• Journal of the Korean Geotechnical Society
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• v.30 no.4
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• pp.5-19
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• 2014

In this study, the structural analysis is performed on the method of shallow block and deep cement mixing pile, and then their characteristics and associated behaviors were analyzed. In the case of continuous beam analysis, the predicted settlement was very small, and shear force and bending stress are somewhat overestimated. The frame method is similar to numerical analysis in the internal force shallow block and long pile, but because the settlement of pile is underestimated, the additional calculation using the reaction of the long pile is necessary. For soil arching method and piled raft foundation method, the excessive axial force of long pile was predicted because the load sharing of pile is very large compared to the other methods. In the behavior of the shallow block and deep pile method, the settlement of shallow block and contact pressure are much in the center than the edge. In the estimating method considering the interaction between improved material and ground, the load sharing of the soil-cement pile ranges from 20% to 45%, and the stress ratio is 2.0~5.0 less than piled DCM. The maximum member forces at the boundary conditions of pile head are similar, but in fixed head the axial force and vertical displacement are different in accordance with pile arrangement.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.32 no.4_1
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• pp.319-326
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• 2014

The accurate geo-referencing processes that apply ground control points is prerequisite for effective end use of HRSI (High-resolution satellite imagery). Since the conventional control point acquisition by human operator takes long time, demands for the automated matching to existing reference data has been increasing its popularity. Among many options of reference data, the airborne LiDAR (Light Detection And Ranging) data shows high potential due to its high spatial resolution and vertical accuracy. Additionally, it is in the form of 3-dimensional point cloud free from the relief displacement. Recently, a new matching method between LiDAR data and HRSI was proposed that is based on the image projection of whole LiDAR data into HRSI domain, however, importing and processing the large amount of LiDAR data considered as time-consuming. Therefore, we wmotivated to ere propose a local LiDAR chip generation for the HRSI geo-referencing. In the procedure, a LiDAR point cloud was rasterized into an ortho image with the digital elevation model. After then, we selected local areas, which of containing meaningful amount of edge information to create LiDAR chips of small data size. We tested the LiDAR chips for fully-automated geo-referencing with Kompsat-2 and Kompsat-3 data. Finally, the experimental results showed one-pixel level of mean accuracy.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.