• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.32.1-32.1
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• 2018

Novel soft magnetic materials can be achieved by altering material properties such as morphology, composition, crystallinity, and grain size of soft magnetic alloys. Especially, magnetic properties (i.e., saturation magnetization, coarcivity) of soft magnetics are significantly affected by grain boundaries which act as a control of magnetic domain wall movement. Thus, we herein develop a two-step electroless plating method to control morphology and grain size of FeCo films for excellent magnetic properties. Accordingly, the chemical composition to control the degree of polarization of FeCo alloys was altered by electroless deposition parameters; for example, electrolyte concentration and temperature. The grain size and crystallinity of FeCo alloys was dramatically affected by the reaction temperature because the grain growth mechanism dominantly occurs at $90^{\circ}C$ where as the neucleation only happens at $50^{\circ}C$. By simply controlling the temperature, the micron-sized FeCo grains embedded FeCo film was synthesized where the large grains allow high magnetization originated from larger magnetic domain with low corecivity and the nano-sized grains allow excellent soft magnetic properties due to the magnetic correlation length.

• Applied Chemistry for Engineering
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• v.8 no.4
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• pp.568-574
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• 1997

The effect of microencapsulation of maetal hydride (MH) with copper on the electrode performance of a Ni/MH battery has been investigated. The MH electrodes were prepared with a combination of cold press and paste methods. The discharge capacity of the electrode increased with an addition of small amounts if CMC into the electrode, but decreased when heat-treated in an oxygen-free nitrogen flow. The capacity of a Cu-coated $LaNi_5$ electrode was higher than that of LaNi5electrode. The discharge capacity of the electrode prepared with Cu-coated $LaNi_5$ increased with the increase of copper content in the electrode. It is considered that the increase of copper content enhanced the current density on the electrode surface, leading to the increase of the discharge capacity The MH electrode coated by an acidic electroless plating method showed much higher discharge capacity than that using an alkaline electroless plating method. The discharge capacity of the $LaNi_{4.5}Al_{0.5}$ electrode was higher than that of the $LaNi_5$ electrode. Also, the effect of microencapsulation on the deactivation of $LaNi_5$ was studied using an absorption-desorption cycle in CO-containing hydrogen.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.

• Proceedings of the KAIS Fall Conference
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• 2004.06a
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• pp.69-71
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• 2004

새로운 기술인 Momentary mold surface heating(MmSH)은 기존의 사출성형법으로 제조된 Acrylonitrile Butadiene Styrene(ABS)의 단점을 개선한 사출성형법이다. MmSH로 제조된 ABS와 기존의 사출성형법으로 제조된 ABS의 도금특성을 도금욕 pH 변화에 따라 연구하였다. Sodium hypophosphite가 첨가된 무전해 Ni 도금욕의 PH가 증가할수록 도금 두께가 증가하였고 기존의 사출성형법으로 제조된 ABS의 경우 pH 5이상에서 4B의 밀착력을 가졌다. MmSH로 제조된 ABS의 경우 pH 6이상에서 5B인 12.3N/25mm 이상의 가장 우수한 밀착력을 나타내었다.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.27-33
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• 2008

With increasing use of portable appliances such as PDA and cellular phone, changing environment of applications requires higher solder joint reliability. The ENIG (Electroless Nickel Immersion Gold) process has been widely used for fine pitch SMT (Surface Mount Technology) and BGA (Ball Grid Array) packaged devices due to its benefits including excellent solderability, high uniformity and substantial legibility throughout the packaging process. Its brittle fracture of solder, however, has received increasingly attentions. It was Down that fracture brittleness is mainly related with black pad resulting from galvanic nickel corrosion and P-enriched layer formation between the IMC (Intermetallic Compounds) and electroless nickel layer. Theoretically, smooth electroless Ni layer was blown to have a advantages in minimizing the black pad phenomenon by uniform solution exchange during immersion gold plating. Nevertheless, how to control the surface morphology of electroless Ni layer has been hardly blown. This study investigates an effect of surface morphology of Cu underlayer on surface morphology of electroless Ni layer. To obtain various kinds of surface morphology of Cu layer, two types of Cu etching chemical and a number of Cu etching treatment were applied.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2004.11a
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• pp.238-244
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• 2004

In this study we have examined Copper and Nickel double metal layer on the synthetic fabrics by electroless chemical plating. We have focused on the shielding effect of the four kinds of woven and none-woven structure against electromagnetic fields. The shielding effectiveness of Copper and Nickel double metal layer showed between 90dB and 70dB, which are closely related to the fabric structure, that is cover factor and density. The more dense, The better shielding effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.602-606
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• 2003

Silicon has been developed as an alternate anode material for lithium secondary batteries. A simple approach to improve the electrical contact of silicon powder has described. Carbon-coated and silver-coated silicon have been prepared by chemical vapor deposition and electroless plating respectively. Assembled cells, which consisted of surface modified silicon, lithium foil and $Li^+$ contained organic electrolyte, have been studied using electrochemical methods. Carbon-coated silicon was improved in the electrochemical performance such as reversibility and resistance compared to surface-unmodified silicon.

• Applied Chemistry for Engineering
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• v.33 no.6
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• pp.630-635
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• 2022

Copper(II) oxide (CuO), electroless plated on a nitrogen-containing carbon sponge prepared by a melamine sponge thermal treatment, was developed as a nitric oxide (NO) gas sensor that operates without a wafer. The CuO content on the surface of the carbon sponge increased as the plating time increased, but the content of nitrogen known to induce NO gas adsorption decreased. The untreated carbon sponge showed a maximum resistance change (5.0%) at 18 min. On the other hand, the CuO plated sample (CuO30s-CS) showed a maximum resistance change of 18.3% in 8 min. It is considered that the improvement of the NO gas sensing capability was caused by the increase in hole carriers of the carbon sponge and improved movement of electrons due to CuO. However, the NO gas detection resistance of the CuO electroless plated carbon sponge for 60 s decreased to 1.9%. It is considered that the surface of the carbon sponge was completely plated with CuO, resulting in a decrease in the NO gas adsorption capacity and resistance change. Thus, CuO-plated carbon sponge can be used as an effective NO gas sensor because it has fast and excellent resistance change properties, but CuO should not be completely plated on the surface of the carbon sponge.

• Bulletin of the Korean Chemical Society
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• v.34 no.7
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• pp.2105-2110
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• 2013

Carbon-fiber-supported NiO catalytic filters for oxidation of volatile organic compounds were prepared by electroless Ni-P plating and subsequent annealing processes. Surface structure and crystallinity of NiO film on carbon fiber could be modified by post-annealing at different temperatures (500 and $650^{\circ}C$). Catalytic thermal decompositions of toluene over these catalytic filters were investigated. $500^{\circ}C$-annealed sample showed a higher catalytic reactivity toward toluene decomposition than $650^{\circ}C$-annealed one under same conditions, despite of its lower surface area and toluene adsorption capacity. X-ray diffraction and X-ray photoelectron spectroscopy studies suggest that amorphous structures of NiO on $500^{\circ}C$-annealed catalyst caused the higher reactivity for oxidation of toluene than that of $650^{\circ}C$-annealed sample with a higher crystallinity.

• Applied Chemistry for Engineering
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• v.16 no.2
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• pp.282-287
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• 2005

Palladium membranes, which are permselective to hydrogen separation, were used for the hydrogen purification and in membrane reactors for improving conversions by shifting the reaction equilibrium. Palladium/ceramic composite membranes were prepared by electroless plating technique and then etched in titanium chloride ($TiCl_4$) as a post treatment to enhance the membrane's durability. These membranes were used for membrane reactors in water gas shift (WGS) reaction. CO conversions for the membrane reactor were obtained according to experimental parameters and compared to the traditional reactor without a palladium/ceramic membrane. As a result, CO conversion using palladium membrane reactor at an appropriate condition was over 20~25% greater than that without the membrane reactor. The stability in the long-term test of up to 120 h for WGS reaction with the membrane reactor was good without the degredation of CO conversion.