보연구
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• 제3권
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• pp.287-316
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• 1999

Cyberspace permits us to more beyond traditional face-to-face, mail and telephone surveys, yet still to examine basic issues regarding the quality of data collection: sampling, questionnaire design, survey distribution, means of response, and database creation. This article address each of these issues by contrasting and comparing traditional survey methods(Paper-and-Pencil) with Internet or Personal Computer networks-mediated (Screen-and-Keyboard) survey methods also introduces researchers to this revolutionary and innovative tool and outlines a variety of practical methods for using the Internet or Personal Computer Networks. The revolution in telecommunications technology has fostered the rapid growth of the Internet all over the world. The Internet is a massive global network and comprising many national and international networks of interconnected computers. The Internet or Personal Computer Networks could be the comprehensive interactive tool that will facilitate the development of the skills. The Internet or Personal Computer Networks provides a virtual frontier to expand our access to information and to increase our knowledge and understanding of public opinion, political behavior, social trends and lifestyles through survey research. Comparable to other technological advancements, the Internet or Personal Computer Networks presents opportunities that will impact significantly on the process and quality of survey research now and in the twenty-first century. There are trade-offs between traditional and the Internet or Personal Computer Networks survey. The Internet or Personal Computer Networks is an important channel for obtaining information for target participants. The cost savings in time, efforts, and material were substantial. The use of the Internet or Personal Computer Networks survey tool will increase the quality of research environment. There are several limitations to the Internet or Personal Computer Network survey approach. It requires the researcher to be familiar with Internet navigation and E-mail, it is essential for this process. The use of Listserv and Newsgroup result in a biased sample of the population of corporate trainers. However, it is this group that participates in technology and is in the fore front of shaping the new organizations of interest, and therefore it consists of appropriate participants. If this survey method becomes popular and is too frequently used, potential respondents may become as annoyed with E-mail as the sometimes are with mail survey and junk mail. Being a member of the Listserv of Newsgroup may moderate that reaction. There is a need to determine efficient, effective ways for the researcher to strip identifiers from E-mail, so that respondents remain anonymous, while simultaneously blocking a respondent from responding to a particular survey instrument more than once. The optimum process would be on that is initiated by the researcher : simple, fast and inexpensive to administer and has credibility with respondents. This would protect the legitimacy of the sample and anonymity. Creating attractive Internet or Personal Computer Networks survey formats that build on the strengths of standardized structures but also capitalize on the dynamic and interactive capability of the medium. Without such innovations in survey design, it is difficult to imagine why potential survey respondents would use their time to answer questions. More must be done to create diverse and exciting ways of building an credibility between respondents and researchers on the Internet or Personal Computer Networks. We believe that the future of much exciting research is based in the Electronic survey research. The ability to communicate across distance, time, and national boundaries offers great possibilities for studying the ways in which technology and technological discourse are shaped. used, and disseminated ; the many recent doctoral dissertations that treat some aspect of electronic survey research testify to the increase focus on the Internet or Personal Computer Networks. Thus, scholars should begin a serious conversation about the methodological issues of conducting research In cyberspace. Of all the disciplines, Internet or Personal Computer Networks, emphasis on the relationship between technology and human communication, should take the lead in considering research in the cyberspace.