• Composites Research
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• v.14 no.1
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• pp.8-14
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• 2001

A simplified method for determining the three mode(I, II, III) components of the strain energy release rate of free-edge delaminations in composite laminates is proposed. The interlaminar stresses are evaluated using the interface moment and the interface shear forces which are obtained from the equilibrium equations at the interface between the adjacent layers. Deformation of an edge-delaminated laminate is analysed by using a generalized quasi-three dimensional classical laminated plate theory. The analysis provides closed-form expression for the three components of the strain energy release rate. The analyses are performed for composite laminates subjected to uniaxial tension, with free-edge delaminations located symmetrically and asymmetrically with respect to the laminate midplane. The analysis results agreed with a finite element solution using the virtual crack closure technique.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.4
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• pp.18-25
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• 1993

This paper is to aim the microdefect evaluation of If package into a quantitative from NDI's image processing of ultrasonic wave. (1) Automatically repeated discrimination analysis method can be devided in the category of all kind of defects on IC package, and also can be possible to have a sampling of partial delamination. (2) It is possible that the information of edge section in silicon chip surrounding can be extractor by the partial image processing of IC package. Also, the crack detection is possible between the resin part and lead frame.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.27-33
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• 2002

The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.345-350
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• 2002

In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method fur entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• Structural Engineering and Mechanics
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• v.43 no.5
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• pp.657-678
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• 2012

The mismatch of ply orientations in composite laminates can cause high interlaminar stress concentrations near the free edges. Evaluation of these interlaminar stresses and their role in the progressive damage analysis of laminates is desirable. Recently, the authors developed a new method to relate the physically based micromechanics approach with the meso-scale CDM considering matrix cracking and induced delamination. In this paper, the developed method is applied for the analysis of edge effects in various angle-ply laminates such as $[10/-10]_{2s}$, $[30/-30]_{2s}$ and $[45/-45]_{2s}$ and comparing the results with available traditional CDM and experimental results. It is shown that the obtained stress-strain behaviors of laminates are in good agreement with the available experimental results and even in better agreement than the traditional CDM results. Variations of the stresses and stiffness components through the laminate thickness and near the free edges are also computed and compared with the available CDM results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.721-726
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• 2005

In this study, researchers classifying the artificial flaws in semiconductor. packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.4
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• pp.274-286
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• 2005

Fracture behaviors and acoustic emission (AE) characteristics of single-edge-notched monolithic aluminum plates and glass fiber/aluminum hybrid laminate plates have been investigated under tensile loads. AE signals from monolithic aluminum could be classified into two different types: signals with low frequency band and high frequency band. High frequency signals were detected in the post stage of loading beyond displacement of 0.45mm. For glass fiber/aluminum laminates, AE signals with high amplitude and long duration were additionally confirmed on FFT frequency analysis, which corresponded to macro-crack propagation and/or delamination between A1 and fiber layers. On the basis of the above AE analysis and fracture observation with optical microscopy and ultrasonic T scan, characteristic features of AE associated with fracture processes of single-edge-notched glass fiber/aluminum laminates were elucidated according to different fiber ply orientations.

• Composites Research
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• v.18 no.2
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• pp.1-12
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• 2005

Fracture behaviors of single-edge-notched monolithic aluminum plates and glass fiber/aluminum laminates under tensile loadings have been studied using acoustic emission(AE) monitoring. AE signals from monolithic aluminum could beclassified into two different types. For glass fiber/aluminum laminates, AE signals with high amplitude and long duration were additionally confirmed on FFT frequency analysis, which corresponded to macrocrack propagation and/or delamination. AE source location determined by signal arrival time showed the zone of fracture. On the basis of the above AE analysis and fracture observation, characteristic features of fracture processes of single-edge-notched glass fiber/aluminum laminates were elucidated according to different fiber ply orientations and fiber/aluminum lay-up ratios.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.14 no.1
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• pp.30-36
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• 2005

This study is to investigate a damage estimation of single edge notched tensile specimens as a function of acoustic emission(AE) according to the uni-directionally oriented carbon fiber/epoxy composites, CFRP In fiber reinforced composite materials, AE signals due to several types of failure mechanisms are typically observed. These are due to fiber breakage, fiber pull-out matrix cracking, delamination, and splitting or fiber bundle breaking. And these are usually discriminated on the basis of amplitude distribution, event counts, and energy related parameters. In this case, AE signals were analyzed and classified 3 regions by AE event counts, energy and amplitude for corresponding applied load. Bath-tub curve shows 3 distinct periods during the lifetime of a single-edge-notch(SEN) specimen. The characterization of AE generated from CFRP during SEN tensile test is becoming an useful tool f3r the prediction of damage failure or/and failure mode analysis.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.