• Food Science and Preservation
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• v.10 no.4
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• pp.506-511
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• 2003

DSC was used to investigate the thermal mechanism of acorn and corn starch with or without saccharides on gelation and retrogradation. When the samples were starch-saccharide-water system (s-s-w), from measuring of gelation enthalpy and temperatures of initial gelation, peak and conclusion(T$\_$0/, T$\_$p/, T$\_$c/), those of s-s-w system were higher than those of stank-water system (s-w). The retrogradation enthalpy of acorn starch and corn starch was straightly increasing by DSC measurement as storage times. This increase meant slowly becoming recrygtallization of amylopectin. In retrogyadation process, the starch-saccharide-water system's enthalpy was also increased. After 7 days went, the value of the enthalpy was steady. Saccharides were retarding retrogrodation because of stopping the recrystallization of amylopectin. Especially in using fructose and maltose, the retrogradation effect of maltose was well. These elements took effect the number of juntion zone, one of equatorial OH and dynamic hydration number. As these three elements were increasing, a starch-Rel-system was stabilizing.

• Polymer(Korea)
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• v.26 no.3
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• pp.335-343
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• 2002

Blend resin (PET/PETG 70/30 blend) of poly (ethylene terephthalate) (PET) and poly (ethylene terephthalate glycol) (PETG) of weight percent 70/30 was prepared by a twin-screw extruder. Undrawn films of the blend and pure PETG were made by melt-press in hot press. Drawn films were made by capillary rheometer. Crystallinity, shrinkage, thermal, dynamic mechanical, and mechanical properties of these blends and PETG drawn films were investigated by wide angle X-ray diffractometer, dry oven, DSC thermal analyzer, and tensile tester. The crystallinity and density of these films increased with increasing draw ratio and draw rate but decreased with increasing draw temperature. The crystallinity and density of the blend films were higher than those of PETG films. The tensile strength and tensile modulus of these drawn alms increased with increasing draw ratio and draw rate but decreased with increasing draw temperature. The tensile strength and tensile modulus of blend films were higher than those of PETG films. Shrinkage of PETG md blend films decreased with draw ratio and draw rate. Shrinkage of undrawn blend film was 600% higher than that of pure PET film.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Polymer(Korea)
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• v.25 no.1
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• pp.15-24
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• 2001

In this study, the effects of different glycol molar ratios of unsaturated polyester(UPE) resins on the curing behaviors were investigated. The cross linking process was checked or monitored by differential scanning calorimetry(DSC) and by viscoelastic properties of rigid-body pendulum model. The knife-edge from which the pendulum is suspended, is immersed in a reaction mixture, and the change of the viscoelastic behavior brings on those of the period(T) and logarithmic decrement(${\Delta}$) of the damped free oscillations of the pendulum. The values of T and ${\Delta}$ obtained are related to the dynamic modulus(E') and modulus loss(E'). The information on the viscoelastic behavior of unsaturated polyester(UPE) resins during the curing process are shown to illustrate the usefulness of the techniques. As the content of NPG in a propylene glycol(PG)/NPG glycol mixture increased, both the cycle time during cure and the change of damping during cure of UPE resin decreased.

• Polymer(Korea)
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• v.24 no.1
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• pp.105-112
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• 2000

Using a commercial epoxy/carbon fiber composite prepreg (DMS 2224) as a model system, the cure kinetics of vitrifying thermoset system were analyzed by isothermal and dynamic-heating experiments. Focusing on the processing condition of high performance composite systems, a phenomenological kinetic model was developed by using differential scanning calorimetry (DSC) and reaction kinetics theories. The model system exhibited a limited degree of cure as a function of isothermal temperature seemingly due to the diffusion-controlled reaction rates. The diffusion-controlled cure reaction was incorporated in the development of the kinetic model, and the model parameters were determined from isothermal experiments. The first order reaction was confirmed from the characteristic shape of isothermal cure thermograms, and the activation energy wes 78.43 kJ/mol. Finally, the proposed model was used to predict a complex autoclave thermal condition, which was composed of several isothermal and dynamic-heating stages.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.797-801
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• 1998

The cure kinetics for diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA) system with or without lOphr of phenyl glycidyl ether(PGE)-acetamide(AcAm) was studied by autocatalytic cure expression. On the dynamic DSC curves, the exothermic peak temperature and the onset temperature of reaction decreased with the addition of PGE-AcAm. Regardless of the addition of PGE-AcAm, the shape of the conversion curve showed sigmoid, and this meant that DGEBA/MDA and DGEBA/MDA/PGE-AcAm systems followed autocatalytic cure reaction. When PGE-AcAm was added to DGEBA/MDA system, the cure rate increased about 1.2~1.4 times due to the catalytic role of hydroxyl groups in PGE-AcAm.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.190-193
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• 2004

Two different diene monomers [dicyclopentadiene (DCPD) and 5-ethylidene-2-norbomene (ENB)] as self­healing agent for polymeric composites were microencapsuled by in-situ polymerization of urea and formaldehyde. The healing agents were investigated by differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). Exothermic reaction and glass transition temperature from DSC and storage modulus (G') and tan $\delta$ from DMA curves were analyzed for the samples cured for 5 min and 24 h in the presence of different amounts of catalyst. Micorcapsules were successfully formed for both diene monomers. Microcapsules containing the healing agent were manufactured and its thermal properties were characterized by thermo gravimetric analysis (TGA). Optical microscope (OM) and particle size analyzer (PSA) were employed to observe morphology and size distribution of microcapsules, respectively. Comparison of the two self-healing agents and their microcapsules with the two was made in this study.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1988-1992
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• 2011

Polypropylene (PP)-SEBS/silicate composites with PP content of 35, 40, and 45wt% were fabricated by melt compounding at $200^{\circ}C$, using lab scale Brabender mixer. The content of silicate was fixed at 5wt%. The thermal properties of the PP-SEBS/silicate composites were investigated by differential scanning calorimetry (DSC) and thermogravimetric analyzer (TGA). The melting temperature of PP-SEBS compound decreased up to $141^{\circ}C$ with SEBS content. TGA result indicates an increase in degradation temperature when the silicate was added in the PP-SEBS compound. The rheological properties of the compounds were measured by dynamic Rheometer. PP-SEBS/silicate composite indicates higher shear thinning and elastic property than PP-SEBS compound. Van Gurp-Palmen analysis was applied in order to certify an increase in elasticity.

• Polymer(Korea)
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• v.25 no.4
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• pp.558-567
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• 2001

The syntheses of thermal latent catalysts have been carried out by modifying the substituent of pyrazinium salts. The thermal latent properties and cure behaviors of difunctional epoxy resin (diglycidylether of bisphenol-A, DGEBA) with 1 wt% of catalyst as an initiator were investigated by dynamic DSC method. As a result, the synthesized catalysts showed the good latent thermal properties in epoxy system. With increasing the basicity of substituted catalyst, the cure temperature and activation energy of epoxy system were increased, whereas the activity was decreased. This was probably due to the fact that the activity and cure behavior were controlled by ring strain and basicity of substituent. Consequently, the catalyst activity modified by methyl group as an electron donor was decreased in increasing of basicity in an initiation step of epoxy cure system. This is due to a decreasing of stabilities of both leaving group of pyrazinium salts and benzyl cation. However, the catalyst activity modified by cyano group as an electron acceptor was increased in increasing the stability of benzyl cation resulting from organic effects and resonance.