• Title/Summary/Keyword: electro-resistance

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Improvement of Activated Sludge Dewaterability by Electro-flotation (전해부상을 이용한 활성슬러지의 탈수성 향상)

  • Choi, Young-Gyun;Park, Byung-Ju;Park, Min-Jung;Kim, Yun-Jung;Chung, Tai-Hak
    • Journal of Korean Society of Water and Wastewater
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    • v.20 no.5
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    • pp.677-684
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    • 2006
  • Electro-flotation(EF), a novel sludge thickening method, could improve the dewaterability of activated sludge. The gas(microbubbles) generated during EF decreased the solid-liquid separation time below 1/5 of the time required for gravity sedimentation. In addition, over 90% of the sludge volume reduction could be achieved by EF although the settling characteristics of the sludge was very poor. The SRF(specific resistance to filtration) of the thickened sludge by EF was much lower than that of the sludge thickened by gravity sedimentation. The SRF of the thickened sludge decreased exponentially with increase of gas generation rate of the EF system. Gas generation rate could be controlled by varying the current density of the electrode. Degasing of the microbubbles by vigorous mixing of the thickened sludge layer deteriorated the dewaterability of the sludge. Therefore, it is obvious that the gas bubbles entrapped in the thickened sludge play a key role in the observed dewaterability improvement.

Planarizaiton of Cu Interconnect using ECMP Process (전기화학 기계적 연마를 이용한 Cu 배선의 평탄화)

  • Jeong, Suk-Hoon;Seo, Heon-Deok;Park, Boum-Young;Park, Jae-Hong;Jeong, Hae-Do
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.3
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    • pp.213-217
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    • 2007
  • Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

Comparison of the Characteristics of Cu-Sn and Ni Pre-Plated Frames Prepared by Electro-Plating (전기도금된 Cu-Sn과 Ni preplated frame의 특성 비교)

  • Lee, D.H.;Jang, T.S.;Hong, S.S.;Lee, J.W.;Yang, H.W.;Hahn, B.K.
    • Journal of the Korean institute of surface engineering
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    • v.39 no.6
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    • pp.276-281
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    • 2006
  • In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

Analysis of Eddy Current Loss Considering Interaction Effect in Metal Sheath of 154 kV Three Phase Power Cable (154 kV 3상 전력 케이블의 상호작용에 따른 금속 Sheath에서 발생하는 와전류 손실 분석)

  • Im, Sang Hyeon;Kim, Ki Byung;Park, Gwan Soo
    • KEPCO Journal on Electric Power and Energy
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    • v.6 no.4
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    • pp.389-392
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    • 2020
  • In order to accurately predict the losses in the power cable, analysis of the eddy current losses in the metal sheath is required. The copper loss is easily calculated by the resistance and current of the conductor, but it is difficult to measure and predict the eddy current generated from the metal sheath. For this purpose, the previous study analyzed the eddy current loss in single phase cable, but there is a limit to apply it because three phase cables are used in real environment. Therefore, in this paper, the eddy current loss occurring in the metal sheath of three phase cable according to the cause was analyzed theoretically. In addition, the eddy current loss occurring in the triangular and horizontal array were predicted through electromagnetic numerical analysis.

Effect of Process Parameters on Microhardness of Ni-Al2O3 Composite Coatings (Ni-Al2O3 복합코팅의 마이크로 경도에 대한 공정변수의 영향)

  • Jin, Yeung-Jun;Park, Simon
    • Journal of the Korean Society of Industry Convergence
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    • v.25 no.6_2
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    • pp.1037-1045
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    • 2022
  • In this study, nanoscale Al2O3 ceramic particles were used due its exceptionally high hardness characteristics, chemical stability, and wear resistance properties. These nanoparticles will be used to investigate the optimal process conditions for the electro co-deposition of the Ni-Al2O3 composite coatings. A Watts bath electrolytic solution of a controlled composition along with a fixed agitation speed was used for this study. Whereas the current density, the pH value, temperature and concentration of the nano Al2O3 particles of the electrolyte were designated as the manipulative variables. The experimental design method was based on the orthogonal array to find the optimum processing parameters for the electro co-deposition of Ni-Al2O3 composite coatings. The result of confirmation experimental based on the optimal processing condition through the analysis of variance ; EDX analysis found that the ratio of alumina increased to 8.65 wt.% and subsequently the overall hardness increased to 983 Hv. Specially, alumina were evenly distributed on Nickel matrix and particles were embedded more firmly and finely in Nickel matrix.

Interfacial Properties and Sensing of Carbon Nanofiber/Tube and Electrospun Nanofiber/Epoxy Composites Using Electrical Resistance Measurement and Micromechanical Technique (전기저항측정 및 미세역학시험법을 이용한 탄소나노섬유/튜브 및 전기방사된 나노섬유/에폭시 복합재료의 계면특성 및 감지능 연구)

  • Jung Jin-Gyu;Kim Sung-Ju;Park Joung-Man
    • Composites Research
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    • v.18 no.4
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    • pp.21-26
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    • 2005
  • Nondestructive damage sensing and load transfer mechanisms of carbon nanotube (CNT) and nanofiber (CNF)/epoxy composites have been investigated by using electro-micromechanical technique. The electrospun PVDF nanofibers were also prepared as a piezoelectric sensor. The electro-micromechanical techniques were applied to evaluate sensing response of carbon nanocomposites by measuring electrical resistance under an uniform cyclic loading. Composites with higher volume content of CNT showed significantly higher tensile properties than neat and low volume$\%$ CNT composites. CNT composites showed humidity sensing within limited temperature range. CNT composites with smaller aspect ratio showed higher apparent modulus due to high volume content in case of shorter aspect ratio. Thermal treated electrospun PVDF nanofiber showed higher mechanical properties than the untreated case due to crystallinity increase, whereas load sensing decreased in heat treated case. Electrospun PVDF nanofiber web also showed sensing effect on humidity and temperature as well as stress transferring. Nanocomposites and electrospun PVDF nanofiber web can be applicable for sensing application.

Study on Micro Dried Bio-potential Electrodes Using Conductive Epoxy on Textile Fabrics (전도성 에폭시를 이용한 직물 위에 구현된 건식 생체전위 전극의 연구)

  • Cha, Doo-Yeol;Jung, Jung-Mo;Kim, Deok-Su;Yang, Hee-Jun;Choi, Kyo-Sang;Choi, Jong-Myong;Chang, Sung-Pil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.5
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    • pp.367-372
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    • 2013
  • In this paper, micro dried bio-potential electrodes are demonstrated for sEMG (surface ElectroMyoGraphic) signal measurement using conductive epoxy on the textile fabric. Micro dried bio-potential electrodes on the textile fabric substrate have several advantages over the conventional wet/dry electrodes such as good feeling of wearing, possibility of extended-wearing due to the good ventilation. Also these electrodes on the textile fabric can easily apply to the curved skin surface. These electrodes are fabricated by the screen-printing process with the size of $1mm{\times}10mm$ and the resultant resistance of these electrodes have the average value of $0.4{\Omega}$. The conventional silver chloride electrode shows the average value of $0.3{\Omega}$. However, the electrode on the textile fabric are able to measure the sEMG signal without feeling of difference and this electrode shows the lower resistance of $1.03{\Omega}$ than conventional silver chloride electrode with $2.8{\Omega}$ in the condition of the very sharp curve surface (the radius of curvature is 40 mm).

Cold electronics based 128 temperature sensor interface with 14 leads for testing of high Tc superconducting cable

  • Gour, Abhay Singh;Thadela, S.;Rao, V.V.
    • Progress in Superconductivity and Cryogenics
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    • v.20 no.1
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    • pp.11-14
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    • 2018
  • High Temperature Superconducting (HTS) power cables are capable of transmitting bulk power without any loss compared to conventional copper cables. The major challenge in the design of such HTS cables is the high stresses (electro-thermal/electro-mechanical) developed at high voltages, high currents and cryogenic temperatures. The safe and reliable operation of HTS cables involves lots of instrumentation for monitoring, measurement, control and safe operation. In principle, a four probe method for resistance (RTD PT-100) is used for temperature measurements at various locations of HTS cable. The number of connecting leads required for this is four times that of the number of sensors. The present paper discusses a novel way of connecting 128 RTD sensors with the help of only 14 leads using a cold electronics based multiplexer board. LabVIEW 11.0 software was used for interfacing and displaying the readings of all the sensors on computer screen.

On Feasibility Study of the Charged Particle Beam Pretreatment Process for Non-conducting Metal Coating (무전도 금속 증착을 위한 하전 입자빔 전처리 공정의 타당성 연구)

  • Na, Myung Hwan;Park, Young Sik;Shim, Ha-Mong;Chun, Young Ho
    • Journal of Korean Society for Quality Management
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    • v.42 no.2
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    • pp.179-187
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    • 2014
  • Purpose: Since several problems were found when present non-conducting metal coating process was applied to mass production, we study and develop to improve those problems. Methods: In this paper, a couple of analysis methods such as surface hardness, XPS spectrum analysis, morphology, and reflection ratio were used. Results: This paper suggest a new possibility of Non-conducting thin metal coating method that has quality of mass production phase without UV coating process. Conclusion: By the result of analysis, we can set optimized process conditions of the electro deposition coating using electron beam.

Interfacial Properties of Electrodeposited Carbon Fiber/Epoxy Composites using Electro-Micromechanical Techniques and Nondestructive Evaluations

  • Park, Joung-Man;Lee, Sang-Il
    • Macromolecular Research
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    • v.9 no.1
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    • pp.20-29
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    • 2001
  • Interfacial adhesion and nondestructive behavior of electrodeposited (ED) carbon fiber rein-forced composites were evaluated using electro-micromechanical techniques and acoustic emission (AE). The interfacial shear strength (IFSS) of the ED carbon fiber/epoxy composites was higher than that of the untreated fiber. This might be expected because of the possibility of chemical or hydrogen bonding in an electrically adsorbed polymeric interlayer. The logarithmic electrical resistivity of the untreated single-carbon fiber composite increased suddenly to infinity when fiber fracture occurred, whereas that of the ED composite increased relatively gradually to infinity. This behavior may arise from the retarded fracture time due to enhanced IFSS. In single- and ten-carbon fiber composites, the number of AE signals coming from interlayer failure of the ED carbon fiber composite was much larger than that of the untreated composite. As the number of the each first fiber fractures increased in the ten-carbon fiber composite, the electrical resistivity increased stepwise, and the slope of the logarithmic electrical resistance increased.

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