• 한국재료학회지
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• 제8권5호
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• pp.444-449
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• 1998

EMI 차폐재를 이용하여 전자파 장해를 극복하는 방법에는 금속판을 이용하는 방법과 플라스틱 표면에 전도층을 형성하는 방법, 전도성 충진제를 플라스틱에 혼입하는 방법이 대표적으로 사용되고 있으나 각각의 방법마다 장단점이 존재하기 때문에 많은 연구들의 목적은 전자 기기 본체의 무게를 증가시키지 않고 최대한 전자파 차폐 효율을 높이는 물질 개발에 목적을 두고 있다. 이러한 목적을 위하여 본 연구에서는 비중이 낮고 판상형인 운모 분체 펴면 위에 무전해 니켈 도금을 시행하므로써 전도성을 지니는 금속화운모를 제조하여, 이를 EMI차폐용 분체로서 사용하였다. 또한 이 EMI 차폐용 분체의 특성을 고찰 하였다. 미분체 운모 표면에 무전해 니켈막 금속화운모 미분체를 도료화하여 전자파 차폐 효과를 측정한 결과 최고 63dB를 나타내었다. 이 값은 구리 금속판을 이용한 전자파 차폐의 90dB에는 못 미치지만, 도포 횟수를 6회 이상 시행했을 경우 전자파 차폐 효과가 약 10dB 정도가 증가함을 알 수 있었고, 넓은 범위의 전자파 차폐 효과를 거둘 수 있는 특징이 있다.

• 청정기술
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• 제17권2호
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• pp.103-109
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• 2011

전기도금의 seed layer를 형성하는 무전해 동도금 공정의 throwing power (TP)와 두께 편차를 개선하기 위한 공정 최적화 방법을 제시하였다. 실험계획법 (DOE)을 이용하여 가능한 모든 공정 인자들 가운데 TP와 두께 편차에 가장 큰 영향을 미치는 주요 인자를 파악해 보았다. 균일성을 가진 via filling을 위해서는 도금액 내의 Cu 이온의 농도를 높여주고 도금 온도를 낮추어 주는 것이 바람직한 것으로 판단되었으며 이는 표면 반응성의 측면에서 설명되었다. Kinetic Monte Carlo (MC) 모사가 이를 시각화하기 위해 도입되었으며 실험에서 관찰된 현상을 정성적으로 무리 없이 설명할 수 있었다. 실험계획법을 이용한 체계적인 실험과 이를 뒷받침하는 이론적인 모사가 결합된 본 연구의 접근법은 관련 공정에서 유용하게 활용될 수 있을 것이다.

• Bulletin of the Korean Chemical Society
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• 제28권8호
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• pp.1285-1288
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• 2007

Au was electrolessly deposited on polycarbonate (PC) membranes (0.1 μm pores) at the air/water interface. It was found that the Au nanotube dimension can be controlled by adjusting the plating temperature and the solution composition. Interfacial deposition of Au at relatively low temperatures (4℃) produced long nanotubes, which run through the whole membrane thickness with small openings. Increase of plating temperatures resulted in the decrease of nanotube lengths and Au film thicknesses. It was also disclosed that the inside-diameter of Au nanotubes can be controlled with negligible variations in length by changing the composition of a plating solution.

• 한국수소및신에너지학회논문집
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• 제20권4호
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• pp.291-299
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• 2009

Ni-plated polytetrafluoroethylene(Ni-PTFE) particles($25{\mu}m$, $500{\mu}m$) were prepared by using nickel electroless plating. The Ni content in Ni-PTFE particles increased with increasing the amount of reduction agent. At about 53 wt% Ni content, $25{\mu}m$ Ni-PTFE particles showed conductivity of 320S/m. The Ni-PTFE particles were formed into the Ni-PTFE plate using heat treatment at $350^{\circ}C$ under $10{\sim}1000kg/cm^2$. The Ni-PTFE plate displayed the high conductivity of 5100S/m due to the formation of 3-dimentional Ni network. The plate was used as an electrode in an alkaline fuel cell(AFC). In terms of the current density, the Ni-PTFE electrode having higher Ni content(53 wt%) showed improved performance.

• 한국표면공학회지
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• 제50권3호
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• pp.177-182
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• 2017

The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni-B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.

• Journal of Electrochemical Science and Technology
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• 제11권1호
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• pp.92-98
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• 2020

SnO₂-based high-capacity anode materials are attractive candidate for the next-generation high-performance lithium-ion batteries since the theoretical capacity of SnO₂ can be ideally extended from 781 to 1494 mAh g^-1. Here 3D etched Cu foam is applied as a current collector for electron path and simultaneously a substrate for the SnO₂ coating, for developing an integrated electrode structure. We fabricate the 3D etched Cu foam through an auto-catalytic electroless plating method, and then coat the SnO₂ onto the self-supporting substrate through a simple sol-gel method. The catalytic dissolution of Cu metal makes secondary pores of both several micrometers and several tens of micrometers at the surface of Cu foam strut, besides main channel-like interconnected pores. Especially, the additional surface pores on etched Cu foam are intended for penetrating the individual strut of Cu foam, and thereby increasing the surface area for SnO₂ coating by using even the internal of Cu foam. The increased areal capacity with high structural integrity upon cycling is demonstrated in the SnO₂-coated 3D etched Cu foam. This study not only prepares the etched Cu foam using the spontaneous chemical reactions but also demonstrates the potential for electroless plating method about surface modification on various metal substrates.

• 한국표면공학회지
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• 제46권1호
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• pp.9-15
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• 2013

The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duration from 1 to 30 minutes. Sample with more than 1 mA of additional electrical current for 1 minute showed higher adhesion strength than that without additional electrical current. However, samples with 10 mA of additional electrical current for more than 10 miniutes showed the degradation of adhesion strength. Ra and RMS values of the peeled polyimide surface were proportional to the adhesion strength though there were no significant changes in the morphology of the peeled surfaces with varied amount and time-length of additional electrical current. Applying electrical current could increase the density of chemical bonding, which results in increase of the adhesion strength between copper and polyimide. However, in the case of applying additional electrical current for excessive amount or time, the degradation of the adhesion strength owing to the formation of copper oxide at the interface could occur.

• Bulletin of the Korean Chemical Society
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• 제32권5호
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• pp.1630-1634
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• 2011

Electroless plating of metallic nickel on carbon fiber surfaces was carried out to control specific electric resistivity of the fibers, and the effects of the nickel content and coating thickness on the electric properties were studied. The structural and surface properties of the carbon fibers were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), and X-ray photoelectron spectroscopy (XPS). The specific resistivity of the fibers was measured using a four-point probe testing method. From the XPS results, the oxygen and Ni atomic ratio of the fibers was greatly enhanced as the plating time increased. Additionally, it was observed that the specific electric resistivity decreased considerably in the presence of metallic nickel particles and with the formation of nickel layers on carbon fibers.

• 전기화학회지
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• 제10권2호
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• pp.88-93
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• 2007

Nano-sized Sn particles were coated with Ni-P layer using an electroless deposition method and their anodic performance was tested for lithium secondary batteries. Uniform coating layers were obtained, of which the thickness was controlled by varying the $Ni^{2+}$ concentration in the plating bath. It was found that the Ni-P layer plays two important roles in improving the anodic performance of Sn powder electrode. First, it prevents the inter-particle aggregation between Sn particles during the charge/discharge process. Second, it provides an electrical conduction pathway to the Sn particles, which allows an electrode fabrication without an addition of conductive carbon. A pseudo-optimized sample showed a good cyclability and high capacity ($>400mAh\;g^{-1}$) even without conductive carbon loading.

• 한국재료학회지
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• 제5권8호
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• pp.1013-1019
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• 1995

본 연구에서는 무전해 도금범으로 polyester film 상에 Co-Ni-P 박막을 석출시키고, pH, 온도 그리고 도금용액의 농도에 따른 도금속도 및 석출된 도금박막의 합금조성과 합금조성에 따른 자기적 특성을 고찰하였다. 무전해도금의 석출속도는 pH 8.5, 온도 90℃일때 가장 좋았으며, 자기적 특성도 이 때가 가장 좋았다. 합금조성은 pH와 착화제의 농도에 따라서는 크게 변화하였으나, 그 밖의 인자들에 의해서는 변화하지 않았다. 최적조건에서 만들어진 박막의 합금조성은 코발트가 78%, 니켈이 16%, 인이 6%였고, 보자력은 370 Oe, 각형비는 0.65였다. 박막은 합금조성에 따라 경질자성막과 연질자성막의 두가지 형태로 변화했고, 니켈이 30% 이상 공석(共席)되었을 때, 연질자성막으로 되었다. 연질자성막일때, 합금박막의 결정구조는 니켈이 강하게 배향된 비정질 형태를 나타냈고, 경질자성 막일때는, 코발트(101)과 (100)면으로 배향된 α-코발트의 hcp 결정구조를 나타내었다.