• Title/Summary/Keyword: edge-stiffeners

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The Buckling Analysis of Stiffened Plate with Hole(3rd Report) -compression and shear buckling- (보강(補剛)된 유공판(有孔板)의 좌굴강도해석(挫屈强度解析)(제3보)(第3報) -압축(壓縮) 및 전단좌굴(剪斷挫屈))

  • Chang-Doo,Jang;Seung-Soo,Na
    • Bulletin of the Society of Naval Architects of Korea
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    • v.22 no.1
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    • pp.9-20
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    • 1985
  • Generally the stiffened plate in the ship structure is subjected to not only axial load but shear load. With respect to those combined loads buckling analysis in necessary. In this paper, buckling strength is analyzed by using Finite Element Method when the stiffened plate with hole is under loading conditions mentioned above. To obtain the higher buckling strength, we need some reinforcement. The methods of reinforcement are attaching doubler around hole and stiffeners in the arbitrary directions For the sake of convenience those arbitrary directions were selected paralleled($0^{\circ}C$), vertical($90^{\circ}C$)and oblique($45^{\circ}C$) to the edge. Two kinds of method mentioned above are investigated, it is clarified that which of the two is more effective reinforcement. From the viewpoint of buckling strength, following conclusions were obtained. When external load direction is unknown, doubler reinforcement is more effective than those of parallel and vertical stiffener. And oblique stiffener reinforcement is more effective than that of doubler when external load direction is know.

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Cyclic Seismic Testing of Steel Moment Connections Reinforced with Welded Straight Haunch (용접 수평헌치로 보강된 철골 모멘트 접합부의 반복재하 내진실험)

  • 이철호;권근배;정종현;오명호;구은숙
    • Journal of the Earthquake Engineering Society of Korea
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    • v.6 no.4
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    • pp.31-37
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    • 2002
  • Recently a simplified design procedure as well as load transfer model for seismic steel moment connections with welded straight haunch have been proposed by Lee and Uang. Cyclic seismic testing was conducted to verify the proposed design procedure and to develop the details that will prevent the cracking at the haunch tip, where stress concentration was the highest. All the specimens thus designed effectively pushed plastic hinging away from the haunch tip and were able to develop satisfactory plastic rotation capacity of 0.04 radian with no fracture. A sloped edge combined with drilling a hole near the haunch tip or a pair of stiffeners(partially or fully) extended from the beam web successfully prevented the crack initiation at the haunch tip. The strut action of the haunch web, which had been predicted from the previous analytical study, was also experimentally identified through the strain gage readings.

Characteristic Validation of High-damping Printed Circuit Board Using Viscoelastic Adhesive Tape (점탄성 테이프를 적용한 고댐핑 적층형 전자기판의 기본 특성 검증)

  • Shin, Seok-Jin;Jeon, Su-Hyeon;Kang, Soo-Jin;Park, Sung-Woo;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.48 no.5
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    • pp.383-390
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    • 2020
  • Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.