• 한국표면공학회지
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• 제40권2호
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• pp.70-76
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• 2007

Ni-P-SiC composite coating layers were prepared by electroless plating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. The deposition rate was kept almost constant independent of the concentration of SiC in the plating solution and the codeposition of SiC in the composite coating layer increased with increased concentration of SiC in the plating solution except the early stage. Vickers microhardness increased with respect to the increased codeposition of SiC and the heat treatment at $300^{\circ}C$ in air for 1 hour. It was found that the wear volume decreased with increased up to 50 wt.% of SiC codeposition, and that friction coefficient increased gradually with increased codeposition of SiC. Considering the wear and the friction behaviors, the composite coating layer obtained by using 50 wt.% of SiC codeposition is desirable for the practical application for anti-wear and anti-friction coatings.

• 공업화학
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• 제25권3호
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• pp.268-273
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• 2014

본 연구에서는 탄소나노튜브의 전자파 차폐 성능을 향상시키고자 무전해 도금법을 이용하여 다중벽 탄소나노튜브에 니켈을 도입하였다. 니켈 도금된 다중벽 탄소나노튜브의 물리적 특성은 고분해능주사전자현미경, 열중량분석기, 표면저항측정기, 전자파 차폐능 분석기를 이용하여 분석하였다. 니켈 도금된 다중벽 탄소나노튜브의 전자파 차폐 효율은 800 MHz 영역에서 16 dB로 측정되었으며 활성화 처리된 다중벽 탄소나노튜브에 비하여 최대 1.6배 증가하였다. 또한, 평균 표면 저항 역시 $70{\Omega}/sq$로 활성화 처리된 다중벽 탄소나노튜브에 비하여 최대 56% 감소한 수치를 나타내었다. 이러한 결과는 니켈 도금 함량에 비하여 표면의 도금 형태가 전자파 차폐 효율에 더 많은 영향을 끼치기 때문인 것으로 판단된다.

• 한국표면공학회지
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• 제31권4호
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• pp.209-216
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• 1998

It is well knownthat electroledd plating is the desirable surface treatment method which is being widely used to all kinds of material such as requiring corrosing resistance, wear resistance and conductivity, especially nonconductivity materials' surface plating. However, it is suggested that there are some problems that must be solved, for exaple, rate of plating, corrosion resistance, thickness of plating film etc. Therefore in this paper, when electroless nickel plating was performed on the PZT(Pb(Zr,Ti))with varying of solution composition such as NaOH, and $H_2NCH_2COOH$, the effect of the rate of plating and corrosion resistance were investigated.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• 마이크로전자및패키징학회지
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• 제11권2호
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• pp.11-16
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• 2004

전자칩의 고집적화에 의해 전자기기들은 점점 소형화 되어가고 있으며, 이들 기기들에서 발생되는 열은 기기의 성능 저하뿐 아니라 수명을 단축시킨다. 본 연구에서는 효율적인 방열 위한 마이크로 히트싱크 제조를 위하여 멤브레인에 금속(금, 니켈, 구리)은 도금하는 무전해 도금 방법을 이용하였다. 무전해 도금은 폴리카보네이트 멤브레인을 sensitization과 activation 등의 전처리 후, 도금하고자 하는 금속염 수용액에 침적시켜 실행하였다. 무전해 도금에 의하여 제조된 각각의 마이크로피브릴의 열전달 특성과 방열량은 표면적이 가장 큰 니켈 마이크로피브릴에서 가장 우수하게 나타났다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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• pp.270-274
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• 2001

With Increasing importance of electroless nickel plating technology in many fields such as electronic and automobile industries, the treatment of the spent baths is becoming a serious problem. These spent baths contain iron and zinc as impurities, organic acids as complexing reagents, and phosphonate ions as oxidized species of tile reducing reagent. as well as several grams per liter of nickel. The spent baths are currently treated by conventional precipitation method. but a mettled with no sludge generation is desired. This work aims at establishing a recycling process of nickel from tile spent baths using solvent extraction. Extraction behaviors of nickel. iron. and zinc in various 쇼pes of real spent baths are investigated as a function of pH using LIX841, di (2-ethylhexyl)phosphoric acid (D2EHPA), and PC88A as tile extractants. Nickel is extracted by LIX84I at the equilibrium pH of more than 6 with high efficiency. For the weakly acid baths. iron and zinc are extracted by D2EHPA or PC88A without adjusting the pH of the baths leaving nickel in the aqueous phase. Stripping of nickel from LIX84I with sulfuric acid is also investigated. It is shown that concentrated nickel sulfate solution (> 100 ㎏-Ni/㎥) is obtained. This solution can be reused in the electroless plating process. Based on these findings, flow sheets for recovering nickel from the spent baths are proposed.

• Transactions on Electrical and Electronic Materials
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• 제14권3호
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• pp.133-138
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• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• 항공우주기술
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• 제8권1호
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• pp.138-143
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• 2009

액체로켓엔진 연소기에 적용된 대기 플라즈마 코팅 및 전해/무전해 도금 코팅의 열차폐 효율과 내구성 평가를 수행하였다. 연소시험 결과 대기 플라즈마 방식의 $ZrO_2$, NiCrAlY 코팅은 로켓엔진 연소기의 초음속 유동영역에서 코팅이 표면에서 박리되는 현상이 간헐적으로 발생하였으며 따라서 이러한 문제를 극복할 수 있는 대체 코팅 방식이 요구되었다. 시험 결과 열차폐 효율 및 내구성 관점에서 대기 플라즈마 방식의 $ZrO_2$, NiCrAlY 코팅의 대안으로 무전해/전해 방식을 사용한 니켈-크롬 코팅을 사용할 수 있음을 알 수 있었다.

• 한국레이저가공학회지
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• 제3권2호
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• pp.25-33
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• 2000

One of perspective direction of microfabrication is direct laser writing technology that allows to create metal, semiconductive and dielectric micropatterns on substrate surface. In this work, a two step method, the combination of seed forming process, in which metallic Al seed was selectively generated on AlN ceramic substrate by direct writing technique using a pulsed Nd : YAG laser and subsequent electroless Ni plating on the activated Al seed, was presented. The effects of laser parameters such as pulse energy, scanning speed and pulse frequency on shape of Alseed and conductor line after electroless Ni plating were investigated. The nature of the laser activated surface is analyzed from XPS data. The line width of this metallic Al and Ni is analyzed using SEM. As a results, Al seed line with 24㎛ width and 100㎛ isolated line space is obtained. Finally, laser direct writing can be applied in the field between thin and thick film technique in electronic industry.

• 한국분말재료학회지
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• 제11권3호
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• pp.224-232
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• 2004

Ni-diamond composite powders with nickel layer of round-top type on the surface of synthetic diamond (140/170 mesh) were prepared by the electroless plating method (EN) with semi-batch reactor. The effects of nickel concentration, feeding rates of reductant, temperature, reaction time and stirring speeds on the weight percentage and morphology of deposited Ni, mean particle size and specific surface area of the composite powders were investigated by Atomic Adsortion Spectrometer, SEM-EDX, PSA and BET. It was found that nucleated Ni-P islands, acted as catalytic sites for further deposition and grown into these relatively thick layers with nodule-type on the surface of diamond by a lateral growth mechanism. The weight percentage of Ni in the composite powder increased with reaction time, feeding rate of reductant and temperature, but decreased with stirring speed. The weight percentage of Ni in Ni-diamond composite powder was 55% at 150 min., 200 rpm and 7$0^{\circ}C$ .