• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.211-214
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• 2001

Electronic Speckle Pattern Interferometry(ESPI) is one of optical technique to measure displacement precisely, uses CCD camera to show result image in real time. General ESPI system measures in-plane or out-of-plane displacement. Shearography is one of electronic speckle pattern interferometric methods which allow full-field observation of surface displacement derivatives and it is robust in vibration. The shearography provides non-contacting technique of evaluating defects nondestructively. In this study, the shearography was used to evaluate defects in Carbon Fiber Reinforced Plastic(CFRP). Various sizes of artificial defects were embedded in various depths of woven CFRP plate. Effects due to the variation of size and depth of defects were evaluated in this study.

• Proceedings of the Korean Reliability Society Conference
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• 2002.06a
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• pp.245-251
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• 2002

Electronic Speckle Pattern Interferometry(ESPI) is one of optical technique to measure displacement precisely, uses CCD camera to show result image in real time. General ESPI system measures in-plane or out-of-plane displacement. Shearography is one of electronic speckle pattern interferometric methods which allow full-field observation of surface displacement derivatives and it is robust in vibration. The shearography provides non-contacting technique of evaluating defects nondestructively In this study, the shearography was used to evaluate defects in Carbon Fiber Reinforced Plastic(CFRP). Various sizes of artificial defects were embedded in various depths of woven CFRP plate. Effects due to the variation of size and depth of defects were evaluated in this study.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.3
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• pp.93-100
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• 2008

Laser interferometry is widely used as a measuring system in many fields because of its high resolution and ability to measure a broad area in real-time all at once. In conventional LASER interferometry, for example Out-of-plane ESPI(Electronic Speckle Pattern Interferometry), In plane ESPI, Shearography and Holography, it uses PZT or other components as a phase shift instrumentation to extract 3D deformation data, vibration mode and others. However, in most cases PZT has some disadvantages, which include nonlinear errors and limited time of use. In the present study, a new type of LASER interferometry using a laser diode is proposed. Using LASER Diode Sinusoidal Phase Modulating (LD-SPM) interferometry, the phase modulation can be directly modulated by controlling the LASER Diode injection current thereby eliminating the need for PZT and its components. This makes the interferometry more compact. This paper reports on a new approach to the LD Modulating interferometry that involves four-buckets phase shift method. This study proposes a four-bucket phase mapping algorithm, which was developed to have a guaranteed application, to stabilize the system in the field and to be a user-friendly GUI. In this paper, the theory for LD wavelength modulation and sinusoidal phase modulation of LD modulating interferometry is shown. Four-bucket phase mapping algorithm is then introduced.

• Proceedings of the Optical Society of Korea Conference
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• 2003.02a
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• pp.20-21
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• 2003

Electronic speckle pattern interferometry has many applications in science and engineering. Among these, vibration measurement is the area where ESPI has many advantages over other techniques. We developed a stroboscopic ESPI system to measure the harmonic vibration of a piece of copper tape attached to a circular hole structure. Figure 1 shows the schematic diagram of the stroboscopic ESPI system. (omitted)

• Journal of Korea Ship Safrty Technology Authority
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• v.12
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• pp.36-43
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• 2003

Fatigue life estimation by the theoretical stress concentration factors are, in general, considerably different from test results. And in calculating stress concentration factor, it is very difficult to consider actual geometry and material property which are the notch shapes, imperfections or defects of materials such as porosities inclusions and casting defects, etc. Therefore, the paper deals with the experimental method to find out the more exact stress concentration factors by measuring the strain distributions on each specimen by 3D-ESPI(Electronic Speckle Pattern Interferometry) System. Then the fatigue lives are compared between theoretical calculations using stress concentration factors determined by 3D-ESPI system and fatigue test results

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.89-96
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• 2004

Micro-tensile testing system, consisting of a micro tensile loading system and micro-ESPI(Electronic Speckle Pattern Interferometry) system, has been developed for measurement of micro-tensile properties of thin micro-materials. Micro-tensile loading system had a load cell with the maximum capacity of 50N and micro actuator with resolution of 4.5nm in stroke. The system was used to apply a tensile load to the micro-sized specimen. During tensile loading, the micro-ESPI system acquired interferornetric speckle patterns in the deformed specimen and measured the in-plane tensile strain. The ESPI system consisted of a CCD-camera with a lens and the window-based program developed for this experiment. Using this system, stress-strain curves for 4 kinds of electrolytic copper foil 18$\square$m thick were obtained. From these curves, tensile properties, including the elastic modulus. yielding strength and tensile strength, were determined and also values of the plastic exponent and coefficient based on Ramberg-Osgood relationship were evaluated.

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.2
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• pp.81-86
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• 2005

This paper proposes a non-destructive ESPI technique to quantitatively evaluate defects inside a semiconductor package. The inspection system consists of the ESPI system, a thermal loading system and an adiabatic chamber. The technique is high feasibility for non-destructive testing of a semiconductor and overcomes the weaknesses of previous techniques, such as time-consumption and difficult quantitative evaluation. Most defects are classified as delamination defects, resulting from the insufficient adhesive strength between layers and from non-homogeneous heat spread. Ninety percent of the tested samples had delamination defects which originated at the corner of the chip and nay be related to heat spread design.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.90-97
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• 2001

An electronic speckle pattern interferometry (ESPI) system for measuring tensile properties under micro-tensile testing has been developed. The system consists of an optical system and an image processing system. In the optical system, optical components for measurement of in-plane deformation are arranged on the path of He-Ne laser. In the image processing system, the window-based program for acquiring speckle pattern interferometric image was developed and deformation in a small specimen is continuously evaluated during the test. Using this system, tensile strain of copper foil was measured during tensile testing. Tensile specimen had the thickness and width of 22 and 500 ${\mu}{\textrm}{m}$, respectively. Tensile properties, including the elastic modulus, yielding strength and tensile strength, of the copper were evaluated and also plastic exponent and coefficient in the Ramberg-Osgood relationship were evaluated from the stress-strain curve.

• Journal of the Korean Society for Precision Engineering
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• v.11 no.5
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• pp.161-170
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• 1994

This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interfermetry(ESPI) method, in measuring two-dimensional in- plane displacement. The analysis result of measurement by ESPI is quite comparable to that of measurement by strain gauge method. This implieds that the method of ESPI is a very effective tool in non-contact two-dimensional in-plane strain analysis. But there is a controversial point, measurement error. This error is discussed to be affected not by ESPI method itself, but by its analysis scheme of the interference fringe, where the first-order interpolation has been applied to the points of strain measured. Further development of advanced first-order interpolation method is being undertaken for the more precise in-plane strain measurement.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.65-72
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• 2009

Laser interferometry is widely used as a measuring system in many fields because of its high resolution and its ability to measure a broad area in real-time all at once. In conventional laser interferometry, for example out-of-plane ESPI (Electronic Speckle Pattern Interferometry), in plane ESPI, shearography and holography, it uses PZT or other components as a phase shift instrumentation to extract 3-D deformation data, vibration mode and others. However, in most cases PZT has some disadvantages, which include nonlinear errors and limited time of use. In the present study, a new type of laser interferometry using a laser diode is proposed. Using Laser Diode Sinusoidal Phase Modulating (LD-SPM) interferometry, the phase modulation can be directly modulated by controlling the laser diode injection current thereby eliminating the need for PZT and its components. This makes the interferometry more compact. This paper reports on a new approach to the LD (Laser Diode) Modulating interferometry that involves four-frame phase shift method. This study proposes a four-frame phase mapping algorithm, which was developed to have a guaranteed application, to stabilize the system in the field and to be a user-friendly GUI. In this paper, the theory for LD wavelength modulation and sinusoidal phase modulation of LD modulating interferometry is shown. Using modulating laser and research of measurement algorithm does comparison with existent ESPI measurement algorithm. Algorithm measures using GPIB communication through most LabVIEW 8.2. GPIB communication does alteration through PC. Transformation of measurement object measures through modulating laser algorithm that develops. Comparison of algorithm of modulating laser developed newly with existent PZT algorithm compares transformation price through 3-D. Comparison of 4-frame phase mapping, unwrapping, 3-D is then introduced.