• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.6
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• pp.140-147
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• 2011

The injection nozzle of an electro-hydraulic injector for the common rail Diesel fuel injection system is being opened and closed by movement of a injector's needle which is balanced by pressure at the nozzle seat and at the needle control chamber, at the opposite end of the needle. In this study, the slenoid actuator was considered as a prime movers in high pressure Diesel injector. Namely a solenoid-driven Diesel injector with different driving current types, as a general method driven by solenoid coil energy, has been applied with a purpose to develop the analysis model of the solenoid actuator to predict the dynamics characteristics of the hydraulic component (injector) by using the AMESim code. Aimed at simulating the hydraulic behavior of the solenoid-driven injector, the circuit model has been developed as a unified approach to mechanical modeling in this study. As this analytic results, we know the suction force and first order time lag for driving force can be endowed in solenoid-driven injector in controlling the injection rate. Also it can predict that the input current wave exerted on solenoid coil is the dominant factor which affects on the initial needle behavior of solenoid-driven injector than the hydraulic force generated by the constant injection pressure.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.6
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• pp.78-86
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• 2014

In this paper, a novel intensity-based fiber optic vibration sensor using a mass-spring structure, which consists of four serpentine flexure springs and a rectangular aperture within a proof mass, is proposed and its feasibility test is given by the simulation and experiment. An optical collimator is used to broaden the beam which is modulated by the displacement of the rectangular aperture within the proof mass. The proposed fiber optic vibration sensor has been analyzed and designed in terms of the optical and mechanical parts. A mechanical structure has been designed using theoretical analysis, mathematical modeling, and 3D FEM (Finite Element Method) simulation. The relative aperture displacement according to the base vibration is given using FEM simulation, while the output beam power according to the relative displacement is measured by experiment. The simulated sensor sensitivity of $15.731{\mu}W/G$ and detection range of ${\pm}6.087G$ are given. By using reference signal, the output signal with 0.75% relative error shows a good stability. The proposed vibration sensor structure has the advantages of a simple structure, low cost, and multi-point sensing characteristic. It also has the potential to be made by MEMS (Micro-Electro-Mechanical System) technology.

• Korean Chemical Engineering Research
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• v.60 no.1
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• pp.86-92
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• 2022

Recently, the bio-healthcare market is enlarging worldwide due to various reasons such as the COVID-19 pandemic. Among them, biometric measurement and analysis technology are expected to bring about future technological innovation and socio-economic ripple effect. Existing systems require a large-capacity battery to drive signal processing, wireless transmission part, and an operating system in the process. However, due to the limitation of the battery capacity, it causes a spatio-temporal limitation on the use of the device. This limitation can act as a cause for the disconnection of data required for the user's health care monitoring, so it is one of the major obstacles of the health care device. In this study, we report the concept of a standalone healthcare monitoring module, which is based on both triboelectric effects and electromagnetic effects, by converting biomechanical energy into suitable electric energy. The proposed system can be operated independently without an external power source. In particular, the wireless foot pressure measurement monitoring system, which is rationally designed triboelectric sensor (TES), can recognize the user's walking habits through foot pressure measurement. By applying the triboelectric effects to the contact-separation behavior that occurs during walking, an effective foot pressure sensor was made, the performance of the sensor was verified through an electrical output signal according to the pressure, and its dynamic behavior is measured through a signal processing circuit using a capacitor. In addition, the biomechanical energy dissipated during walking is harvested as electrical energy by using the electromagnetic induction effect to be used as a power source for wireless transmission and signal processing. Therefore, the proposed system has a great potential to reduce the inconvenience of charging caused by limited battery capacity and to overcome the problem of data disconnection.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.84.2-84.2
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• 2010

PEMS (printed electro-mechanical system) is fabricated by means of various printing technologies. Passive and active components in 2D or 3D such as conducting lines, resistors, capacitors, inductors and TFT, which are printed with functional materials, can be classified in this category. And the issue of PEMS is applied to a R2R process in the manufacturing process. In many electro-devices, the vacuum process is used as the manufacturing process. However, the vacuum process has a problem: it is difficult to apply toa continuous process as a R2R printing process. In this paper, we propose an ESD (electro static deposition) printing process has been used to apply an organic solar cell of thin film forming. ESD is a method of liquid atomization by electrical forces, anelectrostatic atomizer sprays micro-drops from the solution injected into the capillary, with electrostatic force generated by electric potential of about tens of kV. ESD method is usable in the thin film coating process of organic materials and continuous process as a R2R manufacturing process. Therefore, we experiment the thin films forming of PEDOT:PSS layer and Active layer which consist of the P3HT:PCBM. The result of experiment, organic solar cell using ESD thin film coated method is occurred efficiency of about 1.4%. Also, the case of only used to ESD method in the active layer coating is occurred efficiency of about 1.86% as the applying a spin coating in the PEDOT:PSS layer. We can expect that ESD method is possible for continuous process to manufacture in the organic solar cell or OLED device.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.113.1-113.1
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• 2011

PEMS (printed electro-mechanical system) is fabricated by means of various printing technologies. Passive and active compo-nents in 2D or 3D such as conducting lines, resistors, capacitors, inductors and TFT(Thin Film Transistor), which are printed withfunctional materials, can be classified in this category. And the issue of PEMS is applied to a R2R process in the manu-facturing process. In many electro-devices, the vacuum process is used as the manufacturing process. However, the vacuum process has a problem, it is difficult to apply to a continuous process such as a R2R(roll to roll) printing process. In this paper, we propose an ESD (electro static deposition) printing process has been used to apply an organic solar cell of thin film forming. ESD is a method of liquid atomization by electrical forces, an electrostatic atomizer sprays micro-drops from the solution injected into the capillary with electrostatic force generated by electric potential of about several tens kV. ESD method is usable in the thin film coating process of organic materials and continuous process as a R2R manufacturing process. Therefore, we experiment the thin films forming of PEDOT:PSS layer and active layer which consist of the P3HT:PCBM. The organic solar cell based on a P3HT/PCBM active layer and a PEDOT:PSS electron blocking layer prepared from ESD method shows solar-to-electrical conversion efficiency of 1.42% at AM 1.5G 1sun light illumination, while 1.86% efficiency is observed when the ESD deposition of P3HT/PCBM is performed on a spin-coated PEDOT:PSS layer.

• Structural Engineering and Mechanics
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• v.30 no.2
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• pp.191-209
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• 2008

A structural monitoring system based on cheap and wireless monitoring system is investigated in this paper. Due to low-cost and low power consumption, micro-electro-mechanical system (MEMS) is suitable for wireless monitoring and the use of MEMS and wireless communication can reduce system cost and simplify the installation for structural health monitoring. For system identification using wireless MEMS, a finite element (FE) model updating method through correlation with the initial analytical model of the structure to the measured one is used. The system identification using wireless MEMS is evaluated experimentally using a three storey frame model. Identification results are compared to ones using data measured from traditional accelerometers and results indicate that the system identification using wireless MEMS estimates system parameters with reasonable accuracy. Another smart sensor considered in this paper for structural health monitoring is Lead Zirconate Titanate (PZT) which is a type of piezoelectric material. PZT patches have been applied for the health monitoring of structures owing to their simultaneous sensing/actuating capability. In this paper, the system identification for building structures by using PZT patches functioning as sensor only is presented. The FE model updating method is applied with the experimental data obtained using PZT patches, and the results are compared to ones obtained using wireless MEMS system. Results indicate that sensing by PZT patches yields reliable system identification results even though limited information is available.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.63-68
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• 2009

As the complexity of the power system becomes higher, tests of the new devices, such as exciter and PCS(Power Conversion System) of the distributed generation sources, in the real operating condition are more important. However tests of the unverified devices in the real power system may cause hazardous malfunction of the system. In order to avoid this problem, power devices may be tested with the real-time simulators instead of the real power system. This paper presents an real-time multi machine power system simulator using PCs(Personal Computer) and Fast Ethernet. Developed real-time simulator performs the electro-mechanical dynamic simulation of multi-machine power system by the network distributed computing technique. Because the simulator consists of usual PCs and Fast Ethernet, it is possible to make up a simulation system very cheaper than the conventional real-time simulator which consists of dedicated expensive hardware devices. The performance of the developed simulator is tested and verified with the scaled model excitation system. The test which adjust the control parameters of the exciter is performed with the well-known New England 10 generator 39 bus sample power system.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.2
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• pp.57-62
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• 2003

Nano-bending method is presented to measure the Poisson's ratio of thinfilms for MEMS (Micro-Electro-Mechanical Systems) applicaiton. The douvle-ring specimen is designed and fabricated based on the surface micromachining process to facilitate the measurement of the Poisson's ratio. The Poisson's ratio can be obtained through analyzing the linear load-displacement relationship of the double ring specimen subjected to nano-indenter loading. The Present nano-bending mehod is an in-situ measurement approach due to the compatibility to the surface micromachining process. The Poisson's ratio is locally obtained at the location of the double ring specimen with micro dimension. To validate the nano-bending method, the Poisson's ratio of LPCVD (Low Pressure Chemical Vapor Deposition) poly-silicon with thickness of 2.3㎛ is investigated. Experimental results reveal that the Poisson's ratio of the poly-silicon film is 0.2569. The standard deviation of the nano-bending measurement for the stiffness of double ring specimens is 2.66%.

• Journal of Drive and Control
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• v.12 no.3
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• pp.52-59
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• 2015

An electro hydraulic poppet valve (EHPV) and a variable orifice poppet are assembled in a single block, which is referred to as a RHINO but is also generally called a pilot-operated flow control valve. In this study, we analyzed the structure and the operating principle for a RHINO applied in a 21-ton electric excavator system. The RHINO was experimentally tested to measure the dynamic responses and the pressure energy loss. In this test, we investigated the variation in the conductance coefficient according to the increase in the supply pressure under a constant current and a variation in the flow rate according to the increase in the current. Then, the geometrical shapes and the spring stiffness of the RHINO were considered to develop an analysis model. The characteristics (current-force and hysteresis) for the solenoid based on the experimental data were reflected in the analysis model that was developed, and the reliability of the analysis model was also verified by comparing the experimental and analytical results. The developed model is thus considered to be reliable for use in a wide range of applications, including optimum design, sensitivity analysis, parameter tuning, etc.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.