• Title/Summary/Keyword: dynamic scanning

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Using a high-resolution LED display Dual Scanning Image Control System Design (듀얼 스캐닝을 이용한 고해상 LED 전광판 영상제어장치설계)

  • Ha, Young-Jea;Kim, In-Jea;Kim, Sun-Hyung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.15 no.7
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    • pp.1415-1422
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    • 2011
  • In this paper, full color billboards for the efficient expression of the resolution to offer dual-scanning control method, using the LED display it on a fixed pixel video signal to the pixel dot pattern was changed. And DICT(Dynamic Image Correction Technology) using the main controller in accordance with video information, histogram equalization of image gray scale values to be uniformly distributed, and dynamically improves image quality by converting the area, and a dual auto-scan input video switching controller board as the pixels in the LED Module by controlling the physical manifestation of the existing board LED pixel dots than 4 times the resolution proposes a technique that can be expressed and made it through testing verified the performance.

Cure Reaction of Epoxy Resin System with MN/HQ (MN/HQ가 첨가된 에폭시 수지계의 경화반응 연구)

  • Chun, In-Sook;Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.5 no.6
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    • pp.967-974
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    • 1994
  • We studied the cure kinetics of the DGEBA(Diglycidyl ether of bisphenol A)/MDA(4, 4' -methylene dianiline)/MN(Malononitrile)/HQ(Hydroquinone) system by Barrett method and Integral method with dynamic runs of differential scanning calorimetry(DSC). Kinetic parameters such as activation energy and pre-exponential factor were obtained and reaction order was estimated roughly supposing that present system was adjusted to nth order reaction. The MN(Malononitrile) was introduced as a chain extender and HQ(Hydroquinone) as a reactive accelerator or catalyst.

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OMA testing by SLDV for FEM Updating

  • Milla, Brian-Mac;Mehdi Batel;Eddy Dascott;Ben Verbeeck
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2003.11a
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    • pp.840-840
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    • 2003
  • Operational Modal Analysis (OMA) is a technique for identification of modal parameters by measurement of only the system's response. On many lightweight structures, such as load-speaker cones and disk drive read/write heads, is impossible or impractical to measure the input forces. Another characteristic of lightweight structure is their sensitivity to mass loading from sensors. The Scanning Laser Doppler Vibrometry(SLDV) allows response measurements to be taken without mass loading. One disadvantage of OMA testing compared to tradition input output modal testing is the OMA mode shapes are un-scaled. This means that the mode shape obtained from an OMA test can not used for analytical structural modification studies. However, the un-scaled mode shapes from an OMA test can be used to update a Finite Element Model (FEM). The updated FEM can then be used to analytically predict the effect of structural modifications. This paper will present the results of an OMA test performed on a simple plate and motor in operating conditions. The un-scaled mode shapes from this test will be used to update a FEM model of the system. The updated FEM model will be then be used to predict the effect of attaching a mass to the plate. The shapes predicted by the FEM for the modified system will be compared to a second OMA test on the modified system

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A Study on Software algorithm for Processing n-key roll-over at Matrix Keyboard (매트릭스 구성 키보드의 n-키 롤-오버 처리를 위한 소프트웨어 알고리즘에 관한 연구)

  • Jun, Ho-Ik;Lee, Hyun-Chang
    • Journal of Software Assessment and Valuation
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    • v.16 no.1
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    • pp.89-94
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    • 2020
  • In this paper, we propose a software algorithm that can configure n-key roll-over that detects all keys without limitation on the number of pressed keys in the dynamic scanning detection of a keyboard composed of a matrix. The proposed algorithm uses the timer interrupt of the microcontroller for computer keyboard control, so that a constant and accurate detection interval can be obtained, and an accurate debounce time can be provided. In order to confirm the effectiveness of the proposed algorithm, a microcontroller was connected to a toy keyboard constructed in the form of a clavier and experiments were conducted. As a result of the experiment, it was confirmed that detection of all keys was performed accurately regardless of the number of keys pressed.

Analysis of cure behavior of low temperature curing liquid silicone rubber (LSR) for multi-material injection molding (이중사출 성형을 위한 저온 경화 액상실리콘고무 (LSR)의 경화 거동 분석)

  • Hyeong-min Yoo
    • Design & Manufacturing
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    • v.17 no.1
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    • pp.1-5
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    • 2023
  • In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

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Study on the thermal Property and Aging Prediction for Pressable Plastic Bonded Explosives through ARC(Heat-Wait-Search method) & isothermal conditions (ARC(Heat-Wait-Search method)와 isothermal 조건을 이용한 압축형 복합화약의 열적 특성 및 노화 예측 연구)

  • Lee, Sojung;Kim, Jinseuk;Kim, Seunghee;Kwon, Kuktae;Chu, Chorong;Jeon, Yeongjin
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2017.05a
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    • pp.172-178
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    • 2017
  • Thermal property is one of the important characteristic in the field of energetic materials. As the energy material is released during decomposition, DSC(Differential Scanning Calorimetry) is frequently used for the thermal analysis. In case of the dynamic DSC measurements, thermal dynamic change like melting is prevented from the thermal property measurements. And due to the predicting kg scale, the conditions of the heat exchange with the environment significantly is changed. In this study, As the method to resolve the problem, we predict the thermal aging property using the AKTS thermokinetic program from DSC measurements which performed isothermal method. Predicting the thermal aging properties from ARC(Accelerating Rate Calorimetry) measurement, we compare two results.

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Crystallization and Molecular Relaxation of Poly(Ethylene Terephthalate) Annealed in Supercritical Carbon Dioxide

  • Jung, Yong-Chae;Cho, Jae-Whan
    • Fibers and Polymers
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    • v.6 no.4
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    • pp.284-288
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    • 2005
  • Poly(ethylene terephthalate) was annealed at different temperature and pressure of supercritical carbon dioxide $(CO_2)$ using samples quenched from the melt. Crystallization and molecular relaxation behavior due to $CO_2-annealing$ of samples were investigated using differential scanning calorimetric and dynamic mechanical measurements. The glass transition and crystallization temperatures significantly decreased with increasing temperature and pressure of $CO_2$. The dynamic mechanical measurement of samples annealed at $150^{\circ}C$ in supercritical $CO_2$ showed three relaxation peaks, corresponding to existence of different amorphous regimes such as rigid, intermediate, and mobile domains. As a result, the mobile chains were likely to facilitate crystallization in supercritical state. It also led to the decreased modulus of $CO_2-annealed$ samples with increasing pressure.

Cure and Heat Transfer Analysis in LED Silicone Lens using a Dynamic Cure Kinetics Method (승온 반응속도식을 이용한 LED용 실리콘 렌즈의 경화 및 열전달해석)

  • Song, M.J.;Kim, K.H.;Hong, S.K.;Park, J.Y.;Lee, J.W.;Yoon, G. S.
    • Transactions of Materials Processing
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    • v.24 no.2
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    • pp.101-106
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    • 2015
  • Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

Structure -Properties Relations of Polypropylene/ Liquid Crystalline Polymer Blends

  • Sahoo, N.G.;Das, C.K.;Jeong, Hye-Won;Ha, Chang-Sik
    • Macromolecular Research
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    • v.11 no.4
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    • pp.224-230
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    • 2003
  • The blends of polypropylene (PP) with glass filled thermotropic liquid crystalline polymer (LCP-g) have been prepared by melt mixing techniques at different blend ratios. The thermal, dynamic mechanical, crystalline and morphological characteristics of these blends were investigated. Higher percent crystallinity was observed for 10% level of LCP-g in the blend in comparison to that of other blend ratios. The thermal stability increased with LCP-g concentration in the blend with PP. The variation of storage modulus, stiffness and loss modulus as a function of blend ratios suggested the phase inversion at the 50% level of LCP-g in the blend. The scanning electron microscopy (SEM) photographs showed the creation of voids and destruction of the fiber structures during the dynamic mechanical measurements. Processing behavior of the blends depended on the fiber forming characteristics of LCP-g, which again varied with the molding temperatures.

Toughnening of Dielectric Material by Thermoplastic Polymer

  • Lee, Jung-Woo;Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.207-208
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    • 2007
  • Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

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