• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.386.1-386.1
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• 2014

The ionic polymer-metal composite (IPMC), a type of electro-active polymer material, has received enormous interest in various fields such as robotics, medical sensors, artificial muscles because it has many advantages of flexibility, light weight, high displacement, and low voltage activation, compare to traditional mechanical actuators. Mostly noble metal materials such as gold or platinum were used to form the electrode of an IPMC by using electroless plating process. Furthermore, carbon-based materials, which are carbon nanotube (CNT) and reduced graphene-CNT composite, were used to alter the electrode of IPMC. To form the electrode of IPMC, we employ the synthesized graphene on copper foil by chemical vapor deposition method and use the transfer process by using a support of PET/silicone film. The properties of graphene were evaluated by Raman spectroscopy, UV/Vis spectroscopy, and 4-point probe. The structure and surface of IPMC were analyzed via field emission scanning electron microscope. The fabricated IPMC performance such as displacement and operating frequency was measured in underwater.

• Transactions on Electrical and Electronic Materials
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• v.8 no.6
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• pp.246-249
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• 2007

A triple-band antenna was developed and fabricated by LDS(Laser Direct Structuring) process. The effects of the plating rate and heat treatment condition were investigated and the gains of fabricated antennas were measured at various frequencies. The laser irradiated surface shows clearly that there are prominence and depression. It shows anchoring effect between a plating material and ablation surface. The plating rate was decreased when the plating material is exhausted in the solution. This solution needs to refreshed by the new aid solution. The copper plating thickness is decreased with the increase of heat treatment temperature in the same time but it does not change other condition. The gain of LDS antenna showed higher than the generally processed antenna. This result was related with practical use of the dimension and effective dielectric constant.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.11
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• pp.1600-1604
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• 2017

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.279-282
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• 2005

Composites comprising various volume fractions of crystalline nickel and bulk amorphous (BA) were produced by means of electroless coating of nickel on BA powder of $Cu_{54}Ni_6Zr_{22}Ti_{18}$ and subsequent spark plasma sintering (SPS) of coated BA powder. The flow curves of composites at various temperatures in the supercooled liquid region were determined by the uniaxial compression test with various strain rates. During compression at $450^{\circ}C$ with $\dot{\varepsilon}=2\times10^{-3}$, the monolithic BA sample and crystalline-BA composites displayed the superplastic deformation with $\varepsilon>1.4$. At temperatures above $460^{\circ}C$, the stress-strain curve of the monolithic BA sample depicted a sharp peak stress and a fellowing stress drop due to cracking, while those of the crystalline-BA composites displayed work-hardening up to the imposed strain. FEM analysis indicated that a fairly homogeneous strain state prevailed throughout the composite, while a higher level of stress was obtained in a harder BA.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.57-63
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• 2015

In order to prepare a low-cost conductive filler material possessing improved anti-oxidation property, Ag-coated Cu flakes were fabricated and the effects of an applying method of ammonium-based pretreatment solution on the Cu flakes were analyzed. The pretreatment solution was used to remove the surface oxide layer on Cu flake. During a single-stage pretreatment process, hole-shaped defects were formed on the flake surface during the pretreatment after 2 min, and the number and size increased in proportion to the pretreatment time. In the case that Ag plating solution was injected in the pretreatment solution after the pretreatment for 2 min, the defects were also formed during Ag plating. In contrast, the defects tremendous decreased in the case that the pretreatment solution was removed after the first pretreatment for 2 min and the Ag plating proceeded after the second pretratment using a low concentration pretreatment solution. As the final result, the 15 wt% Ag-coated Cu flake sample which was fabricated using the single-stage pretreatment oxidized at $166^{\circ}C$, but the sample fabricated by the double-stage pretreatment oxidized at $224^{\circ}C$, indicating definitely improved anti-oxidation property.

• Korean Journal of Materials Research
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• v.19 no.2
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• pp.61-67
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• 2009

Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires. 50 nm Co (Re,P) films were deposited on Cu/Ti-coated silicon wafers which acted as a catalytic seed and an adhesion layer, respectively. To obtain the optimized bath composition, electroless deposition was studied through an electrochemical approach via a linear sweep voltammetry analysis. The results of using this method showed that the best deposition conditions were a $CoSO_4$ concentration of 0.082 mol/l, a solution pH of 9, a $KReO_4$ concentration of 0.0003 mol/l and sodium hypophosphite concentration of 0.1 mol/L at $80^{\circ}C$. The thermal stability of the Co (Re,P) layer as a barrier preventing Cu was evaluated using Auger electron spectroscopy and a Scanning calorimeter. The measurement results showed that Re impurities stabilized the h.c.p. phase up to $550^{\circ}C$ and that the Co (Re,P) film efficiently blocked Cu diffusion under an annealing temperature of $400^{\circ}C$ for 1hr. The good barrier properties that were observed can be explained by the nano-sized grains along with the blocking effect of the impurities at the fast diffusion path of the grain boundaries. The transformation temperature from the amorphous to crystal structure is increased by doping the Re.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.475-480
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• 2017

In this paper, the conductivity of the fine pattern is improved in the insulating substrate by laser-induced forward transfer (LIFT) process. The high laser beam energy generated in conventional laser induced deposition processes induces problems such as low deposition density and oxidation of micro-patterns. These problems were improved by using a polymer coating layer for improved deposition accuracy and conductivity. Chromium and copper were used to deposit micro-patterns on silicon wafers. A multi-pulse laser beam was irradiated on a metal thin film to form a seed layer on an insulating substrate(SiO2) and electroless plating was applied on the seed layer to form a micro-pattern and structure. Irradiating the laser beam with multiple scanning method revealed that the energy of the laser beam improved the deposition density and the surface quality of the deposition layer and that the electric conductivity can be used as the microelectrode pattern. Measuring the resistivity after depositing the microelectrode by using the laser direct drawing method and electroless plating indicated that the resistivity of the microelectrode pattern was $6.4{\Omega}$, the resistance after plating was $2.6{\Omega}$, and the surface texture of the microelectrode pattern was uniformly deposited. Because the surface texture was uniform and densely deposited, the electrical conductivity was improved about three fold.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.225-229
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• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• Composites Research
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• v.28 no.5
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• pp.254-259
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• 2015

Carbon fiber/aluminum (CF/Al) composites were successfully fabricated without pressure casting using wettability modification of carbon fiber. The wettability of liquid aluminum on carbon fibers was enhanced through electroless plating of copper on carbon fibers. Liquid aluminum was well infiltrated into carbon fiber bundles with Cu coating layer due to low wetting angle, and a lot of pores that existed in CF/Al composite without Cu coating on CF were greatly removed. However, a few tiny pores existed in carbon fiber bundles, which is due to not bad wettability between CF and Al but shrinkage cavity that was generated during cooling of CF/Al composite. The tiny pores could be effectively removed by a subsequent rolling.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.2
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• pp.155-161
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• 2013

In this study, a metal-plated polycarbonate was adopted as a material for bipolar plates in a polymer electrolyte membrane fuel cell (PEMFC). The coated layers included 40-${\mu}m$-thick copper, 10-${\mu}m$-thick nickel, and 0.3-${\mu}m$-thick gold that respectively played the roles of current conduction, adhesion between copper and gold, and minimization of surface corrosion. The maximum power of the air-breathing PEMFC with polycarbonate bipolar plates was $120mW/cm^2$, which was similar to that of graphite bipolar plates. Finally, the maximum power of a 12-cell stack of polycarbonate bipolar plates was $132.7mW/cm^2$, and it had an operating time of 12 h. Therefore, this was considered a suitable material for bipolar plates in PEMFCs.